solderability test 中文意思是什麼

solderability test 解釋
焊接性試驗
  • solderability : 焊錫附著性
  • test : n 1 檢驗，檢查；考查；測驗；考試；考驗。2 檢驗用品；試金石；【化學】試藥；（判斷的）標準。3 【化...
  1. Test methods for bare wires - solderability test of coating - solder globule method

    裸電線試驗方法鍍層可焊性試驗焊球法
  2. Testing of solderability for soft soldering ; vertical dipping test for pre - tinned specimens ; testing ; assessment

    軟釬焊可軟釬性的檢驗.預鍍錫試樣的垂直浸漬試驗.檢
  3. Testing of solderability for soft soldering ; vertical dipping test for specimens of copper alloys ; testing ; assessment

    軟釬焊可軟釬性的檢驗.銅合金試樣的垂直浸漬試驗.檢
  4. Department perfect test, which can be made into various mechanical properties such as : tension tests, strength tests slide, terminal testing ; electrical performance test items include : insulation resistance testing, contact resistance testing, testing withstand voltage, high and low test, solderability test, durability testing, vibration - resistant testing, life test

    完善之測試部，能作各項機械性能測試如:拉力測試、插撥力測試、端子強度測試；電氣性能測試項目計有:絕緣電阻測試、接觸電阻測試、耐電壓測試、高低測試、可焊性測試、耐久性測試、耐振測試、壽命測試等
  5. Standard test method for solderability of metallic - coated products

    金屬塗覆產品的軟釬焊性試驗方法
  6. Smd environmental testing : tests - test : test methods for solderability of surface mounting devices by wetting balance using lead - free solder paste

    環境試驗:試驗.試驗:用無鉛焊錫膏濕潤平衡法測定表面安裝裝置
  7. Environmental testing - test methods - tests - test te - solderability testing of electronic components for surface mount technology by the wetting balance method

    環境試驗規程.第2部分:試驗方法.第69節:試驗te :潤濕平衡法試驗表面鑲嵌技術用電子元件軟釬焊
  8. Environmental testing. part 2 : tests. test ta : soldering. solderability testing by the wetting balance method

    基本環境試驗規程.第2部分:試驗.第54節:試驗ta :錫焊.潤濕平衡法可焊性試驗
  9. Environmental testing - part 2 : tests - test te : solderability testing of electronic components for surface mount technology by the wetting balance method

    基本環境試驗規程.第2部分:試驗.第69節:試驗te :潤濕平衡法對表面鑲嵌技術用電子元件的軟釬焊試驗
  10. Surface mount solderability test

    表面的可焊接性試驗
  11. Aerospace series - cables, electrical, aircraft use - test methods - solderability

    航空航天系列.飛行器用電纜.試驗方法.可焊接性
  12. Connectors for electronic equipment - tests and measurements - part 12 - 7 : soldering tests ; test 12g : solderability, wetting balance method

    電子設備連接器.試驗和測量.第12 - 7部分:焊接試驗.試驗12g .可焊接性.濕潤平衡方法
  13. Connectors for electronic equipment - tests and measurements - part 12 - 7 : soldering tests ; test 12g : solderability, wetting balance method iec 60512 - 12 - 7 : 2001 ; german version en 60512 - 12 - 7 : 2001

    電子設備連接器.試驗和測量.第12 - 7部分:焊接試驗.試
  14. Elements of electrical and optical connection - test methods - soft solderability

    電氣和光學連接元件.試驗方法.可軟釬焊性能
  15. Solderability test method

    軟釬焊性試驗方法
  16. Tp 52 test procedures for solderability of contact terminations use in connectors sockets

    連接器插座中使用的觸點終端的軟釬焊性的tp52試驗程序
  17. Environmental testing - tests - test ta - soldering - solderability testing by the wetting balance method

    環境試驗.試驗.試驗2 . 1ta :釬焊.用濕平衡法進行釬焊性試驗
  18. Aerospace series - elements of electrical and optical connection - test methods - part 501 : soft solderability

    航空航天系列.光電連接件.試驗方法.第501部分:軟釬焊性
  19. Environmental testing. part 2 : tests. test te : solderability testing of electronic components for surface mount technology by the wetting balance method

    環境試驗.第2部分:試驗. te試驗:用加濕平衡法測試表面安裝技術的電子元件的可焊性
  20. Environmental testing part 2 : tests. test ta : soldering. solderability testing by the wetting balance method

    環境試驗.第2部分:試驗.試驗ta :軟釬焊.用濕平衡法測試可焊性
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