銅的沉積 的英文怎麼說
中文拼音 [tóngdechénjī]
銅的沉積
英文
copper deposition-
There are three genetic types of mineral deposits in the beiya ore district : cu - au polymetallic deposits related to alkaline porphyries, comprising porphyritic cu - au deposits and polymetallic skarn deposits related to quartz - albite porphyry and quartz - k - feldspar porphyry ; fe - au deposits related to gabbro or basalt magma, consisting of magmatic fe - au deposits and sedimentary polymetallic deposits formed in caves and lakes ; and palaeo - placers formed at the weathering surface, in lakes and in karsts
北衙金礦有3種成因不同的礦床:與堿性斑巖有關的銅金多金屬礦,包括與石英鈉長斑巖和石英正長斑巖有關的斑巖型銅金礦床和矽卡巖型多金屬礦床;與輝長玄武巖漿有關的鐵金礦床,包括熔漿型鐵金礦床和噴流沉積型多金屬礦床,後者又有洞穴和湖相沉積環境之分;及古砂礦,有古風化殼型砂礦、河湖相古砂礦和洞穴沉積古砂礦。< uk > the minerals are likely to be from the suite pyrite chalcopyrite, sphalerite, galena, fluorite and barite, and to be deposited at temperatures of between 50 and 250. < / uk >
這些礦物可能由黃鐵礦,黃銅礦,閃鋅礦,方鉛礦,螢石和重晶石組成,並且可能是在50 250之間的溫度下沉積出來的。Deposition mechanism of electroless plating tin in acid chloride solutions was analyzed theoretically, and three steps were summed up, including period of replacement reaction, coexistence periods of copper - tin codeposition and self - catalyzed deposition, and period of self - catalyzed deposition
從理論上系統地分析了酸性氯化物化學鍍錫的沉積機理,將其歸納為置換反應期、銅錫共沉積與自催化沉積共存期和自催化沉積期三個階段。The third ways of making stencil is electroform. hole forming by the way of nickel deposit onto the copper cathode
製作模板的第三種工藝是電鑄成型。在這個工藝中,鎳沉積在銅質的陰極心上以形成開孔。The known copper deposits in the distributive area of bikou group and the newly - discovered faziba medium - size copper deposits are all located in the favorable positions indicated by the optimal indicator elements for the eruptive - sedimentary copper deposits of this area
碧口群分佈區的已知具規模的銅礦床及新探明的伐子壩中型銅礦均位於本區火山噴發沉積型銅礦的最佳指示元素所指示的有利部位。The minerals are likely to be from the suite pyrite chalcopyrite, sphalerite, galena, fluorite and barite, and to be deposited at temperatures of between 50 and 250℃.
這些礦物可能由黃鐵礦,黃銅礦,閃鋅礦,方鉛礦,螢石和重晶石組成,並且可能是在50250之間的溫度下沉積出來的。Copper has been deposited on surface of the al mmcs as interlayer by magnetron sputtering, tlp bonding of al mmcs with these interlays, the joints shear strength of tlp bonding using deposited film was as much as the joint shear strength of tlp bonding using cu foil. removing the oxidation on the surface before deposition, copper was coated by magnetron sputtering as tlp bonding interlayer
待連接表面通過磁控濺射法沉積銅膜作為中間層進行瞬間液相連接,得到的接頭強度與銅箔中間層進行瞬間液相連接得到的接頭強度相當,而使用磁控濺射法去除待連接表面氧化膜后沉積銅膜作為中間層進行瞬間液相連接的接頭強度提高7 . 6左右。In this paper, pan based metal gradient composites films ( pmgcf ) were prepared by electrochemical reduction. the effect of polymer matrix on pmgcf and preparation and its forming mechanism of pmgcf were invested, they are as follows : lacrylonitrile - methyl - methacrylate copolymer, acryonitrile - itaconic acid copolymer, acrylonitrile - methyl methacry late - sodium allyl sulfonate terpolymer have been synthesized seperately in order to analyze the effects of the mma monomer unites and the hydrophilic unites of acryonitrile terpolymer on the process of copper deposition in polyacrylonitrile - based metal gradient composite film ( pmgcf ) as well as the flexibility of the film
