ic mems 中文意思是什麼
ic mems
解釋
與微系統論壇-
An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry. it develops for the mass production of ic, mems and moems with small feature sizes and high precise bonding demands. an alignment system is one of the key components in flip chip bonders
全自動倒裝貼片機（ flipchipbonder ）是半導體生產工藝中完成晶元和基底對準、鍵合的高精度自動化設備，適合於特徵尺寸小，鍵合精度要求高的ic （ integratedcircuit ） 、 mems （ microelectromechanicalsystem ） 、 moems （ microopticalelectromechanicalsystems ）等的大規模生產。 -
Micromanipulation is an important emergency technology developed mainly over the past decade. the micro / nano manipulation systems have been widely applied to mems manufacturing, optical parts alignment, optical fiber connection, laser navigation, biomedical engineering and ic manufacturing
在過去的十年中，微操作技術得到了飛速的發展，微操作系統在mems製造、光學調整、光纖作業、激光制導、生物醫療、 ic製造等領域得到了廣泛的應用。 -
Resonant pressure sensors are fabricated by ic process and mems technology and bonded to a stress isolating mechanical structure and sealed into an evacuated package
晶元利用半導體ic工藝和mems工藝製作，採用一種減小封裝應力的結構，完成壓力傳感器的真空密封及封裝。 -
Mems is forecasted to have a commercial market growth similar to its parent ic technology. however, the complexities of mems design and the high cost of mems product slow down this growing
但目前mems的發展面臨著產品研發周期長、成本高等問題，研究表明mems的設計水平落後于製造水平是問題的原因所在。
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