sintered body 中文意思是什麼

sintered body 解釋
燒結體
  • sintered : 繞結的熱壓結的
  • body : n 1 身體,體軀,肉體;屍首;軀干,【林業】立木。2 本體,主體;主力;本文,正文;部分。3 (衣服的...
  1. The studies indicate that different content of pyrophyllite and dolomite can cause the following three cases : ( 1 ) making the refractory point decrease linearly and, to some extent, influencing the microstructure and properties of sintered body ; ( 2 ) acceleratingmullite formation during sintering, reducing thermal expansion coefficient of bond, reinforcing the matching nature and improving the flexural strength and shock strength ; ( 3 ) preventing sic grinding tool from generating black core, expanding suitable sintering temperature range of sic grinding tool

    同時,也不同程度地影響了磨具燒結體的微觀結構和性能; ( 2 )可促進在燒結過程中莫來石的形成,降低結合劑的熱膨脹系數,加強了結合劑與磨料的匹配性,提高了磨具的抗折強度和抗沖擊強度; ( 3 )在一定溫度范圍內還可防止碳化硅磨具出現黑心現象,拓寬了碳化硅磨具的燒結溫度適應范圍。
  2. The entire structure is fired at 1600℃ to form a monolithic sintered body.

    整個結構在1600下焙燒構成單片燒結物體。
  3. Xrd analysis at different depth of zro2 sintered body indicates that it has trace to be bombarded by high - energy particles at top surface, this results are the evidence for the existence of pulse electric field

    Zro _ 2燒結體不同深度的xrd分析表明:樣品表面有被高能粒子轟擊過的痕跡,脈沖電場誘發場發射電子及高能c粒子對樣品表面轟擊。
  4. Sic whisker is incorporated in the raw material of reaction bonded silicon carbide ( rbsc ) to prepare sicw / sic composites. the effect of fabrication process on the microstructure and the properties of the sintered body are investigated in this paper. based on the research results on the sinter process, it is concluded that the sic whisker solve rapidly even at 1450

    本課題將sicw引入反應燒結碳化硅( rbsc )體系,提出了一種制備高sicw含量sicw / sic復合材料的思路,研究了材料制備工藝對sicw / sic復合材料顯微結構的影響,討論了sicw / c坯體的反應燒結機理,對材料顯微結構與力學性能的相關性作了研究。
  5. Researches and applications of compound diamond core bit with sintered body

    混合型金剛石燒結體取心鉆頭的研製及應用
  6. The analysis of microstructure of samples showed that the grain of tio2 were very small under 700, the distance of grain became small with temperature increasing, the rate and size of pore was decreasing. the relative density of sample at 900 was 97 % and the grain size of sintered body was about 200nm. when the temperature exceeded 1100, the grain size of body grew up several times ( > 2 m )

    Tio _ 2燒結體sem顯微形貌分析表明:低溫( 700 )時坯體內顆粒無明顯長大,燒結體緻密度不高( 80 )晶粒間距隨溫度升高而變小,氣孔率也隨之降低,氣孔尺寸變小;當溫度超過900時,晶粒間連接緊密,燒結體內出現大量絮狀物質,緻密度大幅度提高,達97以上,小氣孔已聚集成大孔洞且分佈均勻,晶粒長大不明顯( 200nm左右) ;當溫度超過1100時,燒結體緻密度有所提高,但晶粒尺寸出現異常長大,長大了十幾倍(達2 m以上) 。
  7. The microstructure of sintered body was observed by scanning electron microscope ( sem )

    液相燒結時,顆粒合併是w顆粒長大的主要機制。
  8. The periodicity fluctuating has been produced by pulse magnetic field so that there are periodic high temperature region exists in sintered body, it results in the symmetrical crack in sintered body of zro2

    感生磁場的存在引起電場周期性的波動,在燒結體內產生不同的溫度區域,是造成燒結體內產生分佈均勻裂紋的主要原因。
  9. The development of filters, resonators and other telecommunication technology required better dielectric materials. the dielectric materials, used as the resonate body, should be high in dielectric constant, low in dielectric loss and a near zero temperature coefficient of dielectric constant in high frequency band, also could be sintered in a relative low temperature so as to reduce production cost, and what ’ s more, the miniaturization and reliability of materials are also the main aspects in the research work of high frequency band dielectric materials

    隨著濾波器、諧振器等器件以及通信技術的發展,人們對電介質材料的要求越來越高,要求作為介質諧振腔的電介質材料在高頻段下具有高介電常數,低介電損耗,接近於零的介電常數溫度系數,還要求高頻電介質材料能夠在較低的燒結溫度下燒成,以降低實際生產的成本,此外,材料的小型化,高可靠性也是高技術高頻介質材料的重要研究方向。
  10. Low heating rate and high sintered pressure were profitably for reducing the rate of pore so as to increase the relative density of sintered body

    低的升溫速率和高的燒結壓力有利於氣孔的排出,降低氣孔率,從而提高燒結體的緻密度。
  11. With the same sintered conditions, the relative density of sintered body was 98. 7 % at 25mpa sintered pressure and it was 91. 4 % at 12mpa. reducing heating rate enhanced the density of sample. the density was more than 98 % and had finest microstructure with a heating rate of 100 ? / min, it was 94. 8 % at 300 ? / min heating rate

    相同燒結條件下,燒結壓力為25mpa的tio :燒結體的相對密度為98 . 7 % ,而12mpa的僅為91 . 4 % ;以100 / min升溫的燒結體中晶粒形貌均勻,相對密度達98 %以上,而以300 / min升溫的燒結體中晶粒形貌不均勻,部分晶粒已異常長大,有大尺寸的氣孔存在,相對密度為94 . 8 % ,當然過低的升溫速率會延長燒結時間,燒結時間的延長也會引起晶粒的快速長大。
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