csp chip size package 中文意思是什麼
csp chip size package
解釋
晶元尺寸封裝-
As an advanced package, 3 - d stacked csp assembly provides significant size and performance advantages than traditional single chip package. meanwhile, high packaging density tends to generate more power in a package and cause serious thermal problem
三維疊層晶元尺寸封裝( stackedchipscalepackage )是目前最先進的微電子封裝形式之一,具有體積小、重量輕、封裝效率高等特點。
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