case bonding 中文意思是什麼
case bonding
解釋
殼體結合-
Performance for a piezoresistive transducer pressure sensor to thermal and pressure environments can be predicted by finite element method. a simplified 1 / 8 model, considering silicon dioxide and nitride process as well as stack anodic bonding and adhesive bonding processes, was developed. the fem results were found to be comparable to experimental data. case studies suggested that pyrex stack induces certain amount of non - linearity, while it isolates hard epoxy nonlinear effect. flexible epoxy bonding or soft adhesive bonding is preferred to the packaging process. the viscoelasticity and viscoplasticity of bonding material will result in hysteresis and drift errors to sensor output. however, soft adhesive s influence on sensor can be ignored under relative stable environments. more over, detailed design and process information will help to improve modeling application
熱、壓環境下壓阻變換壓力傳感器的性能可以通過有限元方法預測.這里研究了簡化的1 / 8模型，模型考慮了二氧化硅和氮化硅生成過程及堆陽極鍵合和膠粘結合過程.結果發現有限元預測結果和實驗數據具有可比性.範例研究表明，硼硅堆導致產生一定的非線性，但它隔離了硬環氧樹脂的非線性.在包裝過程中最好使用柔性環氧黏合或軟黏膠性結合.黏合材料的黏彈性和黏塑性將會導致傳感器輸出的滯后和漂移誤差.然而，在相對穩定的環境下，軟黏合劑對傳感器的影響可以忽略.此外，詳細的設計和過程信息有助於提高模型的適用性 -
Figure 1 illustrates the connection arrangement of circuit protective conductors ( cpc ) and bonding conductors to exposed and extraneous conductive parts. by proper installation of automatic disconnection devices, cpc and equipotential bonding, in case of an earth fault occurred in an installation, the voltage on any exposedextraneous conductive parts occurring anywhere in the installation should be of such magnitude and duration as not to cause danger ( please refer to figure 2 and 3 )
因此，當電力裝置發生故障時，由於線路得到相關截流器的保護，電力裝置的任何一處的外露非帶電金屬部分和非電氣裝置金屬部分的電壓，其強度及持續時間皆不致引起危險（請參閱附圖二及三） 。
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