釬焊合金 的英文怎麼說

中文拼音 [hànhànjīn]
釬焊合金 英文
brazing alloy
  • : 名詞(釬子) drill rod [steel]; borer
  • : 動詞(用熔化的金屬修補金屬器物或使金屬工件連接起來) weld; solder
  • : 合量詞(容量單位) ge, a unit of dry measure for grain (=1 decilitre)
  • : Ⅰ名詞1 (金屬) metals 2 (錢) money 3 (古時金屬制的打擊樂器) ancient metal percussion instrum...
  1. Aluminium alloy foil for brazing type heat exchanger

    式熱交換器用鋁
  2. Experimental investigation on ni - cr brazed monolayer diamond abrasives

    單層剛石磨料的試驗研究
  3. The strength and wear resistance of diamond drill bits for petroleum exploitation will be increased considerably when cast tungsten carbide is applied and adheres to the substrate firmly with cast tungsten carbide of 80 - 200mesh as the skelton and copper alloy as the soldering material in a process of non - pressure immersion

    石油鉆探行業用的剛石鉆頭,用粒度為80 ? 200目的鑄造碳化鎢粉作骨架,採用無壓浸漬工藝,以銅料,將鑄造碳化鎢與基體牢固結,強度、耐磨性大大提高。
  4. Soft solder alloys - chemical compositions and forms

    釬焊合金.化學成份和形狀
  5. Cast copper alloy solder joint drainage fittings - dwv

    Dwv鑄銅連接排水配件
  6. Cast copper alloy solder joint drainage fittings : dwv

    Dwv類鑄銅連接排水管件
  7. Cast copper alloy solder joint pressure fittings

    鑄銅連接壓力管件
  8. Wrought copper and copper alloy solder joint pressure fittings

    鍛銅和銅壓力配件
  9. Wrought copper and copper alloy solder - joint pressure fittings

    鍛銅和銅接壓力連接件
  10. Cast copper alloy solder joint drainage fittings - dwv ; errata

    鑄銅連接排水管件. dwv .勘誤
  11. Wrought copper and wrought copper alloy solder joint drainage fittings - dwv

    Dwv型鍛銅和鍛銅排水配件
  12. Requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications

    電子用電子級及助熔和非助熔固體料的要求
  13. Attachment materials for electronic assembly - part 1 - 3 : requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications

    電子組件用連接材料.第1 - 3部分:電子接用電子級釬焊合金及有劑和無劑的固體料的要求
  14. The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy, the composition and properties of mother materials and their clean level on the surface, the surface tension of liquid state solders, the temperature and atmosphere in soldering and the activity of flux, the chemical composition and structure and properties of the surface film of melting solders, and so on

    分析表明:相關的影響因素主要包括的組成、純度和化學均勻性;母材的成分、性質和表面的潔凈度;液態料的表面張力;溫度、氣氛、助劑的活性;液態料表面膜的組成、結構和性能等。
  15. This article introduced the development and ti - based brazing material used for titanium alloys, and analyzed the relationship between metallurgical structure and mechanical property of welding joint, mechanical behavior under high temperature 、 corrosion resisting property and fatigue capability of the joint were also represented

    本文介紹了鈦用的鈦基料的發展現狀,重點評價了鈦基后組織與力學性能的關系,以及鈦基料的高溫力學性能、耐蝕性以及疲勞性能等。
  16. Aerospace series - gold base alloy au - b40001 - filler metal for brazing - wire

    航空航天系列.au - b40001 .用填充屬.
  17. Aerospace series - gold base alloy au - b4000 - filler metal for brazing - rolled foil

    航空航天系列.au - b4000 .硬用填充屬.軋制箔
  18. Aerospace series - gold base alloy au - b40001 - filler metal for brazing - rolled foil

    航空航天系列.au - b40001 .用填充屬.軋制箔
  19. Testing of solderability for soft soldering ; vertical dipping test for specimens of copper alloys ; testing ; assessment

    可軟性的檢驗.銅試樣的垂直浸漬試驗.檢
  20. Aluminum brazing vacuum furnace

    真空爐sabf系列
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