ic fabrication 中文意思是什麼

ic fabrication 解釋
集成電路製作
  • ic : 1. integrated circuit 【無線電】積體[集成]電路。2. interior communications 內部通訊聯絡。
  • fabrication : 成形加工
  1. In early ic fabrication practice, etch bias was usually dealt with by introducing an appropriate amount of compensation in the masking layer.

    在早期的集成電路製作實踐中，刻蝕偏差通常是通過在掩膜層上引入一個適量的修正來處理的。
  2. Compared with bst materials, especially in thin films, ps t has smaller ferroelectric critical size, lower crystallization temperature, and compatible fabrication with si micro - electronics, so it can meet the need of the high quality si - based integrate circuit ( ic ). moreover, it is important to promote the development of the miniaturization and integration for the modern devices

    與bst相比，特別作為薄膜材料， pst的鐵電臨界尺寸較小，晶化溫度較低，制備工藝與si微電子工藝兼容，更能夠滿足高性能的si基集成電路的需要，對推動現代器件發展的小型化和集成化具有十分重要的意義。
  3. The paper mainly found on the application of photoresist in the process of ic fabrication to summarize the facets of reaction mechanism, performance index parameters and finally to indicate some new development directions in terms with process evolution target

    主要圍繞光刻膠在積體電路製造中的應用，對其反應機理及應用性能指標進行闡述，重點從工藝的角度去提出新的研究方向。
  4. Compared with the similar research results, the weighted control ic here has the following characteristics : ( 1 ) the circuit structure is simpler ; ( 2 ) the chip ' s fabrication is compatible with standard cmos process ; ( 3 ) n - mosfets with high w / l ratio and short channels are used for weighting and output to reduce the insertion loss ; ( 4 ) the weighting factor varies in a relatively wide range with the controlling signals ; ( 5 ) input and output impedance approach 50 in low frequency ( e. g. 50mhz ), while in higher frequency they slightly deviate from 50, hence the energy reflection lower than 0. 1 ; ( 6 ) it completes the functions of sampling, weighting, controlling and summing of high frequency analog signals

    它的加權控制電路與已報道的相關電路相比具有如下特點：電路結構簡單；製造工藝與普通cmos工藝兼容：短溝道，高寬長比的nmos晶體管具有低的通導電阻，將其作為加權、輸出器件可降低由電路引起的插入損耗；改變加權信號，可實現權值在較大范圍內的連續變化；輸入、輸出阻抗在低頻（如50mhz ）下接近50 ，而在高頻下略有偏離50 ，但反射系數均低於0 . 1 ；實現了對高頻信號的取樣、加權、控制、疊加功能的迭加。
  5. Especially, mesfet devices fabricated on lec si - gaas substrate have been adopted into very large - scale integration ( vlsi ) and monolithic microwave integrated circuit ( mmic ) extensively. therefore, it is necessary to study the influence of defects in substrate material of lec si - gaas on performance of mesfet to meet the need of design and fabrication of gaas ic

    以液封直拉半絕緣gaas為襯底的金屬半導體場效應晶體管（ mesfet ）器件是超大規模集成電路和單片微波集成電路廣泛採用的器件結構，因此研究lec法生長si - gaas （ lecsi - gaas ）襯底材料特性對mesfet器件性能的影響，對gaas集成電路和相關器件的設計及製造是非常必要的。
  6. Smic is a pure - play ic foundry that provides wafer fabrication of 8 - inch and 12 - inch wafers at 0. 35 - micron to 0. 11 - micron technologies

    中芯國際是一家純商業性晶元代工企業，提供0 . 35微米至0 . 11微米技術工藝的8英寸和12英寸晶元代工服務。
  7. To be economically viable, such a technology must share a great deal with the existing ic processor infrastructure, including critical items like fabrication foundries and software platforms

    在經濟上要能行得通，這項技術在很多方面必須和現有的ic處理器結構相通，包括關鍵的製造廠房及軟體平臺等。
  8. While expensive eda tools are required for ic design, other types of equipment are also needed for other parts of the cycle, such as wafer fabrication, packaging, wafer bumping, testing, etc. currently, most hong kong ic design companies have to rely on overseas companies to perform these tasks

    集成電路設計工作須要利用昂貴的電子設計自動化工具，但周期內其他環節如晶圓加工、封裝、晶圓凸塊製造、測試等，卻需要其他類型的儀器。目前香港大部分集成電路設計公司均要依賴海外公司進行有關工作。
  9. A concept of ic technology database is presented after ic process is analyzed in detail. the ic fabrication computer - aided management system - icf _ cams is developed according to the model of simplified ic process. the result of icf _ cams running shows that it has the expectant management capability of ic process and that the concept of ic technology database is correct and feasible

    本文首先對ic及其製造工藝以及管理信息系統作了概述，對ic工藝流程特點進行了深入剖析，提出了工藝庫管理模式的概念，並選用了幾個關鍵的單項工藝組成了一個簡化的工藝流程模型，以此模型為原型系統設計開發了一個ic製造計算機輔助管理系統。
  10. This paper ' s aim is to combine computer technology for information management with ic fabrication and to study the design method of computer - aided management system of ic fabrication

    本文的目的是將計算機信息管理技術與ic製造工程相結合，探討用於ic製造的計算機輔助管理系統的設計開發方法。
  11. It ' s a more difficult task to integrate these new materials into the ic fabrication

    將這些新材料綜合運用於集成電路的製作是一項非常艱難的任務。
  12. The computer management capability of ic fabrication is also poor. so it is significant for us to study the pattern and method of ic fabrication management and to develop the management system

    因此，對ic製造管理模式和管理方法的研究以及管理系統的開發對我國集成電路產業的發展具有十分重要的意義。
  13. The ic incorporates a main switching device and a low power consumption control ic, and thus permits fabrication of a partial resonance power supply with minimal external components

    Ic內部素子低消費電力ic搭載少外付部品部分共振電源構成可能。
  14. In chapter 3, the layout and fabrication of the ic are presented

    第三章介紹了可加權高頻模擬開關晶元的版圖實現和製造。
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