金屬化層 的英文怎麼說
中文拼音 [jīnzhǔhuàcéng]
金屬化層
英文
metalization layer-
Standard test method for gross defects and mechanical damage in metallic coatings by polysulfide immersion
用聚硫化物浸入法測試金屬塗層中總疵點和機械損壞的標準試驗方法Metallic coatings - porosity tests - porosity in gold or palladium coatings by sulfurous acid sulfur dioxide vapour
金屬鍍層.孔隙試驗.通過亞硫酸二氧化硫蒸氣的金和鈀鍍層的孔隙度Metallic coatings - porosity tests - porosity in gold or palladium coatings by sulfurous acid sulfur dioxide vapour iso 15721 : 2001 ; german version en iso 15721 : 2001
金屬塗層.孔隙率試驗.用亞硫酸和二氧化硫蒸氣測定金. metallic coatings - autocatalytic electroless nickel - phosphorus alloy coatings - specification and test methods
金屬覆層.自催化Corr corrosion - resistant testing method of the metal deposits and conversion coatings for the light industrial products. corrodkote test
輕工產品金屬鍍層和化學處理層的耐腐蝕試驗方法.腐蝕膏試驗Anti - color change corrosion testing method of the metal deposits and conversion coatings of the light industrial products. hydrogen sulfide test
輕工產品金屬鍍層和化學處理層的抗變色腐蝕試驗方法.硫化氫試驗法( 1 ) first, metallizing abs plastics surface by chemical coarsing, metal ion absorption, metal ion reducing and chemical copper - plating. then, the copper - coating was thickened by electroplating in order to improve adhesion between following - coating and plastics matrix, and nickel was preplating. finally, ni - sic composite was plated
( 1 )通過反復實驗,確定工藝流程:首先通過粗化、敏化、活化和化學鍍銅,使塑料表面金屬化,再電鍍銅加厚銅鍍層,增強后續鍍層與塑料基體的結合力,然後預鍍鎳,最後電鍍ni ? sic復合鍍層。Fixed capacitors for use in electronic equipment - sectional specification : fixed metallized polyphenylene sulfide film dielectric surface mount d. c. capacitors
電氣設備用固定電容器.分規范:固定金屬化聚苯撐硫化膜鍍層表面固定直流電容器Fixed capacitors for use in electronic equipment - blank detail specification : fixed metallized polyphenylene sulfide film dielectric surface mount d. c. capacitors - assessment level ez
電氣設備用固定電容器.空白詳細規范:固定金屬化聚苯撐硫化膜鍍層表面固定直流電容器.評定級ezImmediately below the oxide film and often mingled with it in an intricate way is the true surface layer of the metal.
氧化膜的下面就是真正的金屬表層,氧化膜常常與金屬表面層以復雜的形式混合在一起。Aerospace series. adhesion test for metallic coatings by shot peening
航空航天系列.經過噴丸硬化的金屬塗層的粘結試驗Gold and silver gilding techniques in the western han dynasty of china
兩件西漢時期鎏金與鎏銀青銅器鍍層中的金屬化合物Testing method of the chemical protective coatings of the ferrous metal for the light industrial products. dipping spot test
輕工產品黑色金屬化學保護層的測試方法.浸漬點滴法For the first time, we reported the barrier height of au / algan is 1. 08ev by analysis on various i - v curves under corresponding temperatures. 3 ^ we reported oriented polycrystalline gan on silica substrates using a new method named ga nitridation
3 、採用金屬鎵層氮化技術,利用我們自行改造的熱蒸發設備和氨氣氮化設備,在無定形石英襯底上生長出具有擇優取向的多晶gan ,取得了一些階段性的成果。The emphasis is about the metal line reliability, contact reliability, gate oxide integrity, and hot carrier injection in test. based on the test datum, the reliability of 1. 0 m process on single failure mechanisms is evaluated, and all the test structures are explained
測試內容上著重介紹了金屬化完整性測試、氧化層完整性測試、連接完整性測試和熱載流子注入測試,根據測試數據,對1 . 0 m工藝線單一失效機理的可靠性進行了評價,對不同測試結構的作用進行了說明。Aerospace series. lubricating dry fluorocarbonated coating with binding material and fillers, of a minimum thickness of 5 micrometers on metallic substrate. quality of coated parts
航空航天系列.金屬底層最小厚度5微米的帶粘接材料和填料的干潤滑碳氟化合物覆層.覆層零件質量Surface examination method of the metal deposits and conversion coatings for the light industrial products
輕工產品金屬鍍層和化學處理層的外觀質量測試方法Thin sin layers and nitride - based multiquantum well ( mqw ) light emitting diode ( led ) structures with conventional single gan buffer and gan / sin double buffers were grown on sapphire substrates by metalorganic chemical vapor deposition ( mocvd )
摘要以有機金屬化學氣象沉積在藍寶石基板上成長由單一氮化鎵成核層與氮化鎵/氮化矽雙緩沖層所形成的兩種不同氮基礎的多層量子井發光二極體結構。The improved neural network is applied in study of the relationship between reaction parameters of electroless plating nickel in the process of the metallization of aluminum nitride and the adhesion strength between the metal layer and the substrate
為得到較大的氮化鋁金屬化層粘附力,運用基於穩健估計的神經網路研究氮化鋁金屬化中化學鍍鎳的反應參數與金屬層粘附力的關系。The anti - burnout character was improved obviously after the metallization be made more thick. the analysis on the gaas mmic metallization which burnout has been occured proved that the main reason was that the metallization is too thin to endure the mechanical stress, so the collapse will trigger the circuits burnout
對gaasmmic互連出現的燒毀現象的顯微分析表明,主要是空氣橋金屬化層過薄,尤其是搭接處易出現塌陷,金屬層加厚后,互連線的燒毀能力有明顯改善。分享友人