chip thickness 中文意思是什麼
chip thickness
解釋
切屑厚度-
The radius of the micropump is 3mm, the radius of the films of micropump is 2mm, the thickness of the films of the micropump is 5 m, the thickness of the pzt chip is 10 m, the tall of the micropump is 1000 m, the drive voltage is 50v, the drive frequency of the micropump is 4000hz
泵體半徑為3mm ，泵膜半徑為2mm ，泵膜厚度為5 m ， pzt片厚度為10 m ，泵體高度為1000 m ，方波驅動電壓為50v ，驅動頻率為4000hz 。 -
Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built, thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built, and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip
本文根據實際的多晶元組件的封裝結構，建立了三維溫度場分析模型，分析了金剛石作為導熱層和基板對多晶元組件散熱性能的改善;建立了二維和三維的晶元-粘結層-基板熱力學模型，分析了不同的基板/晶元厚度比和面積比對層間熱應力分佈的影響。 -
On the design of the system, the thickness measure system of mems chip is built based on lbu and pump - probe technology. on the analysis of data, the reflectivity curve is analyzed using the law of reflectivity change induced by ultrasound, and the thickness is calculated using the system designed by the article, to aluminum film the size of about 20nm can be measured, when the film be measured is single layer, the relative error of the system is less than 2 %, when the film be measured is double layer, the relative error of the system is less than 10 %
在基礎理論方面研究了激光（特別是超短脈沖激光）超聲的激勵機理，探討了激光調制技術以提高系統信噪比，闡述了泵束探針束技術及相關實驗設置；在系統設計上，以激光超聲為基本原理，以泵束探針束技術為系統設計方案完成了mems基片厚度測量系統的設計；在數據分析方法上，利用聲致光反射率變化的一般規律對測得的光反射率曲線進行分析，確定超聲回波在薄膜兩界面間來回傳播的時間，以計算薄膜的厚度。 -
In the milling forces simulation model, the algorithm to identify the engaging cutting edges is proposed using z - map simulation model in ball - end milling process. the expression of instantaneous chip thickness is discussed by analyzing the effect of cutter eccentricity and deflection. then ball - end cutter milling forces simulation model is established on the basis of the relationship between milling forces and chip load
3 .在球頭銑刀銑削力建模和模擬方面，基於z - map模型，提出了識別球頭銑刀數控加工中參與切削的切削刃單元的peem方法，建立了球頭銑刀銑削力模型，同時根據單刃切削條件，提出了確定刀具偏心參數的方法，開發了考慮刀具偏心和刀具變形的球頭銑刀三軸加工過程的模擬系統。
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