intermetallic 中文意思是什麼

intermetallic 解釋
adj. 形容詞 金屬間的，金屬間化合的。

  1. Abstract : the current status of research work on intermetallic compound dispersoid in rapidly solidified elevated temperature aluminum alloys is reviewed. the dispersoid existing in common elevated temperature aluminum allo ys, effect of rapid solidification processing on the formation of dispersoid and their thermal stability are discribed

    文摘:綜述了快速凝固耐熱鋁合金中金屬間化合物彌散相的研究現狀，介紹了常見耐熱鋁合金中存在的彌散相、快速凝固工藝對彌散相形成的影響和彌散相的熱穩定性及其影響因素。
  2. According to the nb - si phase diagram, the temperature of 1550 ?, which is lower than the eutectoid transformation temperature of nbssi ( 1783 ? ), is chosen for heat - treatment. according to the present conditions of the furfaces, heat - treatment by stages is first proposed for the nb - si system intermetallic composites to keep the furface in good conditions. the results indicate that the equilibrium nb + nbssia dual - phase microstructure of the nb - si system intermetallics forms gradually via such eutectoid reaction as nbasi ? nb + nbssis with the heat - treatment time

    根據nb - si二元相圖，選擇略低於nb _ 3si共析轉變溫度t _ f = 1783的1550對鑄態nb - si系金屬間化合物進行不同時間（ 25h - 100h ）的熱處理，並根據目前國內和我院熱處理爐的現狀，首次提出採用分段熱處理的方法來解決nb - si合金熱處理溫度高、連續熱處理時間過長而影響熱處理爐壽命的困難。
  3. Preparation process of intermetallic compound sbsn and its desulfurization performance

    的合成及脫硫性能研究
  4. The study of structure and micro - mechanism of the sm3 fe1 - xvx 29 intermetallic compounds

    29的結構及基微觀機制研究
  5. Study on microstructure and formation of intermetallic compound in rs al - ti - re alloy

    合金化合物相結構及形成的研究
  6. Preparation of ordered intermetallic compound of fe3si with mechanical activation and sintering

    有序金屬間化合物的制備
  7. Evolution of intermetallic compounds in snag and snagcu lead - free solder joints during aging

    無鉛焊料接頭中金屬間化合物在時效中的演變
  8. Classification and designation for superalloys and high temperature intermetallic materials

    高溫合金和金屬間化合物高溫材料的分類和牌號
  9. Method of tensile test for intermetallic compounds - part 1 : room temperature tensile test

    金屬間化合物抗拉伸試驗方法.第1部分:室溫抗拉伸試驗
  10. Method of tensile test for intermetallic compounds - part 2 : elevated temperature tensile test

    金屬間化合物抗拉伸試驗方法.第2部分:高溫抗拉伸試驗
  11. Study on structural stability of mg - ce intermetallic compounds based on the pseudopotential plane - wave method

    化合物相結構穩定性的贗勢平面波方法研究
  12. Molecular field theory analysis of magnetic properties and magnetic phase transitions of intermetallic compound

    2化合物的磁性和磁相變的分子場理論研究
  13. The process and mechanism of ball bonding were studied in this paper, specifically, intermetallic compounds ( imc ) formation and reliability on copper wire and aluminum alloy pad bonding joint during thermal aging were analyzed in detail

    本文在對銅絲球鍵合工藝和原理研究的基礎上，著重分析了老化過程中銅絲球與鋁合金焊盤鍵合的金屬間化合物生長及可靠性。
  14. Tial - matrix intermetallic compounds have become one of the hottest high - temperature structural materials recently, due to its excellent high - temperature properties and lower density

    Tial基金屬間化合物因具有優良的高溫性能和較低的密度，從而成為目前世界上研究最為熱門的高溫結構材料之一。
  15. The simplest way of making intermetallic compounds ? by just melting the elements together ? was not possible in this case, because the two elements have very different melting points : 650 degrees c for magnesium and higher than 2, 000 degrees c for boron

    製造金屬互化物最簡單的方法，就是將組成元素一起熔化，但是這種方法在這里卻不適用，因為這兩種元素的熔點相差太多：鎂的熔點是650 ，而硼的熔點則超過2000 。
  16. Subsidized by the national natural science foundation of china, " tenth five - year " plan of hubei province and so on, this dissertation systematically discussed the author ' s researches on synthesis and deformation of ni / al and ti / al system intermetallic compound

