lead solders 中文意思是什麼
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Research and development of sn - ag - sb lead - free based solders
系列合金的研究與開發 -
It is used for pressure and vacuum of ammoniac liquid and gas as well as of zhe madia which can ' t corrode carbon steel, stainless steel and solders like tin and lead
儀表適用於測量氨的液體和氣體的壓力真空，也可測量對碳鋼、奧氏體不銹鋼和錫鉛類焊料無腐蝕作用的介質的壓力和真空。 -
Study on the reliability of sn - ag - cu lead - free solders
無鉛焊料的可靠性研究 -
Development and research of self - adaptive lead - free solders
自適應無鉛焊料的開發與研究 -
Test methods for lead - free solders - part 1 : methods for measuring of melting temperature ranges
無鉛焊劑的試驗方法.第1部分:熔化溫度范圍的測量方法 -
Methods for chemical analysis of tin - lead solders - determination of arsenic content
錫鉛焊料化學分析方法砷量的測定 -
Methods for chemical analysis of tin - lead solders - determination of iron content
錫鉛焊料化學分析方法鐵量的測定 -
Methods for chemical analysis of tin - lead solders - determination of silver content
錫鉛焊料化學分析方法銀量的測定 -
Methods for chemical analysis of tin - lead solders - determination of antimony content
錫鉛焊料化學分析方法銻量的測定 -
Methods for chemical analysis of tin - lead solders - determination of cadmium content
錫鉛焊料化學分析方法鎘量的測定 -
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
完成某集成電路封裝（叩焊晶元）內部實際的電氣連接的焊料中的鉛。 -
Methods for chemical analysis of tin - lead solders - determination of sulphur content
錫鉛焊料化學分析方法硫量的測定 -
Methods for chemical analysis of tin - lead solders - determination of aluminum content
錫鉛焊料化學分析方法鋁量的測定 -
Methods for chemical analysis of tin - lead solders - determination of zinc content
錫鉛焊料化學分析方法鋅量的測定 -
Methods for chemical analysis of tin - lead solders - determination of tin content
錫鉛焊料化學分析方法錫量的測定 -
Methods for chemical analysis of tin - lead solders - determination of copper content
錫鉛焊料化學分析方法銅量的測定 -
Methods for chemical analysis of tin - lead solders - determination of phosphorus content
錫鉛焊料化學分析方法磷量的測定 -
Methods for chemical analysis of tin - lead solders - determination of copper, iron cadmium, silver, gold, arsenic, zinc, aluminium, bismuth, phosphorous content
錫鉛焊料化學分析方法銅鐵鎘銀金砷鋅鋁鉍磷量的測定 -
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead - free soldering
包括背景，焊料，表面鍍層，元器件，基板，組裝工藝，返工和無鉛焊接的可靠性。 -
Methods for the sampling and analysis of tin and tin alloys - method for the determination of copper in ingot tin and tin - lead solders photometric method
錫及錫合金取樣及分析方法.第4部分:錫錠及錫鉛焊料中銅的測定方法
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