tin plating 中文意思是什麼

tin plating 解釋
電鍍錫
  • tin : n 1 錫。2 鍍錫薄鋼板,馬口鐵,白鐵。3 錫器;罐頭;(容量)〈英國〉一罐[聽] (=〈美國〉 can)。4 ...
  • plating : n. 1. (電)鍍,噴鍍;鍍金(術)。2. 鍍層;外覆金屬板;【造船】(全部)船殼板;(兵艦等的)裝甲。3. 【攝影】曬相。4. 懸賞賽馬。
  1. Review and prospect of solderable tin - based binary alloy plating

    可焊性錫基二元合金鍍層研究的現狀與展望
  2. We have been closely cooperated with beijing institute of technology, one of the most prestigious university in china, and co - developed ion vacuum plating technique, multi - arc tin coating technique and twin - eccentric automatic fuel supply advancer in the recent years successively, and acquired many patents. the sag and scda series fuel supply advancer manufactured in one of our branch company : has adopted the advanced twin - eccentric blocks structure, thoroughly changed the traditional structurearc block, sliding block. the angle of advance is very accurate and precise, also perfect at position resume

    由本總公司提前器廠生產的sag scdm兩大系列供油角度自動提前器,改變了目前提前器市場上的傳統結構,用先進的雙偏心式結構,代替了二十年一貫制的弧形塊滑塊式結構,具有提前角特別靈敏,恢復性好,怠速運轉無噪音等優點,克服了提前器擺動大漏油等常見缺陷。
  3. Deposition mechanism of electroless plating tin in acid chloride solutions was analyzed theoretically, and three steps were summed up, including period of replacement reaction, coexistence periods of copper - tin codeposition and self - catalyzed deposition, and period of self - catalyzed deposition

    從理論上系統地分析了酸性氯化物化學鍍錫的沉積機理,將其歸納為置換反應期、銅錫共沉積與自催化沉積共存期和自催化沉積期三個階段。
  4. Ndfeb magnet is mainly made of neodymium iron and boron, with excellent magnetic property abundant raw material and reasonable prices, ndfeb magnet can be used as an ideal magnet in mini - motor permanent magnetic resonance sound device magnetic suspension system, magnetic transmission machine and iatrical apparatus and etc. for ndfeb, its surface is usually treatd with some special methods. the surface treatment method include zine nickel tin silver gold plating phosphor and spray epoxy resin etc

    其主要應用在微特電機、永磁儀表、電子工業、汽車工業、石油化工、核磁共振裝置、音響器材、磁懸浮系統、磁性傳動機構和磁療設備等方面。釹鐵硼磁鐵容易生銹、氧化,所以對釹鐵硼磁鐵,其表面通常需作電鍍處理,如鍍鋅、鎳、銀、金等,也可以做磷化處理或噴環氧樹脂來減慢其氧化速度。
  5. Rapid determination of nickel in the acidic brightening tin - nickel alloy plating bath

    酸性光亮鍍錫鎳合金鍍液中鎳的快速測定
  6. Some technical innovations inspired from practice part v removal of copper impurity from acidic bright tin plating bath

    光亮酸性鍍錫液中銅雜質的去除
  7. Black tin coating was prepared by multi - arc ion plating technology, and wear resistance, corrosion resistance, heat - proof property and absorption property of solar spectrum were also discussed

    摘要介紹了利用多弧離子鍍工藝制備黑色氮鈦膜,並對其耐磨損、耐腐蝕、熱穩定性及太陽光譜吸收等性能進行了研究。
  8. Meanwhile, fundamental principles about electroless tin plating by reducing agent and disproportionation reaction were explained. function of every component in the bath was explained that complexing agent can effectively change the potential of copper and tin, and accelerate the beginning of replacement reaction favorably ; reducing agent can increase the rate of chemical reaction and has the effect of promoting reaction dynamics too ; antioxidant can effectively prevent sn2 + in the bath from being oxidated ; additive agent a can improve the stability of the bath ; additive agent b has such effects as refining and brightening for the tin deposits, and it enlarges the range of brightening section ; additive agent c used as leveling agent can not only make the depostis level off, but also improve the dispersive ability of the bath ; surface - active agent can solve bubble problem which gathered on the surface of the deposits, and improve the surface quality of the deposits and the bath stability