    本文在國家自然科學基金、湖北省「十五」重點攻關計劃等基金支持下，系統地論述了作者在ni al系和ti al系金屬間化合物合成與成形的電脈沖效應方面研究成果。
  17. However, the die attach layer delaminated after 500 cycles and pcb cracked in the underfilled samples after long time cycling. c - sam is employed to investigate the delamination in the underfilled samples. highly concentrated stress - strain induced by the cte mismatch between the bga component and the pcb board, coarsened grain and two kinds of intermetallic compounds ( nisn / nisns ) which formed during reflow and thermal cycle and their impact on the reliability of solder joints are discussed in this paper

    充膠樣品粗化尤為嚴重； ? ni - sn金屬間化合物包括兩層：其中，靠近ni焊盤的那層比較平整，同時， eds結果分析表明其化學式近似為nisn ，而靠近焊料的那層呈板條狀，化學式近似為nisn _ 3 ，文獻表明其為亞穩相； ?充膠使得樣品最大應力范圍降了接近一個數量級並降低了dnp的作用，同時，器件失效模式變為晶元粘接層分層； ? c - sam結果表明本論文採用的充膠樣品，晶元粘接層分層起始於500周左右，而經過2700周循環的樣品，分層幾乎擴展到整個界面。
  18. Being a new generation of high temperature structure materials, ni / al and ti / al system intermetallic compounds are most potentially. they possess many excellent capabilities at high temperature such as high strength, corrosion resistance, contrast intensity and contrast rigidity

    Ni al系和ti al系金屬間化合物是極有潛力的新一代高溫結構材料，它們具有許多優良性能，如高溫高強度、高溫耐蝕性、高的比強度和比剛度等。
  19. The results indicate that arc melting is a good method to produce nb - si system intermetallics due to its simpler technics, lower cost and compact products. however, powder metallurgy is found to be not suitable to produce the nb - si system intermetallics due to its coarse and loose products resulting from the poor molding property of nb and si mixed powders. optical floating zone technology, which is used to fabricate nb - si intermetallic composites for the first time, is also found to be a good way to produce nb - si system intermetallics because of its compact products and good property despite of its relatively high cost

    結果表明，電弧熔煉方法制備得到的nb - si系金屬間化合物比較緻密，且制備工藝簡單，經濟實用，是一種合適的nb - si系金屬間化合物制備方法；由於nb 、 si元素粉末的成型性很差，用粉末冶金方法（熱壓燒結和冷等靜壓）制備的nb - si系金屬間化合物表面粗糙、緻密度低，且成本較高，不宜用於制備nb - si系金屬間化合物；首次用光學懸浮單晶生長技術制備的nb - si系金屬間化合物復合材料緻密度很高，盡管成本稍高，但由於性能最佳，也是一種合適的nb - si系金屬間化合物制備方法。
  20. It was found that the interfacial bonding of 93w - ofc was both the joining action of ofc / w grains and that of ofc / ni - fe binders, whereas the joining of ofc to tc4 could be seen as the mutual intense diffusion effect between ofc / tc4 and as a result cu - ti intermetallic compounds were formed at the joint. the joining of tc4 - a1 and a1 - mb2 were also attributed to the result of diffusion between elements ti - al and al - mg respectively. on the other hand, residual thermal stress and stress - induced distortion were produced at the joint simultaneously due to the difference in thermal expansion coefficient of different welding " materials

    研究表明， 93w與ofc的界面連接是ofc與93w中w晶粒的連接以及ofc與93w中ni - fe粘接劑的連接共同作用的結果； ofc與tc _ 4連接界面的形成是由於ofc與tc _ 4之間發生反應擴散，並由此在二者接頭處生成了cu - ti金屬間化合物的中間相； tc _ 4 - al的連接與al - mb _ 2的連接則分別是其基體元素ti 、 al之間和al 、 mg之間元素互擴散的結果，另外，由於熱膨脹系數的差異，擴散焊接后在不同焊件的接頭處存在殘余熱應力並由此引起接頭的形變。
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