其內容如下: 1通過合成的丙烯腈?甲基丙烯酸甲酯二元共聚物( p ( an - mma ) ) ,丙烯腈?亞甲基丁二酸二元共聚物( p ( an - ita ) ) ,丙烯腈-甲基丙烯酸甲酯?丙烯磺酸鈉三元共聚物( p ( an - mma - as ) )分別作為基體制備了聚合物基金屬梯度復合膜材料( pmgcf ) ,以分析加入的mma基團和親水性基團對pmgcf沉積層中金屬銅的梯度分佈形態和膜的柔韌性的影響。The great amount of stabilizing agent led to the non - uniform of the plating layer. the addition of the high polymer could decrease the size of silver particles and help to increase the dispersibility of powders
採用高銅鍍液,鍍覆表面金屬顆粒降至2 3urn ,形成一層緻密連續的銅銀共沉積的金屬膜層。Abstract : based on 1 200000 aeromagnetic survey data performed in 1998, and referred to materials of geolo - gic and geochemical prospecting of the working area, this paper discusses the relationship between the characte - ristics of magnetic field, magmatic rocks, fault structure and the distribution of mineral resources, and investigates the geologic metallogenic environments, and sets up the prospecting criteria for hydrothermal and volcanic - sedimentary copper, lead, zinc, gold, iron, manganese deposits, then makes the prognosis of the prospecting potential of the working area
文摘:本文以1998年1 20萬航空磁測資料為基礎,參考地質和化探資料,對工作區磁場特徵、巖漿巖、斷裂構造與礦產分佈的關系進行探討,研究地質成礦環境,建立尋找熱液型和火山-沉積型的銅、鉛、鋅、金、鐵、錳礦找礦標志,對本區找礦遠景進行了預測。Alkali basite, which came from upper mantle or lower crust, invaded through those structure, which not only bring cu et al mineralizing elements, but also the most important is that thermal energy. it cycled the formation water ( yinmin fonnation and luoxue formation ), and form alkali - rich, middle - high temperature and salinity fluid mixed with alkali - rich magmatic water. there were high rate of percolation and well voidage in the contact zone between yinmin purple stratum and yinmin rubblerocks, which is in favor of the transposition and mineralization of minerogenetic fluids
因此,總結東川稀礦山式銅礦成礦模式為沉積( fe 、 cu ) ?熱液疊加( cu )改造:晉寧-澄江期,小江深大斷裂發生走滑運動,在東川礦區造成右行旋扭及其派生構造,形成「 z 」字形落因破碎帶,同時來自深源(下地殼或上地幔)堿基性巖漿侵入,不僅帶來了大量cu等成礦物質,更重要的是提供了熱源,促使地層水(落雪組白雲巖和因民組紫色層)循環,與富堿( na和k )巖漿水混合,形成富堿中高溫高鹽度流體。Abstract : according to the composition, the thermal - water sedimentary rocks of yinmin formation in the dongchuang copper ore field can be divided into nine types, of which skarnoid, cupric magnetite carbonate, paracontemporaneous breccia formed in thermal water processing are confirmed and named in this study
文摘:東川銅礦田因民組熱水沉積巖根據主要成分可分為9大類,其中類夕卡巖、含銅磁鐵碳酸鹽巖、熱水膠結準同生角礫巖為本次研究確定和命名,其礦物組合、微量元素、稀土元素等地球化學特徵表明:它們是海底火山噴流沉積作用的產物。In 2005, 61 physical and chemical parameters were measured and analysed in sediments. these included particle size, electrochemical potential as highly anoxic sediment with negative potential is related to organic pollution, chemical oxygen demand which indicates organic pollutants, total sulphide inorganic constituents, source of the unpleasant - smelling gas hydrogen sulphide, 15 metals and metalloids aluminium, arsenic, barium, boron, cadmium, chromium, copper, iron, lead, manganese, mercury, nickel, silver, vanadium and zinc, and trace toxic organics pahs and pcbs - 16 compounds and 18 congeners respectively
