integrated semiconductor 中文意思是什麼

integrated semiconductor 解釋
積分電路
  • integrated : adj. 完整的，完全的。 an integrated iron and steel works 鋼鐵聯合企業。 an integrated oil company 大型石油（聯合）公司。
  • semiconductor : n. 【物理學】半導體。
  1. Bcd detail specification for electronic component. semiconductor integrated circuit. type ch2019 4 - line to 10 - line decoder with bcd - in

    電子元器件詳細規范.半導體集成電路ch2019型4線- 10線譯碼器
  2. A further refinement in semiconductor technology is the integrated circuit.

    在半導體工藝中，集成電路是一次革新。
  3. Semiconductor, diodes, bipolar junction transistors, field - effect transistors, transistor amplifiers, frequency response, operational amplifiers, differential and multistage amplifiers, integrated circuits

    半導體、二極體、雙極電晶體、場效電晶體、電晶體放大器、頻率響應、算放大器、差動及多極放大器、積體電路。
  4. Detail specification for electronic components. semiconductor integrated circuit ct54h20 ct74h20 dual 4 - input positive - nand gate

    電子元器件詳細規范.半導體集成電路ct54h20 ct74h20型雙4輸入與非門
  5. Detail specification for electronic components. semiconductor integrated circuit. ct54ls00 ct74ls00 quadruple 2 - input positive - nand gate

    電子元器件詳細規范.半導體集成電路. ct54ls00 ct74ls00型四2輸入與非門
  6. Detail specification for electronic component. semiconductor integrated circuit - type cd3220cp dual preamplifier with alc

    電子元器件詳細規范.半導體集成電路cd3220cp型帶alc雙前置放大器
  7. General principles of measuring methods for quartz clock and watch circuits of semiconductor integrated circuits

    半導體集成電路石英鐘表電路測試方法的基本原理
  8. Detail specification of metal rhomb package for semiconductor integrated circuits

    半導體集成電路金屬菱形外殼詳細規范
  9. Detail specification for electronic components. semiconductor integrated circuit - cf3080 type transconductance operational amplifier

    電子元器件詳細規范.半導體集成電路cf 3080型跨導運算放大器
  10. Universal instruments is a global electronics productivity specialist, providing innovative circuit, semiconductor, and back - end assembly technologies and equipment, integrated system solutions, and process expertise to manufacturers in every sector of the global electronics industry

    環球儀器公司是一家全球性的電子產品生產設備專業製造商，為全球電子行業各領域的製造廠商提供富有創新性的電路、半導體、後端組裝技術和設備、集成系統解決方案及專項工藝技術。
  11. China ' s domestic companies included 86 ic design companies : china integrated circuit design co., ltd., datang microelectronics, c * core, spreadtrum communication, lhwt, shenzhen state microelectronics, shenzhen zte ic design, hisense hiview tech., etc. ; 25 manufacturers : smic, huahong nec, hejian, china resources microelectronics, grace semiconductor manufacturing, csmc tech., asmc, etc ; 10 engaged in packaging and testing, such as nantong fujitsu, jiangsu changjiang electronics, tianshui huatian, 10 semiconductor equipment manufacturers : cetc no. 2 institute, cetc no. 48 institute, beijing sevenstar huachuang, institute of microelectronics of the chinese academy of sciences, institute of optics and electronics of the chinese academy of sciences etc. ; 37 semiconductor materials providers, including grinm semiconductor materials, heraeus zhaoyuan precious metal materials, etc

    國內參展商包括中國華大、大唐微電子、蘇州國芯、展訊通信、六合萬通、深圳國微、深圳中興集成電路、海信信芯科技等86家集成電路設計公司；中芯國際、華虹nec 、和艦科技、華潤微電子、宏力半導體、華潤上華、上海新進等25家主要集成電路製造企業；南通富士通、江蘇長電、天水華天等10家封裝測試企業；中電科技集團第2研究所、第48研究所、七星華創、中科院微電子所、中科院光電所等10家半導體設備企業；有研矽谷、賀利氏招遠等37家半導體材料企業。
  12. As one kind of si nanostructures, si - rich si02 films are the important si - based light - emitting materials. moreover, silicon is the leading semiconductor in the microelectronic industry. furthermore si02 films as passitive and insular layers are widely used in si device and integrated circuit. so si - rich films are considered suitable for optoelectronic applications

    另一種觀點認為納米硅薄膜中的可見光發射來自界面或介質層中的發光中心。還有人認為對于鑲嵌在sio _ 2中的納米晶粒來說，與氧有關的缺陷可能是導致可見光或藍綠光發射的主要原因。
  13. Semiconductor integrated circuits. detail specification for type jf3140 and jf3140a bimos operational amplifiers with high input impedence

    半導體集成電路. jf3140 jf3140a型bimos高輸入阻抗運算放大器詳細規范
  14. Gaas crystal is a kind of iii - v group compound semiconductor material with good electrical performance. the semiconductor devices and integrated circuit ( ic ) fabricated on gaas substrate have such advantages of hign - speed information processing that they have drawn the researcher ' s attention

    Gaas晶體是一種電學性能優越的-族化合物半導體材料，以其為襯底製作的半導體器件及集成電路，由於具有信息處理速度快等優點而受到青睞，成為近年來研究的熱點。
  15. With the advance of semiconductor manufacturing, circuits with increasingly higher speed are being integrated at an increasingly higher density, which makes analysis and verification of power grid integrity more important. power grid integrity includes four issues, namely, ir drop analysis, ground bounce analysis, ldi / dt from the pin inductance and em analysis

    隨著超大規模集成電路集成度和工作頻率的不斷提高，電源網格完整性分析變得越來越重要，一般有四個關鍵問題： ir電壓降分析、接地點電勢上升（ groundbounce ）分析、來自引腳電感的ldi / dt分析和電子遷移率em分析。
  16. Detail specification for electronic component. semiconductor integrated circuit. type ch2021 4 - bit up down synchronous binary counter dual clock

    電子元器件詳細規范.半導體集成電路ch2021型4位二進制同步加減計數器
  17. Semiconductor devices - integrated circuits - hybrid integrated circuits and film structures - manufacturing line certification - generic specification

    半導體器件.集成電路.混合集成電路和薄膜結構.生產線認證.總規范
  18. Semiconductor devices - integrated circuits - hybrid integrated circuits and film structures - manufacturing line certification - blank detail specification

    半導體器件.集成電路.混合集成電路和薄膜結構.生產線認證.空白詳細規范
  19. Semiconductor devices - integrated circuits - hybrid integrated circuits and film structures - manufacturing line certification - procedure for qualification approval

    半導體器件.集成電路.第23 - 5部分:混合集成電路和薄膜結構.生產線認證.合格鑒定規程
  20. Semiconductor devices - integrated circuits - part 23 - 5 : hybrid integrated circuits and film structures ; manufacturing line certification ; procedure for qualification approval

    半導體器件.集成電路.第23 - 5部分:混合集成電路和薄膜結構.生產線認證.鑒定批準
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