晶元加工 的英文怎麼說

中文拼音 [jīngyuánjiāgōng]
晶元加工 英文
wafer back grinding
  • 晶 : Ⅰ形容詞（光亮） brilliant; glittering Ⅱ名詞1. （水晶） quartz; （rock） crystal 2. （晶體） any crystalline substance
  • 工 : Ⅰ名詞1 （工人和工人階級） worker; workman; the working class 2 （工作; 生產勞動） work; labour 3 ...
  1. This paper mainly aims at the characteristics of the hardware and software structure of the parallel computer on satellite, and has fulfilled researches of fault tolerant technique in three aspects of control theories and engineering : the first research of the system level fault - tolerant module is based on the system structure of the parallel computer on satellite, a kind of cold backup module and a kind of hot backup module for multiprocessor computer have been put forward. then the research of software fault tolerant technique which is based on the operate system named rtems has been carried, the mission level fault - tolerate arithmetic and the system level fault - tolerate mechanism and strategies based on the check point technique have been put forward, at the same time the self - repair technique of software which has used the technique of system re - inject has been studied. finally the technique of components level fault - tolerant based on fpga has been studied, a kind of two level fault - tolerant project which aims at the fault - tolerant module of the parallel computer on satellite has been put forward, and the augmentative of circuit that project design realization need is little, this project can avoid any breakdown of any part logic circuit of the fpga

    本課題主要針對星載并行計算機體系結構及軟體結構的特點，從如下三個方面進行了容錯控制理論研究和實踐工作:首先進行了基於星載多cpu并行計算機體系結構的系統級容錯模型研究，提出了一種多cpu冷備份容錯模型和一種多cpu熱備份容錯模型;然後進行了基於rtems操作系統的軟體容錯技術研究，提出了任務級容錯調度演算法以及基於檢查點技術的系統級容錯恢復機制和策略，同時研究了利用系統重注入進行軟體在線自修復的容錯技術;最後研究了基於fpga的部件級容錯技術，提出了對容錯模塊這一星載并行計算機關鍵部件的兩級容錯方案，實現該方案所需增加的電路少，可避免板級晶元以及fpga晶元內部任何邏輯發生單點故障。
  2. Although rose quartz is usually too cloudy to be used as a cut gemstone, a few exceptional pieces are found with enough clarity and color to make fine gems. most gemmy rose quartz is used as cabochons where the clarity is not as important as the color. rose quartz is also a very attractive ornamental stone and is carved into popular spheres, pyramids, obelisks, figurines and ornate statues

    粉晶原礦大多為塊狀，產于各地偉晶巖中，生長在上層的質地比較好，粉晶的質地易脆，因內含有微量的胎元素而形成粉紅色，如果長時間接受陽光爆曬會失去原有的嬌嫩色澤，常見的人工加工方式是染色，透明度由不透到半透至全透明的都有，非常清澈明亮的天然晶體，我們稱之為星光粉晶。
  3. India - born n. damodar reddy ' s tiny california company reopened an at & t chip plant in kansas city last spring with financing from the state of missouri

    印度出生的n .達莫達.雷迪經營的小小的加州公司在堪薩斯城重新啟用了美國電話電報公司的一家晶元工廠，並從密蘇里州獲取了財政上的支持。
  4. Waxes for electron wafer binding : waxes for electron wafer binding, mainly used in precision process of micro electron wafer ( u piece, s piece or smd piece ), excellent strong adhesive ability, no scathe to element, cleanup easily after process

    電子晶片粘接蠟系列：主要用於微電子矽片或石英晶片（ u片、 s片或smd片）的精密加工，具有極強的附著力，對元件無任何損傷，使用后易去除。
  5. Pcb copies board pcb to design pcb layout chip is deciphered the bom detailed manufacture schematic diagram instead to push the prototypical debugging processing end product quantity to producecircuit - tech electronic

    Pcb抄板pcb設計pcb layout晶元解密bom清單製作原理圖反推樣機調試加工成品量產深科特電子
  6. Shenzhen circuit - tech electronic co., ltdpcb copies board pcb to design pcb layout chip is deciphered the bom detailed manufacture schematic diagram instead to push the prototypical debugging processing end product quantity to produce

    深圳市深科特電子技術有限公司pcb抄板pcb設計pcb layout晶元解密bom清單製作原理圖反推樣機調試加工成品量產
  7. In order to make the sensitivity of 2 - demension accelerometer along the two main arbors almost identical, symmetric four - beam structure that embeds a double - sides interdigitated differential capacitive with puckered beam in two directions was used as sensitive component. in addition, the differential capacitive accelerometer fabricated by bulky silicon micromechanical technique has high sensitivity, wide measurement scope, less nonlinear error, and simple converting circuit. then, the structure parameters of the sensitive component were calculated and stimulated, which results in a set of the optimized structure design parameters, main fabrication procedure and several key fabrication technology

