集成電路 的英文怎麼說

中文拼音 [jíchéngdiànlù]
集成電路 英文
[電子學] integrated circuit （ic）; unicircuit; molectron; integrated semiconductor; monolithic circuit集成電路放大器 integrated amplifier; 集成電路晶體管 integrated circuit transistor; 集成電路塊 integrated circuit block
  • 集 : gatherassemblecollect
  • 成 : Ⅰ動詞1 （完成; 成功） accomplish; succeed 2 （成為; 變為） become; turn into 3 （成全） help comp...
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 集成 : integration集成晶體管 integrated transistor; 集成元件 integrated component
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. The combined toy as right request 3 stated, whose character is : the electronic components electrically or electromagnetically connected with the iron stick or the magnet stick can be resistor, capacitor, inductor, battery, switch, diode, audion, ic ( integrated circuit ), motor, led ( light - emitting diode ), infrared ray receiver, sound circuit and instrument

    如權利要求3所述的組合玩具，其特徵是：和鐵棒或磁鐵棒電連接的電子元器件是可以是電阻、電容、電感、電池、開關、二極體、三極體、集成電路、馬達、發光二極體、紅外線接受器、發聲電路、儀表。
  2. Bcd detail specification for electronic component. semiconductor integrated circuit. type ch2019 4 - line to 10 - line decoder with bcd - in

    電子元器件詳細規范.半導體集成電路ch2019型4線- 10線譯碼器
  3. In the 1960s the ic market was broadly on bipolar transistors.

    六十年代集成電路市場主要為雙極型晶體管。
  4. Computer - aided manufacturing ( cam ) refers to how to use computer technology effectively through direct or indirect combining computer and material resources manpower resources of one enterprise, in such aspect as plan, management, cantonment, operation, etc. when cam is used in integrated circuit ( ic ) manufacturing, we call it ic - cam

    計算機輔助製造（ cam ）是指通過直接或者間接把計算機與企業的物力和人力資源聯系起來，在生產的計劃、管理、控制和操作等方面有效地應用計算機技術。計算機輔助製造應用在集成電路生產製造上就稱之為ic - cam 。
  5. Study of the silicon carbide integrate circuits technique

    單片集成電路工藝技術
  6. Manufacturer of confectionery, certified to iso 9001, 2000 standards

    -批發世界知名廠商生產的dip和smd集成電路。
  7. Nowadays, more and more ic cores based on all kinds of crypto algorithm appear

    目前，基於各種密碼演算法的集成電路晶元已經出現。
  8. On the base of analyzing the development status and trend of the electromagnetic flowmeter technology, this article uses new mcu and ic to design the intelligent electromagnetic flowmeter that has a conversion instrument and a cumulation apparatus

    本文在分析國內外電磁流量計發展現狀和趨勢基礎上，採用新型微處理器和集成電路來開發集轉換器、積算儀於一體的智能電磁流量計。
  9. For vlsi, a plane surface may be approximated by depositing the interlevel dielectric by bias-sputter deposition (see section 9. 2. 4) or by using planarization.

    對于超大規模集成電路的平面狀表面，可以用偏置濺射淀積法的層間介質淀積（見924節）或用平面化工藝來近似獲得。
  10. The extensive use of digital circuit has led to the development of integrated circuits.

    數字電路的廣泛使用促進了集成電路的發展。
  11. Development of hybrid integrated circuit of high linearphase - locked frequency discriminator

    混合集成電路高線性鎖相鑒頻模塊的研製
  12. Esc engine spark control igniter

    三菱發動機集成電路點火控制裝置
  13. Gmc network has better high - frequency performances and is easier to control on chip than rc network

    與傳統的電阻電容結構相比，跨導電容結構有更好的高頻特性，在集成電路中較易控制。
  14. Two other effects are transient phenomenon called single event upset ( seu ) and single event latchup ( sel ). in this paper, some means to harden the devices against these phenomena are used. guard banding around nmos and pmos transistors greatly reduces the susceptibility of cmos circuits to lachup

    在本文設計中，採用雙環保護結構，大大的降低了cmos集成電路對單粒子閂鎖效應的敏感性；對nmos管採用環型柵結構代替傳統的雙邊器件結構，消除了輻射感生邊緣寄生晶體管漏電效應；採用附加晶體管的冗餘鎖存結構，減輕了單粒子翻轉效應的影響。
  15. Film and hybrid integrated circuits. hermetic packages

    薄模和混合式集成電路.密封外殼
  16. Cpk study of bonding process in hic production

    混合集成電路鍵合工序能力指數探索
  17. Hic hybrid integrated circuit igniter unit

    混合集成電路點火裝置
  18. The final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer.

    按照順序從每一塊掩膜版上將圖形一層一層地轉移到矽片的表面，就制得了成品集成電路。
  19. These defects appear during crystal growth, but crystals having such defects are not considered usable for ic manufacture and are discarded.

    這些缺陷在晶體生長時出現，有這類缺陷的晶體不能用於集成電路製造，應報廢。
  20. In early ic fabrication practice, etch bias was usually dealt with by introducing an appropriate amount of compensation in the masking layer.

    在早期的集成電路製作實踐中，刻蝕偏差通常是通過在掩膜層上引入一個適量的修正來處理的。
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