wafer lapping 中文意思是什麼
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Our extensive wafer manufacturing expertise qualifies us to provide wafer sub - contract services for a wide variety of crystal materials. ingot slicing and grinding, wafer lapping and polishing are process we can provide on a sub - contract basis
我們淵博的晶圓製造專業為晶體材料同業提供多種晶圓代工服務。項目包括晶棒切割與成型、晶片研磨與拋光。 -
There exist large stress, intensive scratch, damage and pollution of ion in wafer process, so it is necessary to improve mechanism of slicing and lapping by changing single mechanical function to equilibrium chemical and mechanical function for small damage and low stress. reducing damage and stress and enhancing quality and efficiency of product result in a base of followed process so as to improve wafer process and enhance finished product ratio of whole wafer process
目前加工過程中存在應力過大，造成表面劃傷嚴重，容易產生破損，離子沾污的問題，因而必須改善切削、研磨機理，把單一的機械作用變為均勻穩定的化學機械作用，以達到淺損傷、低應力的目的，有效的減少破損層和應力的累積，提高產品質量和加工的效率。 -
Slicing and lapping are two basic procedures in wafer substrate process and are introduced firstly in this thesis
切片和研磨工序是硅器件襯底片制備中的兩道基本工序。本文首先介紹了這兩道工序。 -
Shortly followed, we successfully designed and assembled our complete " end to end " wafer production line including crystal growth, wire slicing, lapping, etching and polishing processes
緊接著即建構好銜接完整的晶圓加工生產線（由長晶、線切、研磨、拋光到超凈包裝） 。 -
Lapping lapping wafer
剛磨光晶圓 -
We effectively solve the stress of wafer process and prove the function of the new slicing slurry and lapping slurry in wafer process. research fruit is applied to manufacture
在實驗部分中我們有效地解決了矽片加工的應力問題，驗證了新型切削液和研磨液在矽片加工過程中的明顯作用，並使研究成果投入生產轉化為產品。
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