woven glass fabric 中文意思是什麼

woven glass fabric 解釋
玻璃布, 玻璃織物
  • woven : weave 的過去分詞。
  • glass : n 1 玻璃，玻璃狀物。2 〈集合詞〉玻璃製品，玻璃器具，料器；玻璃暖房 （＝glasshouse）。3 玻璃杯；一...
  • fabric : n. 1. 構造物，建築物；工廠；結構；（社會等的）組織；【地質學；地理學】組構。2. 編織品，織物；纖維品；織法；質地。adj. -able 可成型的，可塑造的。
  1. Woven glass fabric as inlay bituminous sheeting

    作瀝青路襯底的機織玻璃纖維織物
  2. Bismaleimide triazine epoxide woven glass fabric copper - clad lamimates

    雙馬來酰亞胺三嗪環氧玻璃布覆銅箔板
  3. Bismaleimide specifications - specification no. 19 - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    規范.第19號規范.製造多層印製板用的規定可燃性能的薄比斯瑪勒米德
  4. Bismaleimide base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印製電路用基材.第2部分:規范.第18號規范:規定易燃性的比斯瑪勒米德
  5. Specifications. specification no. 19. thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    規范.第19號規范:多層印製電路板構件規定的可燃性雙馬來酰亞胺三嗪改型氧化物玻璃纖維編織包銅疊層板材
  6. Base materials for printed circuits - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    印製電路用基體材料.用於多層印製板構成的限定可燃性的薄雙馬來酰亞胺三嗪改性的環氧織物玻璃纖維包銅層壓板
  7. Base materials for printed circuits. part 2 : specifications. specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 18號規范:規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板
  8. Base materials for printed circuits. part 2 : specifications - specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 18號規范.規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板
  9. . 1 base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test ; amendment 1

    印製電路用基材.第2部分:規范.第18號規范:規定易燃性的雙對馬來酰壓胺三氮雜苯改良型環氧玻璃纖維編織覆銅層壓板
  10. Polyimide woven glass fabric copper - clad laminates

    聚酰亞胺玻璃布覆銅箔板
  11. Epoxide woven glass fabric copper - clad laminates

    環氧玻璃布基覆銅箔板
  12. Ployester woven glass fabric copper - clad laminates

    聚酯玻璃布覆銅箔板
  13. Components for electronic equipment. printed circuits. woven glass fabric impregnated with expoxid resin for printed boards

    電子設備元件.印刷電路.印刷電路板用環氧樹脂浸潤的玻璃纖維織物
  14. Polyimide woven glass fabric copper - clad laminated sheet of defined flammability for printed circuits

    印製電路用限定燃燒性的覆銅箔聚酰亞胺玻璃布層壓板
  15. Thin epoxide woven glass fabric copper clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

    限定燃燒性的薄覆銅箔環氧玻璃布層壓板
  16. Thin polyimide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    多層印製電路用限定燃燒性的薄覆銅箔聚酰亞胺玻璃布層壓板
  17. Specification for metal - clad base materials for printed circuits - silicone woven glass fabric copper - clad laminated sheet si - gc - cu - 13

    印製電路板用覆箔板.第13部分:硅酮玻璃布覆銅層壓板si - gc - cu - 13
  18. Base materials for printed circuits. part 2 : specifications. specification no 4 : epoxide woven glass fabric copper - clad laminated sheet, general purpose grade

    印製電路基材.第2部分:規范.第4號規范:普通級環氧化合物編織的玻璃纖維覆銅層壓板
  19. Epoxide woven glass fabric laminated sheet

    環氧玻璃布層壓板
  20. Epoxide woven glass fabric paper copper - clad laminated sheets for printed circuits

    印製電路用覆銅箔環氧玻璃布層壓板
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