互連結構 的英文怎麼說

中文拼音 [hùliánjiēgòu]
互連結構 英文
interconnection structure
  • 互 : 代詞（相互;彼此） each other; mutual
  • 連 : Ⅰ動詞1 （連接） link; join; connect 2 （連累） involve （in trouble）; implicate 3 [方言] （縫） ...
  • 結 : 結動詞（長出果實或種子） bear （fruit）; form （seed）
  • 構 : Ⅰ動詞1 （構造; 組合） construct; form; compose 2 （結成） fabricate; make up 3 （建造; 架屋） bui...
  • 結構 : 1 （各組成部分的搭配形式） structure; composition; construction; formation; constitution; fabric;...
  1. Materials for interconnection structures. part 7 : sectional specification set for restraining core materials. section 1 : copper invar coper

    互連結構用材料.第7部分:限制芯材料用分規范集.第1節:銅殷鋼銅
  2. Cr / cu / cr film has been widely used in mcm - d

    Cr cu cr是目前常用薄膜互連結構。
  3. Materials for printed boards and other interconnecting structures - reinforced base materials, clad and unclad - phenolic cellulose paper reinforced laminated sheets, economic grade, copper - clad

    印製板和其它互連結構用材料.包被和非包被增強基材.酚醛纖維素紙增強銅包被經濟級疊層板
  4. Integrated circuit design has entered into the era of system on chip ( soc ), the bus interconnect architecture of system on board have also developed into a kind of hierarchy architecture - on chip bus ( ocb )

    隨著集成電路設計進入到系統晶元（ soc ）時代，板極系統的總線互連結構也發展成為系統晶元的層次化總線體系一片上總線。
  5. Test methods for electrical materials, interconnection structures and assemblies - part 1 : general test methods and methodology

    電氣材料互連結構和組裝件的試驗方法.第1部分:一般試驗方法和分類法
  6. Test methods for electrical materials, interconnection structures and assemblies - part 3 : test methods for interconnection structures printed boards

    電氣材料互連結構和部件的試驗方法.第3部分:互連結構的試驗方法
  7. Test methods for electrical materials, interconnection structures and assemblies - part 1 : general test methods and methodology ; amendment 1

    電氣材料互連結構和組裝件的試驗方法.第1部分:一般試驗方法和分類法.修改件1
  8. Test methods for electrical materials, interconnection structures and assemblies - part 2 : test method for materials for interconnection structures

    電氣材料互連結構和組件的試驗方法.第2部分:互連結構用材料的試驗方法
  9. Test methods for electrical materials, interconnection structures and assemblies - part 2 : test methods for materials for interconnection structures

    互連結構和附件用電氣材料的試驗方法.第2部分:互連結構用材料的試驗方法
  10. Test methods for electrical materials, printed boards and other interconnection structures and assemblies - general test methods and methodology

    印刷電路板和互連結構及附件用電氣材料的試驗方法.第1部分:一般試驗方法和方法論
  11. Test methods for electrical materials, printed boards and other interconnection structures and assemblies - part 1 : general test methods and methodology

    電氣材料印刷電路板及其它互連結構和組件的試驗方法.第1部分:一般試驗方法和方法論
  12. Test methods for electrical materials, interconnection structures and assemblies - part 2 : test methods for materials for interconnection structures ; amendment 1

    互連結構和附件用電氣材料的試驗方法.第2部分:互連結構用材料的試驗方法.修改件1
  13. This dissertation only considers the signal ’ s distortion by interconnect, such as delay, reflection, discontinuity of microstrip, crosstalk and simultaneous switching noise, and so on. nowadays, there are some simulation software in pcb level, but they are lack of the well ability of modeling. in order to simulate the interconnect accurately, we have to make use of three - dimension full wave analysis method, whose disadvantage is low speed in computing, but is competent for developing rules in high - speed designs

    目前也有一些針對這些噪聲的高速pcb板級模擬軟體，但它們都缺乏詳盡的建模能力，特別是當頻率逐漸提高和電路板日益復雜后，更是顯得無能為力，要精確地對互連結構進行分析，三維全波模擬器似乎不可缺少，其缺點就是速度慢，對整板模擬很難實現，但非常適用於規則開發，而這正好是本文除了建模與模擬方法研究外另一個重點。
  14. Materials for printed boards and other interconnection structures - part 2 - 19 : reinforced base materials, clad and unclad ; epoxide cross - plied linear fibreglass - reinforced laminated sheets of defined flammability vertical burning test, copper clad

    印製板和其它互連結構用材料.第2 - 19部分:被包和非包被增強基材料.規定燃燒性的環氧交叉簾布層線性纖維玻璃增強包銅的疊層板
  15. Materials for interconnection structures - part 8 : sectional specification set for non - conductive films and coatings - section 8 : temporary polymer coatings

    互連結構材料.第8部分:不導電薄膜和塗層分規范集.第8節:非永久高聚物塗層
  16. Materials for printed boards and other interconnecting structures - part 2 - 9 : reinforced base materials clad and unclad ; bismaleimide triazine modified epoxide or unmodified, woven e - glass reinforced laminated sheets of defined flammability vertical burning test, copper - clad

    印製板和其它互連結構用材料.第2 - 9部分:包被和非包被增強基材.規定了易燃性的包銅二順丁烯二酰亞胺三嗪改良或未改良的環氧編織e型玻璃纖維增強層壓板
  17. Materials for interconnection structures - sectional specification set for reinforced base materials, clad and unclad - reinforced base materials clad and unclad - bismaleimide triazine, modified epoxide or unmodified, woven e - glass reinforced laminated sheets of defined flammability vertical burning test, copper - clad

    互連結構用材料.包被和非包被增強基材分規范.包被和非包被增強基材.規定了易燃性的包銅二順丁烯二酰亞胺三嗪改良或未改良的環氧編織e型玻璃纖維增強層壓板
  18. Materials for interconnection structures - sectional specification set for reinforced base materials, clad and unclad - epoxide cross - plied linear fibreglass - reinforced laminated sheets of defined flammability vertical burning test copper clad

    互連結構用材料.包層和非包層的增強的基材分規范.規定了易燃性的環氧斜交簾布層的線性纖維玻璃增強的包銅的疊層板
  19. Materials for printed boards and other interconnecting structures - part 2 - 19 : reinforced base materials, clad and unclad - epoxide cross - plied linear fibreglass - reinforced laminated sheets of defined flammability vertical burning test, copper clad

    印製板和其它互連結構用材料.第2 - 19部分:包覆和不包覆增強基材.規定易燃性的環氧交叉簾布層線性纖維玻璃增強包銅層壓板
  20. Materials for interconnection structures - sectional specification set for reinforced base materials, clad and unclad - epoxide woven e - glass laminated sheet of defined flammability vertical burning test, copper - clad

    互連結構件的材料.包層和非包層加強的基體材料的分規范.銅包層的環氧化物編織的e -玻璃疊層薄板材
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