2005年,沉積物監測包括分析61種物理及化學參數,其中有粒子大小電化學勢有機污染促使沉積物缺氧,而讓電化學勢呈負數值化學需氧量顯示有機污染程度總硫化物無機物,是造成難聞氣體硫化氫的主因15種金屬及準金屬鋁砷鋇硼鎘鉻銅鐵鉛錳汞鎳銀釩及鋅和痕量毒性有機物多環芳烴及多氯聯苯分別為16種復合物及18種同質物。Study on precise cold extrusion technology of 6061 al - alloy splines shell
電沉積法制備的超細晶薄銅板拉伸及表面層效應Copper electrodeposition in ulsi
超大規模集成電路中的電沉積銅The influence factors to electrochemical deposition and gradient distribution of pmgcf, such as the predrying extent of the swelling cathode film, the excessive power voltage of the cathode, the ph value of electrochemical reduction medium solutionn, the microstrucure of polymer matrix, were majorly invested in this thesis
本文著重討論了了溶脹陰極膜的預乾燥程度、陰極過電位、電解質溶液的ph值、聚合物基體的結構等因素對金屬銅在溶脹陰極膜中的沉積分佈以及結晶的形態的影響。3 the experiment showed that there is no copper deposition in the film using p ( an - mma ) as polymer matrix. but the copper deposition and gradient distributing appears in the film when using p ( an - ita ) and p ( an - mma - as ) as polymer matrix. the size and number of crystal increases as the concentration of ita in copolymer increase and the film is prone to be ruptured
3實驗顯示p ( an - mma )作為基體制備的pmgcf五金屬沉積,銅的沉積量為零; p ( an - mma - as ) , p ( an - ita )兩種共聚物為基體時均出現金屬銅的沉積,二者金屬沉積相均呈現一定程度的梯度分佈形態,但p ( an - ita )為基體時得到的晶體比較粗大,且隨其中ita的含量的增多得到粗糙晶體的數目增大,所制的pmgcf脆而硬,受外力沖擊時容易斷裂。It has been pointed out that, with the development of microelectronics, the electroplating of copper has been currently focused on, owing to its engineering significance
結合銅在微電子工業中的應用,綜述了硫酸鹽鍍銅中銅的電沉積機理、銅鍍層微結構、添加劑對銅電沉積過程的影響以及銅電沉積初期行為方面的研究進展。The analytic results of the effects on the micromorphological structure of the film by the electrochemical condition ' s showed that the carbon is apt to improve the boundary combination between the scfs and the surface of the cathode and the seperation of the films, and that the micromorphological structure of the mpgcfs is greatly affected by the dring and the power voltage, which remarkably affluence ion move in swelling cathode film, and that higher temperature and concentration of cu2 + in the medium solution are also advanagable to the deposition of cu in scfs. the plot of deformation behavior of mpgcfs showed that the maximum strench ratio decreases and the brittleness increases due to the existence of the metal phase, and that the strengh trend of the composite films is fistly up and down followed with the content of metal phase because of the change of the role of the metal phase from acting as the physical cross - linking to weakening the films due to destroying the whole structure of the polymer
另外它作為基體的另一個突出的優點是制備的溶脹復合膜( scf )中的溶劑與電解液中的溶劑相同都是水,克服了以前膜內外不同溶劑之間擴散的問題,結果使得電流最終趨於一種穩態,因此可以更好實現用電化學條件來控制mpgcf的形態結構;硬質石墨材料的多孔的結構和石墨本身的結構性能特點使得碳作為陰極材料時有利於溶漲復合膜( scf )與電極表面的結合以及膜的剝離,因此是作為陰極的理想材料;電化學條件中的乾燥程度和電壓能夠明顯的影響離子在膜內的遷移,從而對mpgcf的形態結構造成較大的影響;而提高反應溫度和增大電解液中銅離子的濃度也有利於銅在膜中的沉積生長。Significant research works have been focused on single metal, in particular copper deposition and its mechanism and kinetics, including electrochemical parameter and physical parameter measurements
研究了單金屬特別是銅的沉積、形成機理和動力學以及採用的研究方法和分析測試手段,包括對電化學參數和物理參數等研究。分享友人