tiny crack 中文意思是什麼
tiny crack
解釋
發裂-
Incondition of surface anti - corrision and insulation coat of metal and tiny hole of steel where resistance and crack is very small, when supplying a high voltage, gas crack will be punctured and electric spark discharging will occur, now send a pulse signal to the alarming circuit the alarmer can send out sound and light to alarm. we can do leak hunting on the coating according to this principle
金屬表面絕緣防腐層過薄、漏鐵及漏電微孔處的電阻值和氣隙密度都很小，當有高壓經過時就形成氣隙擊穿而產生火花放電，給報警電路產生一個脈沖信號，報警器發出聲光報警，根據這一原理達到防腐層檢漏目的。 -
It can rapidly and exactly search for tiny defect, needle hole, crackl, gas crack on the anticorrosion coating of the metal and correctly note down the number of damaged point on the coating
快速精確地搜速金屬表面防腐層的極小缺陷，針孔，裂紋，氣隙並準確地記錄防腐層破損點的個數。 -
Secondly, the producing mechanism of crack in reinforced structure and factors which affect crack have been discussed, in the emphasis, the method is expounded, which applies first releasing then resisting, combination of releasing and resisting. in the method, flexible slit is applied firstly, which can make deformation of structure distributed, and decrease deformation energy, then the tiny expansion concrete and prestressed concrete with unbonded tendons are applied. and in the different phase, the compressive prestress is put on the concrete structure
其次，分析並論述了鋼筋混凝土結構裂縫產生的機理和影響因素，著重闡述了「利用先放后抗，抗放結合，綜合控制」的方法：即首先利用后澆帶，使混凝土結構分段變形，減小超長變形的影響；並採用微膨脹混凝土技術及無粘結預應力混凝土技術，分階段對混凝土結構施加一定的預壓應力，從而減小或完全抵消混凝土結構因混凝土硬化收縮引起的拉應力；再結合一些其他措施，成功實現鋼筋混凝土結構的超長無縫設計與施工。 -
The research shows that the conductive coat has definite application for monitoring tiny crack in bridges and tunnels
該研究表明：導電塗膜對橋梁、隧道的裂縫監測具有一定的工程應用前景。 -
During the fabrication or service, if the applied tensile stresses exceed the probabilistic tensile strength of silicon, then failure will occur. even a tiny crack will bring tremendous damage to devices and circuits. especially nowadays, with the increasing of silicon wafer diameter, warpage in heat treatment, defects and dislocations generated in silicon often become critical problems in ulsi devices fabrication
特別在大規模集成電路與器件生產中，一個微小的裂紋就可能導致后道工序中電路與器件的完全損壞；而且在熱處理過程引起的翹曲，使光刻精度下降；在矽片內部產生的氧沉澱及位錯等缺陷，會導致集成電路或器件的漏電流增加，使器件失效。
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