wafer bumping 中文意思是什麼
wafer bumping
解釋
晶圓凸塊-
Lead - free solder bumping technology for wafer level package
圓片級封裝的無鉛焊料凸點製作技術研究 -
Wafer bumping technology for wlp
圓片級封裝的凸點製作技術 -
For a wafer bumping stencil, the cutting technology must be capable of producing thousands of small, closely spaced apertures to extremely tight dimensional and positional tolerances
對于晶片凸起鋼網，切割技術應能夠生產尺寸和位置要求極其嚴的好幾千小而密的孔。 -
While expensive eda tools are required for ic design, other types of equipment are also needed for other parts of the cycle, such as wafer fabrication, packaging, wafer bumping, testing, etc. currently, most hong kong ic design companies have to rely on overseas companies to perform these tasks
集成電路設計工作須要利用昂貴的電子設計自動化工具，但周期內其他環節如晶圓加工、封裝、晶圓凸塊製造、測試等，卻需要其他類型的儀器。目前香港大部分集成電路設計公司均要依賴海外公司進行有關工作。
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