銅層 的英文怎麼說
中文拼音 [tóngcéng]
銅層
英文
copper layer-
In the early days copper was normally followed by a relatively thin bright nickel layer with conventional chromium topcoat
早期，塗覆銅層之後，再塗一薄層光亮鎳，然後傳統的鉻層位於最外層。Base materials for printed circuits - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印製電路用基體材料.用於多層印製板構成的限定可燃性的薄雙馬來酰亞胺三嗪改性的環氧織物玻璃纖維包銅層壓板Base materials for printed circuits. part 2 : specifications. specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印刷電路用基材.第2部分:規范. 18號規范:規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板Base materials for printed circuits. part 2 : specifications - specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印刷電路用基材.第2部分:規范. 18號規范.規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板. 1 base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test ; amendment 1
印製電路用基材.第2部分:規范.第18號規范:規定易燃性的雙對馬來酰壓胺三氮雜苯改良型環氧玻璃纖維編織覆銅層壓板The metastable austenitic phase of s s fiber at the interface of the fiber / cu composite would turn back to equilibrium with the interfacial energy and inter stain inducing, when the cu films were separated from s s fiber. so the magnetism value of the s s fiber declined. the information of grain - orientation at the interface of the fiber / cu composite can serve as a mechanism responsible for its declining coercivity, and a part of cu elements diffused into s s fibers
不銹鋼纖維銅復合體去除銅層后，原有的界面能及應力下降，使得原纖維界面處弱磁性的部分亞穩奧氏體，恢復到平衡態，它們對樣品s測試結果不再有貢獻；不銹鋼纖維銅復合體中，處于界面處的纖維晶粒具有很強的軸向取向排列，當晶粒取向性減弱，磁疇轉動的阻力增加，磁體的矯頑力上升。Base materials for printed circuits. part 2 : specifications. specification number 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality
印刷電路用基材.第2部分:規范. 2號規范:經濟質量的酚醛纖維素紙包銅層壓板Base materials for printed circuits ; part 2 : specifications ; specification 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality ; amendment 3
印製電路用基材.第2部分:規范.第2號規范:酚醛纖維素紙覆銅層壓板，經濟質量.修改件3Base materials for printed circuits - part 2 : specifications - specification no. 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality ; amendment 5
印製電路用基底材料.第2部分:規范.第2號規范:經濟質量的酚醛纖維素紙覆銅層壓板.修改件5Base materials for printed circuits. part 2 : specifications. specification number 14 : phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test, economic quality
印刷電路用基材.第2部分:規范. 14號規范:經濟質量的規定易燃性的酚醛纖維素紙包銅層壓板Base materials for printed circuits - part 2 : specification - specifications number 14 : phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test, economic quality
印刷電路用基材.第2部分:規范. 14號規范:經濟質量的規定易燃性的酚醛纖維素紙包銅層壓板Metal base copper - clad laminate
金屬基覆銅層壓板, specifications - phenolic cellulose paper copper - clad laminated sheet of defined flammability vertical burning test, economic quality
規范.限定燃燒特性的酚醛多孔覆銅層壓板Specification for metal - clad base materials for printed circuits - silicone woven glass fabric copper - clad laminated sheet si - gc - cu - 13
印製電路板用覆箔板.第13部分:硅酮玻璃布覆銅層壓板si - gc - cu - 13Base materials for printed circuits. part 2 : specifications. specification no. 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality
印製電路用基材.第2部分:規范.第2號規范:經濟型酚醛纖維素紙覆銅層壓板Base materials for printed circuits - part 2 : specification - specification n o 2 : phenolic cellulose paper copper - clad laminated sheet, economic quality
印製電路用基材.第2部分:規范.第2號規范:經濟型酚醛纖維素紙覆銅層壓板Base materials for printed circuits. part 2 : specifications. specification no. 1 : phenolic cellulose paper copper - clad laminated sheet, high electrical quality
印製電路用基材.第2部分:規范.第1號規范:高電氣質量的酚醛纖維素紙覆銅層壓板Base materials for printed circuits. part 2 : specifications. specification no 4 : epoxide woven glass fabric copper - clad laminated sheet, general purpose grade
印製電路基材.第2部分:規范.第4號規范:普通級環氧化合物編織的玻璃纖維覆銅層壓板Base materials for printed circuits ; part 2 : specifications ; specification 1 : phenolic cellulose paper copper - clad laminated sheet, high electrical quality ; amendment 2
印製電路用基材.第2部分:規范.第1號規范:高電氣質量的酚醛纖維素紙覆銅層壓板.修改件2High speed thick copper plating of cylinders
圓筒高速電鍍厚銅層分享友人