互連薄膜 的英文怎麼說
中文拼音 [hùliánbómó]
互連薄膜
英文
interconnection film-
Cr / cu / cr film has been widely used in mcm - d
Cr cu cr是目前常用薄膜互連結構。The results indicate the stress of copper interconnects generates in the metallization and the thermal stress caused by thermal mismatch during the damascene process is the main stress. the thermal stress distribution in copper interconnects has been simulated by the finite element analysis software with the different trench structures
對測量結果的分析得出金屬薄膜的淀積是造成銅互連線中應力的主要原因，熱應力在銅互連線應力中占較大比例，熱處理后銅互連線中應力減小。Studies on the stress of copper interconnects include the stress measurement by xrd, computer simulation and observation the local stress distribution with snam
利用薄膜應力測試分佈儀和xrd測量硅基銅膜及銅互連線薄膜宏觀應力。Materials for interconnection structures - part 8 : sectional specification set for non - conductive films and coatings - section 7 : marking legend inks
互連接裝置用材料.第8部分:非導電薄膜和塗層裝置分規范.第7節:列印油墨Consequently, the metal interconnects of vlsi have smaller sectional area and carry increasing power density, which made the electromigration become one of the main latent damage modes
作為vlsi互連線的金屬薄膜的截面積越來越小，其承受的功率密度急劇增加，使得電遷移成為電路的主要失效模式之一。Studies on the microstructure of copper interconnects include the determination of grain size by afm and sem, the measurement of texture by xrd and ebsd, the evaluation of barriers by xps and aes
銅互連線的微觀結構的研究：通過afm 、 sem 、 tem等的分析方法對銅膜及銅互連線薄膜的晶粒尺寸進行了評價。The results show the grain size becomes larger along with elevated temperature and the grain size in interconnects does not change evidently after annealed at 200 ? because of the effect of the trench structure
結果顯示熱處理后銅膜晶粒長大，但銅互連線薄膜由於溝槽結構對晶粒的長大有阻礙作用。利用xrd和ebsd測試方法對銅膜及銅互連線薄膜的織構進行評價。Materials for interconnection structures - part 8 : sectional specification set for non - conductive films and coatings - section 8 : temporary polymer coatings
互連結構材料.第8部分:不導電薄膜和塗層分規范集.第8節:非永久高聚物塗層Theoretical calculation on the mechanical characterization of ulsi two - layer interconnect films by surface acoustic waves
互連布線雙層薄膜機械特性的理論計算Materials for interconnection structures - sectional specification set for non - conductive films and coatings - marking legend inks
互連接結構用材料.不導電薄膜和塗層分規范.列印油墨Materials for interconnection structures. part 8 : sectional specification set for non conductive films and coatings. section 7 : marking legend links
互連結構用材料.第8部分:非導電薄膜和塗層的分規范集.第7節:標記圖例鏈路Materials for interconnection structures. part 8 : sectional specification set for non - conductive films and coatings. section 8 : temporary polymer coatings
互連結構用材料.第8部分:不導電薄膜和塗層用分規范集.第8節:暫時性聚合物塗層Materials for interconnection structures. part 5 : sectional specification set for conductive foils and films with or without coatings. section 4 : conductive inks
互連結構用材料.第5部分:有塗層或無塗層的導電箔和薄膜的分規范集.第4節:導電油墨Materials for interconnection structures. part 5 : sectional specification set for conductive foils and films with and without coatings. section 1 : copper foils for the manufacture of copper - clad base materials
互連結構用材料.第5部分:有塗層和無塗層的導電箔和薄膜的分規范集.第1節:銅箔Materials for interconnection structures - part 8 : sectional specification set for non - conductive films and coatings ; section 8 : temporary polymer coatings iec 61249 - 8 - 8 : 1997 ; german version en 61249 - 8 - 8 : 1997
互連結構用材料.第8部分:非導電薄膜和塗層分規范集分享友人