表面安裝部件 的英文怎麼說

中文拼音 [biǎomiànānzhuāngjiàn]
表面安裝部件 英文
surface mounted assembly
  • : Ⅰ名詞1 (外面;外表) outside; surface; external 2 (中表親戚) the relationship between the child...
  • : Ⅰ名詞1 (頭的前部; 臉) face 2 (物體的表面) surface; top 3 (外露的一層或正面) outside; the ri...
  • : Ⅰ名詞1 (服裝) dress; outfit; attire; clothing 2 (演員的化裝品) stage makeup and costume Ⅱ動詞...
  • : Ⅰ名詞1 (部分; 部位) part; section; division; region 2 (部門; 機關或組織單位的名稱) unit; mini...
  • : Ⅰ量詞(用於個體事物) piece; article; item Ⅱ名詞1. (指可以一一計算的事物) 2. (文件) letter; correspondence; paper; document
  • 表面 : surface; superficies; boundary; face; rind; sheet; skin; outside; appearance
  • 部件 : component; unit; parts; assembly; subsystem; secundina (pl. secundinae)
  1. Mechanical standardization of semiconductor devices - part 6 - 1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - design guide for gull - wing lead terminals

    半導體器的機械標準化.第6 - 1分:半導體器略圖制備的一般規則.鷗型翼引線終端的設計指南
  2. Surface mounting technology part 2 : transportation and storage conditions of surface mounting devices - application guide

    技術第2分:元器的運輸和貯存條-應用指南
  3. Surface mounted piezoelectric devices for frequency control and selection - standard outlines and terminal lead connections - part 4 : hybrid enclosure outlines

    頻率控制和選擇用的壓電器.標準外形和端頭連接器.第4分:混合外殼輪廓圖
  4. Mechanical standardization of semiconductor devices - part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages

    半導體器的機械標準化.第6分:半導體器輪廓圖繪制的一般規則
  5. Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch ball grid array

    半導體器的機械標準化.第6 - 5分:半導體器外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南
  6. Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array

    半導體器的機械標準化.第6 - 6分:半導體器略圖制備的一般規則.小螺距刃片柵格排列的設計指南
  7. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器的機械標準化.第6 - 8分:半導體器略圖制備的一般規則.玻璃密封的陶瓷四方塊的設計指南
  8. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for glass sealed ceramic quad flatpack

    半導體器的機械標準化.第6 - 8分:半導體器外形圖繪制的一般規則.玻璃密封的陶瓷四邊形扁平組的設計指南
  9. Printed board assemblies - part 1 : generic specification - requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

    印刷電路板組.第1分:一般規范.使用和相關配技術的焊接電氣組和電子組的要求
  10. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch land grid array ; rectangular type

    半導體器的機械標準化.第6 - 12分:半導體器外形圖繪制的一般規則.小節距柵極矩陣列的設計指南
  11. Semiconductor devices - mechanical and climatic test methods - part 30 : preconditioning of non - hermetic surface mount devices prior to reliability testing

    半導體器.機械和氣候試驗方法.第30分:可靠性試驗之前不氣密的的預調試
  12. Packaging of components for automatic handling - part 6 : bulk case packaging for surface mounting components

    自動化處理用組的包.第6分:的散箱包
  13. Smds surface mounting technology - standard method for the specification of surface mounting components

    技術.第1分:
  14. Smds surface mounting tehcnology - part 1 : standard method for the specification of surface mounting components

    技術.第1分:表面安裝部件
  15. Smds surface mounting technology - part 1 : standard method for the specification for surface mounting components

    技術.第1分:
  16. Printed wiring boards - guide for the design and use of printed wiring boards : surface mounted devices

    印製電路板.第23分:設計和使用導則:規范
  17. Workmanship requirements for soldered electronic assemblies - part 2 : surface - mount assemblies

    釬焊電子組的工藝要求.第2分:
  18. Workmanship requirements for soldered electronic assemblies - part 2 : surface - mounted assemblies

    釬焊電子組的工藝要求.第2分:
  19. Workmanship requirements for soldered electronic assemblies - part 2 : surface - mount assemblies iec 61192 - 2 : 2003 ; german version en 61192 - 2 : 2003

    釬焊電子組的工藝要求.第2分:
  20. Packaging of components for automatic handling - part 6 : bulk case packaging for surface mounting components iec 60286 - 6 : 2004 ; german version en 60286 - 6 : 2004

    自動配用元的包.第6分:的散
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