互連板 的英文怎麼說
中文拼音 [hùliánbǎn]
互連板
英文
interconnection plane-
Materials for printed boards and other interconnecting structures - reinforced base materials, clad and unclad - phenolic cellulose paper reinforced laminated sheets, economic grade, copper - clad
印製板和其它互連結構用材料.包被和非包被增強基材.酚醛纖維素紙增強銅包被經濟級疊層板Abstract : the history, characteristic, application and development of the measurement and control system buses that include measurement and control chassis backplane buses, interconnect buses between computers and measurement & control systems, and field buses are summarized
文摘:綜述了測控系統中機箱底板總線、計算機與測控系統的互連總線和現場總線的歷史、性能、應用和發展。The reverse side of a control panel, display panel, or the like ; the side with the interconnecting wiring
控制面板、顯示面板或類似的面板的反面，也就是帶有互連接線的那一面。Integrated circuit design has entered into the era of system on chip ( soc ), the bus interconnect architecture of system on board have also developed into a kind of hierarchy architecture - on chip bus ( ocb )
隨著集成電路設計進入到系統晶元（ soc ）時代，板極系統的總線互連結構也發展成為系統晶元的層次化總線體系一片上總線。The main function that the data communication board carries out is sending data under the control of industry computer to the same card in the simulation computer and also receiving data from it. through this way the two computers can communicate
該板卡分別安裝在總控計算機和模擬計算機內，由專用電纜互連，兩板之間互相發送激勵信號，使得雙方可以實現數據的通信。Followed above, this dissertation has much content about the hardware design which include dsp, fpga, ddr sdram memory bank interface circuit, pci, power circuit, board - level interconnection design. this part puts much emphasis on key circuits many of which require us to have deeply known the components adopted and involved specifications
這部分主要是對電原理圖的重要地方和需要注意的地方進行重點闡述，包括dsp 、 fpga 、 ddrsdram內存條介面電路、 pci介面電路、電源、板級互連等部分。Test methods for electrical materials, printed boards and other interconnection structures and assemblies - general test methods and methodology
印刷電路板和互連結構及附件用電氣材料的試驗方法.第1部分:一般試驗方法和方法論Test methods for electrical materials, printed boards and other interconnection structures and assemblies - part 1 : general test methods and methodology
電氣材料印刷電路板及其它互連結構和組件的試驗方法.第1部分:一般試驗方法和方法論This dissertation only considers the signal ’ s distortion by interconnect, such as delay, reflection, discontinuity of microstrip, crosstalk and simultaneous switching noise, and so on. nowadays, there are some simulation software in pcb level, but they are lack of the well ability of modeling. in order to simulate the interconnect accurately, we have to make use of three - dimension full wave analysis method, whose disadvantage is low speed in computing, but is competent for developing rules in high - speed designs
目前也有一些針對這些噪聲的高速pcb板級模擬軟體，但它們都缺乏詳盡的建模能力，特別是當頻率逐漸提高和電路板日益復雜后，更是顯得無能為力，要精確地對互連結構進行分析，三維全波模擬器似乎不可缺少，其缺點就是速度慢，對整板模擬很難實現，但非常適用於規則開發，而這正好是本文除了建模與模擬方法研究外另一個重點。Materials for printed boards and other interconnection structures - part 2 - 19 : reinforced base materials, clad and unclad ; epoxide cross - plied linear fibreglass - reinforced laminated sheets of defined flammability vertical burning test, copper clad
印製板和其它互連結構用材料.第2 - 19部分:被包和非包被增強基材料.規定燃燒性的環氧交叉簾布層線性纖維玻璃增強包銅的疊層板Materials for printed boards and other interconnecting structures - part 2 - 9 : reinforced base materials clad and unclad ; bismaleimide triazine modified epoxide or unmodified, woven e - glass reinforced laminated sheets of defined flammability vertical burning test, copper - clad
印製板和其它互連結構用材料.第2 - 9部分:包被和非包被增強基材.規定了易燃性的包銅二順丁烯二酰亞胺三嗪改良或未改良的環氧編織e型玻璃纖維增強層壓板Materials for interconnection structures - sectional specification set for reinforced base materials, clad and unclad - reinforced base materials clad and unclad - bismaleimide triazine, modified epoxide or unmodified, woven e - glass reinforced laminated sheets of defined flammability vertical burning test, copper - clad
互連結構用材料.包被和非包被增強基材分規范.包被和非包被增強基材.規定了易燃性的包銅二順丁烯二酰亞胺三嗪改良或未改良的環氧編織e型玻璃纖維增強層壓板Here use cadence ' s allegro interconnection design platform to design sft optical transceiver circuit
對于sfp光收發模塊電路板的設計，文中採用cadence軟體的allegro互連設計平臺進行設計。The plates are bounded by an interconnected network of ridges, transform faults, and trenches
板塊以一個由洋中脊、轉換斷層和海溝相互連接形成的網路為界。Does supplier have the ability to develop hdi or microvia process
供應商是否有能力提供高密度互連和微盲孔板的製造能力？Materials for interconnection structures - sectional specification set for reinforced base materials, clad and unclad - epoxide cross - plied linear fibreglass - reinforced laminated sheets of defined flammability vertical burning test copper clad
互連結構用材料.包層和非包層的增強的基材分規范.規定了易燃性的環氧斜交簾布層的線性纖維玻璃增強的包銅的疊層板Materials for printed boards and other interconnecting structures - part 2 - 19 : reinforced base materials, clad and unclad - epoxide cross - plied linear fibreglass - reinforced laminated sheets of defined flammability vertical burning test, copper clad
印製板和其它互連結構用材料.第2 - 19部分:包覆和不包覆增強基材.規定易燃性的環氧交叉簾布層線性纖維玻璃增強包銅層壓板Materials for interconnection structures - sectional specification set for reinforced base materials, clad and unclad - epoxide woven e - glass laminated sheet of defined flammability vertical burning test, copper - clad
互連結構件的材料.包層和非包層加強的基體材料的分規范.銅包層的環氧化物編織的e -玻璃疊層薄板材Materials for printed boards and other interconnecting structures - part 2 - 7 : reinforced base materials clad and unclad - epoxide woven e - glass laminated sheet of defined flammability vertical burning test, copper - clad
印製電路板和其它互連結構件用材料.第2 - 7部分:包覆和非包覆的增強基材.規定易燃性的環氧編織e型玻璃纖維層壓包銅薄板材All parts of the apparatus were welded in each transparent plastics box, and these boxes can be expediently inserted or pulled out of the scaleboard ; on the scaleboard, the nine eyelets combined with the " 田 " are connected, they can be used as a node when we do experiments
元器件焊裝在透明塑料盒內，盒與底板可以方便地插拔連接；底板上以「田」字組成的九個小孔內部相互連通，實驗時可以成為電路中的一個結點。分享友人