    闡述了鍍液中各組分的作用:絡合劑能有效地改變銅、錫的電位,促使初期的置換反應順利進行;還原劑能加快化學反應速度,對反應動力學有積極的促進作用;抗氧化劑能有效地防止鍍液中sn ~ ( 2 + )的氧化;添加劑a能提高鍍液的穩定性,添加劑b對鍍層能有細化和光亮作用,擴大了鍍層光亮區的范圍;添加劑c作為平滑劑,不僅能增強鍍層表面的平整性,而且能提高鍍液的分散能力;表面活性劑較好地解決了化學鍍過程中汽泡在鍍件表面聚集的問題,提高了鍍層的表面質量和鍍液的穩定性。
  9. Gold coating, tin plating, tic plating

    鍍金鍍鈦鍍tic
  10. Gold coating, tin plating

    鍍金鍍鈦
  11. Effects of pulse bias on tin coating in arc ion plating

    均苯三甲酸鑭鋱發光配合物的合成與表徵
  12. Enamel - insulated round copper wire, tin - plating round copper wire. for electronic elements and cables bane round copper wire. it is a main manufacturing base in the north of chine. which has 2, 000, 000kg year - production capacity. the company had introduced advanced technology and key equipments from niehff co

    主要生產各類漆包線、電子元器件與電纜用鍍錫銅線和裸銅線三大類,年生產能力2000噸,是北方漆包線的主要生產基地。
  13. On the basis of electroplating and immersion plating tin, and through large numbers of experiments, a new process of electroless plating tin in acid chloride bath solutions including sncl2 2h2o, nah2po2 h2o, special complexing agent, additive agent, stabilizing agent and antioxidant, was established. continuous self - catalyzed deposition of tin on copper substrate was achieved successfully, and half - bright and silvery - white tin deposits with excellent properties were obtained

    本文是在電鍍錫、浸鍍錫工藝配方的基礎上,通過大量的試驗,確立了一種以氯化亞錫、次亞磷酸鈉和特定的絡合劑、添加劑、穩定劑,抗氧化劑為基本鍍液組成的酸性氯化物化學鍍錫體系,成功地在銅上實現了錫的連續自催化沉積,獲得了性能優異的半光亮銀白色錫鍍層。
  14. Methods for analysis of acid plating tin solutions - part 3 : determination of lead content by atomic absorption spectrometric method

    酸性電鍍錫溶液分析方法第3部分:原子吸收光譜法測定鉛的含量
  15. Methods for analysis of acid plating tin solutions - part 4 : determination of copper content by atomic absorption spectrometric method

    酸性電鍍錫溶液分析方法第4部分:原子吸收光譜法測定銅的含量
  16. Methods for analysis of acid plating tin solutions - part 2 : determination of free sulphuric acid content by potentiometric titrimetric method

    酸性電鍍錫溶液分析方法第2部分:電位滴定法測定硫酸
  17. Copper clad steel, copper clad aluminum, copper clad aluminum cca copper cloated ccaw copper clad coated cover over aluminum magnesium, ccam, ccamw, copper clad steel, copper coated steel, copper cover steel our company specialist for manufacturing and supplying copper clad aluminum wire, copper clad aluminum magnesium alloy silk ccam, tin - plating copper clad aluminum silk tcca, copper clad steel wire, tin - plating copper clad steel wire

    我公司長期提供銅包鋁線cca銅包鋁鎂合金ccam銅包鋁鍍錫ccas銅包鋼ccs電鍍錫銅包鋼cp的生產型企業,可生產范圍: 0 . 04 - 6 . 0mm希望能與貴公司建立長期的合作關系,如果有意向歡迎來函arthur . wang7 @ hotmail . com
  18. The specifications and techniques involved in the operating of microcircuits, such as forming of outgoing lines, tin plating, brazing assembling and disassembling of microcircuits, and interference protection measures are detailed in this paper

    從微電路引出線成形、鍍錫,微電路的釬焊、安裝、拆裝,以及微電路的抗干擾防護等操作工序,闡述了有關俄產微電路使用的工藝技術、操作技巧和建議規定
  19. Abstract : the specifications and techniques involved in the operating of microcircuits, such as forming of outgoing lines, tin plating, brazing assembling and disassembling of microcircuits, and interference protection measures are detailed in this paper

    文摘:從微電路引出線成形、鍍錫,微電路的釬焊、安裝、拆裝,以及微電路的抗干擾防護等操作工序,闡述了有關俄產微電路使用的工藝技術、操作技巧和建議規定
  20. A new process of electroless tin plating was studied, and half - bright and silvery - white tin coating is obtained

    摘要通過反復試驗,研究了一種新型的化學鍍錫工藝,獲得了半光亮銀白色的鍍錫層。
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