覆銅層壓板 的英文怎麼說

中文拼音 [fùtóngcéngyābǎn]
覆銅層壓板 英文
copper-clad laminate
  • 覆 : 動詞1. [書面語] （蓋住） cover 2. [書面語] （底朝上翻過來; 歪倒） overturn; upset 3. 同 「復」 （Ⅱ1. 2. ）
  • 銅 : 名詞（金屬元素） copper （cu）
  • 層 : i 量詞1 （用於重疊、積累的東西 如樓層、階層、地層） storey; tier; stratum 2 （用於可以分項分步的...
  • 壓 : 壓構詞成分。
  • 板 : Ⅰ名詞1 （片狀硬物體） board; plank; plate 2 （專指店鋪的門板） shutter 3 [音樂] （打拍子的樂器） ...
  1. . 1 base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test ; amendment 1

    印製電路用基材.第2部分:規范.第18號規范:規定易燃性的雙對馬來酰壓胺三氮雜苯改良型環氧玻璃纖維編織覆銅層壓板
  2. Polyimide woven glass fabric copper - clad laminated sheet of defined flammability for printed circuits

    印製電路用限定燃燒性的覆銅箔聚酰亞胺玻璃布層壓板
  3. Thin epoxide woven glass fabric copper clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

    限定燃燒性的薄覆銅箔環氧玻璃布層壓板
  4. Thin polyimide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    多層印製電路用限定燃燒性的薄覆銅箔聚酰亞胺玻璃布層壓板
  5. Base materials for printed circuits ; part 2 : specifications ; specification 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality ; amendment 3

    印製電路用基材.第2部分:規范.第2號規范:酚醛纖維素紙覆銅層壓板，經濟質量.修改件3
  6. Base materials for printed circuits - part 2 : specifications - specification no. 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality ; amendment 5

    印製電路用基底材料.第2部分:規范.第2號規范:經濟質量的酚醛纖維素紙覆銅層壓板.修改件5
  7. Metal base copper - clad laminate

    金屬基覆銅層壓板
  8. , specifications - phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test, economic quality

    規范.限定燃燒特性的酚醛多孔覆銅層壓板
  9. Specification for metal - clad base materials for printed circuits - silicone woven glass fabric copper - clad laminated sheet si - gc - cu - 13

    印製電路板用覆箔板.第13部分:硅酮玻璃布覆銅層壓板si - gc - cu - 13
  10. Base materials for printed circuits. part 2 : specifications. specification no. 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality

    印製電路用基材.第2部分:規范.第2號規范:經濟型酚醛纖維素紙覆銅層壓板
  11. Base materials for printed circuits - part 2 : specification - specification n o 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality

    印製電路用基材.第2部分:規范.第2號規范:經濟型酚醛纖維素紙覆銅層壓板
  12. Base materials for printed circuits. part 2 : specifications. specification no. 1 : phenolic cellulose paper copper - clad laminated sheet, high electrical quality

    印製電路用基材.第2部分:規范.第1號規范:高電氣質量的酚醛纖維素紙覆銅層壓板
  13. Base materials for printed circuits. part 2 : specifications. specification no 4 : epoxide woven glass fabric copper - clad laminated sheet, general purpose grade

    印製電路基材.第2部分:規范.第4號規范:普通級環氧化合物編織的玻璃纖維覆銅層壓板
  14. Base materials for printed circuits ; part 2 : specifications ; specification 1 : phenolic cellulose paper copper - clad laminated sheet, high electrical quality ; amendment 2

    印製電路用基材.第2部分:規范.第1號規范:高電氣質量的酚醛纖維素紙覆銅層壓板.修改件2
  15. Materials for printed boards and other interconnecting structures - part 2 - 19 : reinforced base materials, clad and unclad - epoxide cross - plied linear fibreglass - reinforced laminated sheets of defined flammability vertical burning test, copper clad

    印製板和其它互連結構用材料.第2 - 19部分:包覆和不包覆增強基材.規定易燃性的環氧交叉簾布層線性纖維玻璃增強包銅層壓板
  16. Materials for printed boards and other interconnecting structures - part 2 - 4 : reinforced base materials clad and unclad - polyester non - woven woven fibreglass laminated sheet of defined flammability vertical burning test, copper - clad

    印刷電路板及其它互連結構用材料.第2 - 4部分:包覆和不包覆增強基材.規定易燃性的聚酯非機織機織玻璃纖維包銅層壓板
  17. Base materials for printed circuits ; part 2 : specifications ; specification no. 9 : epoxide cellulose paper core, epoxide glass cloth surfaces copper - clad laminated sheet of defined flammability vertical burning test

    印製電路用基材.第2部分:規范.第9號規范:規定易燃性的環氧化合物纖維素紙芯的環氧化合物玻璃布表面覆銅層壓板
  18. Base materials for printed circuits ; part 2 : specifications ; specification no. 7 : phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test

    印製電路用基材.第2部分:規范.第7號規范:規定易燃性的酚醛纖維素紙覆銅層壓板
  19. Base materials for printed circuits. part 2 : specifications. specification no. 3 : epoxide cellulose paper copper - clad laminated sheet of defined flammability vertical burning test

    印製電路用基材.第2部分:規范.第3號規范:規定易燃性的環氧化合物纖維素紙覆銅層壓板
  20. Base materials for printed circuits ; part 2 : specifications ; specification 16 : polyimide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印製電路用基材.第2部分.規范.第16號規范:規定易燃性的聚酰亞胺玻璃纖維覆銅層壓板
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