表面安裝封裝 的英文怎麼說

中文拼音 [biǎomiànānzhuāngfēngzhuāng]
表面安裝封裝 英文
smsurface mount package
  • 表 : Ⅰ名詞1 （外面;外表） outside; surface; external 2 （中表親戚） the relationship between the child...
  • 面 : Ⅰ名詞1 （頭的前部; 臉） face 2 （物體的表面） surface; top 3 （外露的一層或正面） outside; the ri...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 表面 : surface; superficies; boundary; face; rind; sheet; skin; outside; appearance
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. Mechanical standardization of semiconductor devices - part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages

    半導體器件的機械標準化.第6部分:表面安裝半導體器件封裝輪廓圖繪制的一般規則
  2. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制一般規則.玻璃密封陶瓷方型扁平封裝設計指南
  3. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:半導體器件包裝用表面安裝略圖制備的一般規則.玻璃密封的陶瓷四方塊的設計指南
  4. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:表面安裝半導體器件封裝外形圖繪制的一般規則.玻璃密封的陶瓷四邊形扁平組件的設計指南
  5. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch land grid array ; rectangular type

    半導體器件的機械標準化.第6 - 12部分:表面安裝半導體器件封裝外形圖繪制的一般規則.小節距柵極矩陣列的設計指南
  6. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for gull - wing lead terminals

    半導體器件的機械標準化.表面安裝的半導體器件封裝外形圖繪制的一般規則.海鷗翼式鉛端子的設計指南
  7. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitchball grid array

    半導體器件機械標準化.表面安裝半導體器件封裝外形圖繪制的一般規則.小螺距球柵陣列的設計指南
  8. Flga. mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch land grid array - rectangular type

    半導體裝置的機械標準化.表面安裝的半導體器件封裝圖形圖繪制的一般規則.細微間距柵級陣列
  9. Mechanical standardization of semiconductor devices - part 6 - 3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; measuring methods for package dimensions of quad flat packs

    半導體器件的機械標準化.第6 - 3部分:表面安裝半導體器件封裝外形圖繪制的一般規則.四面扁平部件封裝尺寸的測量方法
  10. Flag. mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array - proposed amendment on terminology

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制的一般規則.小爆距紋間表面網格陣列
  11. 8 mm through 200 mm embossed carrier taping and 8 mm 12 mm punched carrier taping of surface mount components for automatic handling

    自動裝配用表面安裝元件的8mm至200mm壓紋載體帶式封裝以及8mm和12mm穿孔載體帶式封裝
  12. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for 1, 50 mm, 1, 27 mm and 1, 00 mm pitch ball and column terminal packages

    半導體裝置的機械標準化.表面安裝的半導體裝置封裝外形圖繪制的一般規則. 1 . 5mm 1 . 27mm和1 . 00mm樹脂球和引線端子封裝的設計指南
  13. Mechanical standardization of semiconductor devices - part 6 - 2 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for 1, 50 mm, 1, 27 mm and 1, 00 mm pitch ball and column terminal packages

    半導體器件的機械標準化.第6 - 2部分:繪製表面安裝半導體器件封裝外形圖的一般規則. 1 . 5mm 1 . 27mm和1 . 00mm樹脂球和引線端子封裝的設計指南
  14. Modular component interfaces for surface - mount fluid distribution components - part 1 : elastomeric seals

    表面安裝流體分配元件用模塊化元件介面.第1部分:彈性密封件
  15. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制的一般規則
  16. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - dimensions of p - vson

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制的一般規則. p - vson的尺寸
  17. Mechanical standardization of semiconductor devices - part 6 - 10 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - dimensions of p - vson

    半導體器件的機械標準化.第6部分:表面安裝半導體器件封裝外形圖繪制的一般規則. p - vson的尺寸
  18. Mechanical standardization of semiconductor devices - part 6 - 10 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; dimensions of p - vson

    半導體器件的機械標準化.第6 - 10部分:表面安裝半導體器件封裝外形圖繪制的一般規則. p - vson的尺寸
  19. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array

    半導體器件的機械標準化.繪製表面安裝半導體器件封裝外形圖的一般規則.焊球網格陣列封裝尺寸的測量方法
  20. Bga mechanical standardization of semiconductor devices - part 6 - 4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array

    半導體裝置的機械標準化.第6 - 4部分:表面安裝半導體裝置封裝外形圖繪制的一般規則.球狀網格陣列
分享友人
分享到 Line

分享到臉書