chip bonding 中文意思是什麼
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Research on the thermode bonding procee for flip chip
倒裝晶元熱電極鍵合工藝研究 -
Flip chip bonding technology used in modern micro - photoelectron package
現代微光電子封裝中的倒裝焊技術 -
An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry. it develops for the mass production of ic, mems and moems with small feature sizes and high precise bonding demands. an alignment system is one of the key components in flip chip bonders
全自動倒裝貼片機（ flipchipbonder ）是半導體生產工藝中完成晶元和基底對準、鍵合的高精度自動化設備，適合於特徵尺寸小，鍵合精度要求高的ic （ integratedcircuit ） 、 mems （ microelectromechanicalsystem ） 、 moems （ microopticalelectromechanicalsystems ）等的大規模生產。 -
Moving stiffness analysis on the parallel bonding mechanism of ic chip die
晶元粘片機並聯焊頭機構的動剛度分析 -
Figure 7 shows the sequence for tape bonding the chip and assembling the package.
圖7所示為帶狀引線連接晶元和管殼裝配的工藝程序。 -
In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. part of the assembly process
在微電子中，使用電線將數據包的引線與晶元上的結合區相連接的過程。裝配過程的一部分。 -
Mcm flip - chip - bonding technique used in fabrication of cmos - s eed smart pixel
靈巧象素中的應用研究 -
Andorin optoelec technology inc. established in 1999. as lcd module manufactory our capcapabilities are cob ( chip - on - board ), and tab ( tape automated bonding ). we provide extensive and complete solutions based on customer needs
安的利光電科技有限公司成立於1999年，主要產品是液晶顯示模組，包括cob及tab產品系列。我們可根據客戶要求提供方案，以滿足客戶的需要。 -
Flip - chip bonding technology
的柔性凸點技術 -
For the problem of poor cohesion and the difficult process follow - uply, such as mount the components in the ltcc substrate. besides, it ' s easy to short circuit between each electrode because of the small size of chip. we carried on the experiment of mount components and chip bonding
針對ltcc基板布線附著性較差，貼裝元器件等電路后續加工困難，布線容易脫落和管芯尺寸小，鍵合時各級之間容易短路的問題，進行ltcc基板后續貼裝和管芯鍵合工藝實驗。 -
Based on silicon - piezoresistive method, the paper first gives the theory of array silicon piezoresistive pressure, acceleration sensor, and the design of its incorporated chip, microstructure and out - circuit. several key techniques of making array silicon piezoresistive pressure, acceleration sensor such as 1c technic, mems ( silicon - silicon direct bonding, anodic bonding, anisotropic etching ) is also studied. minuteness engine machining, anode bonding etc. in the paper there are three ways which are examine - form, curve simulanting, to carry out sensors non - linear self - emendating ; adopt the several curves approaching and curve simulating to achieve the aims of sensor error self compensation, fusion technology etc. therefore, it providing referenced values of ways and directions for sensor system directing on
論文首先以硅壓阻效應原理為基礎，討論了陣列式硅壓力、加速度傳感器的設計原理，並對陣列式硅壓力、加速度傳感器中集成敏感晶元（壓力、加速度） 、總體結構和壓力陣列的信號處理電路進行了設計，在陣列式硅壓力、加速度傳感器的研製中，還研究了半導體平面工藝、大規模集成電路技術、微機械加工技術（硅硅鍵合、靜電封接、各向異性腐蝕）等關鍵技術的應用。
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