microscopic particle 中文意思是什麼

microscopic particle 解釋
微觀粒子
  • microscopic : adj. 1. (像)顯微鏡的。2. 用顯微鏡可見的;微觀的;極微的(opp. macroscopic)。adv. -ically 1. 用顯微鏡。 2. 極微。
  • particle : n 1 顆粒,微粒;微量,極少量。2 【物、數】粒子,質點。3 【語法】虛詞,不變詞〈冠詞、副詞、介詞、...
  1. The sucking mouse brain were inoculated with mdj - 01 strain to make electron microscopic examination, results showed that the virus was a spheral particle with membran which had a diameter of about 40 nm. by indirect fluorescent antibody test mdj - 01 strain was identified with tbev. a part of region encoding e protein was expanded by rt - pcr and sequenced. the nucleotide sequences of two strain viruses were compared with sequences in genbankjsequence homology analyses revealed mdj - 01 strain and senzhang strain had the highest homology with tbev oshima5 - 10, respectively, which were 95 %, 94 %. mdj - 01 strain was identified with tbev again

    應用間接免疫熒光試驗進行血清學鑒定,結果表明mdj - 01株為tbev 。通過rt - pcr技術擴增部分e蛋白序列並測序,在genbank上進行同源性比較,發現mdj - 01株和森張株與tbevoshima5 - 10株的同源性最高,分別為94 、 95 ,從分子生物學水平上進一步證明mdj - 01株病毒為tbev 。在鑒定的基礎上,本實驗對兩株病毒進行了核苷酸全序列測定。
  2. It is found that the electric, field improves elongations in 2090 and 2090 + ce alloys markedly, especially in 2090 alloy, but has little effect on strengths. at the same time, the electric field lessenes percentages of intergranular delamination and increases transgranular fracture and microscopic plastic deformation. besides, the electric field makes both average particle size and its distributing range of 8 " phase smaller, and reduces the half width of pfz in aged alloys

    研究表明:固溶電場可顯著提高2090合金及2090 + ce合金的延伸率,尤其是對2090合金,但對強度則無明顯的影響;同時,固溶電場減少合金的沿晶分層斷裂比例,並增加穿晶斷裂及微區塑性變形;固溶電場還使合金時效后相顆粒的平均尺寸減小、尺寸分佈范圍減小,並使pfz的寬度減小。
  3. Cleanliness test for oil system of gas turbine measuring solid particle contaminant in oil liquid by microscopic counting method

    燃氣輪機.油系統清潔度測試.用顯微鏡計數法測定油液中固體顆粒污染度
  4. Microscopic analysis of the abrasion surface indicated that the wear mechanism of composites and matrix alloy included sticking abrasion and grindrng - particle abrasion on the materials

    磨損表面微觀分析表明,復合材料的磨損過程是粘著磨損和磨粒磨損兩種機制共同作用的結果。
  5. Testing of materials for semiconductor technology - test method for particle analysis in liquids - part 1 : microscopic determination of particles

    半導體工藝用材料的檢驗.液體中粒子分析的試驗方法
分享友人