gold bonding wire 中文意思是什麼

gold bonding wire 解釋
金連接 線, 金鍵合線
  • gold : n 1 金，黃金；金幣。2 財富；財寶；黃金一樣貴重[富麗]的東西。3 金色，金黃色。4 包金，鍍金；金粉，...
  • bonding : 冰凍膠結
  • wire : n 1 金屬線，銅絲，鐵絲，鋼絲；【電學】導線；線路；金屬絲網；【造紙】抄網。2 電信；〈口語〉電報。3...
  1. As a contrast object, gold wire ball bonding technology was also studied

    金絲球鍵合作為對比研究對象引入本文研究范圍。
  2. Copper wire ball bonding is a new technology which is expected to replace the traditional gold wire ball bonding and is of great significance in reducing the cost and improving the reliability of microelectronic components

    銅絲球鍵合是一種有望取代現行金絲球鍵合工藝的新技術，這一技術對于降低微電子元器件的成本、提高元器件的可靠性具有重要意義。
  3. The whole process of copper wire ball bonding and gold wire ball bonding were compared and analyzed, and a central composite design of experiment ( doe ) approach was applied to optimize the parameters of free air ball formation process and bonding process, separately

    本文首先對比分析了銅絲球鍵合和金絲球鍵合的全過程，採用實驗設計分別對燒球工藝參數和鍵合工藝參數進行了優化。在此優化參數下，獲得了連接良好的銅絲球鍵合點和金絲球鍵合點。
  4. Iso 9001 quality system. hope to be major supplier of cob and gold bonding wire in semiconductor packaging industry

    全部製程環境為標準半導體無塵超凈空間， iso 9001質量體系保證。
  5. Special for cob bonding wire al si fine wire fine gold lead bonding wire and electronics manufacturing service, have been evaluated vendor for motorola. imported equipment and material from usa, uk, germany and japan. advanced process under clean room environment

    主要開發和生產cob邦定鋁線led鍵合金線高純鋁線fine bonding wire ，同時提供電子產品委託生產服務ems ，是motorola公司的正式供貨商。
  6. Method for determining impurities in gold wire for semiconductor lead bonding by icp - aes

    鍵合金絲中雜質元素的icp - aes測定方法
  7. Gold wire for semiconductor devices lead bonding

    半導體器件鍵合金絲
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