    為使二維振動傳感器在兩主軸方向的靈敏度大致相同，敏感元件採用高度對稱的四梁結構，其中每個軸向上均採用帶折疊梁的雙側叉指電容結構，採用體硅微機械工藝製作的高深寬比叉指電容式敏感元件，具有高靈敏度、寬量程、非線性誤差小、外圍電路簡單等優點;對設計的敏感元件結構參數進行了計算，並利用有限元法進行了模擬分析，根據模擬結果得出了優化參數;在確定敏感結構的基礎上，研究了敏感元件採用體硅微機械加工工藝製作的工藝流程和關鍵工藝技術;對敏感晶元內部的c - v介面電路進行了原理設計與分析，利用差動測量技術得到由振動引起的微小電容變化量，經c - v介面電路進行相位調制處理，然後通過解調輸出與加速度成正比的電壓信號。
  8. Ningbo foryard optoelectronics co., ltd. is a manufacturer specialized in led area in china, located in ningbo jiangdong hi - tech park

    寧波復洋光電有限公司生產的led顯示屏，採用高品質的led原材料及晶元，利用先進的生產加工工藝，確保了產品的可靠性。
  9. Transient ablation model for laser machining polymer microfluidic chip

    激光加工聚合物微流控晶元暫態燒蝕模型研究
  10. The electrophoretic microchip fabricated by mems technology is successfully used to finish the electrophoresis process

    摘要微晶元電泳是基於微機電加工技木（ mems ）工藝，在晶元上的微管道中完成電泳檢測過程的新型技術。
  11. A mixture of three amino acids ( arg, gly, glu ) labeled with fluorescein isothiocyanate ( fitc ) was separated in pdms microfluidic chip, the separation voltage is 200v / cm, the separation time is less than 120 seconds ; according to ccd fluorescence images, two distinct physical processes - stacking and destacking during sample injection were studied qualitatively ; rhodamine b, a kind of temperature - dependent fluorescence dye, was used as probe to develop a temperature - fluorescence intensity equation, then temperature - color map in microchannels was constructed, and temperature trait in microchannels on the pdms microfluidic chip was analysed. according to the results, we conclude that the electric field applied to the pdms microfluidic chip should not exceed 400v / cm

    利用pdms微流控晶元對fitc標記的精氨酸、甘氨酸、谷氨酸混合物進行了電泳分離，分離電壓為200v cm ，分離時間不到120秒；通過拍到的熒光顯微圖像對電泳注樣過程中復雜的樣品分子積聚與解聚現象作定性的分析；以熒光染料rhodamineb為溫度熒光探針，建立了pdms微流控晶元上的溫度-熒光強度的關系公式，並利用matlab圖像處理工具箱構建出微流體溝道內的溫度色圖，對pdms微流控晶元的微流道溫度特性進行了分析，根據實驗結果，我們認為對于pdms微流控晶元來說，在進行需要外加電場作用的試驗時，外加電場不應超過400v cm 。
  12. Mainly for capacitance, semiconductor, jingzhen, resistance, ic chips, jiechajian procedures, connecting pieces, switching devices, silicon, triode, diode, piezoelectric ceramic base films, tubes, electron tubes, electronic stamping, precision metal parts, production processes between cleansing processes

    晶元接插件連接件轉接器矽片三極體二極體壓電陶瓷基片顯象管電真空器件等內精密電子沖壓五金零件，生產加工過程工序間的清洗。
  13. Our company can offer pcb to the masses of customers and copy the board, change board, pcb design, principle picture make, bom from make, chip decipher and pcb produce, stick to scenes of processing a connected sequence. our aim : " quality first, the customer is the highest " we will do the best service for you with the biggest cordiality in any demand of yours, expect to cooperate, with you sincerely

    我司可為廣大客戶提供pcb抄板改板pcb設計原理圖製作bom單製作晶元解密以及pcb生產貼片加工一條服務。我們的宗旨： 「質量第一，客戶至上」您的任何需求我們都將以最大的熱誠為您做最好的服務，真誠期待與您合作。
  14. According to the request of this subject, we have developed the system hardware and software for the slave device and the inspection software running on the pc. in this paper all of the followings is illustrated detailedly, such as the research on the principles of measurement and its realization, three means of water - level measurement that are separately based on photo electricity coder, pressure sensor and potentiometer ; selection of the microchip, we choose an advanced integrated soc ( system on chip ) microchip c8051f021 as the main controller ; realization of signal sampling, processing and its conversion in the mcu ; application of high precision 16 bits adc cmos chip - - ad7705 in our system, designing its interface with the microchip and relevant program ; using a trickle charge timekeeping chip ds1302 in the system which can provide time norm and designing of its i / o interface and program ; additionally, a 4 ~ 20ma current output channel to provide system check - up using ad421. in the system, ad421, ad7705 and the microchip compose spi bus ; to communicate with the master pc, here we use two ways which are separately rs232 and rs485 ; moreover, there are alarm unit, keyboard unit, power supply inspection unit and voltage norm providing unit in the system

    針對研製任務的要求，課題期間研製了下位機系統硬體和軟體，開發了上位機監控軟體，其中所作的具體工作包括：測量原理的研究和在系統中的實現，在本次設計中用三種方法來進行水位測量，分別是旋轉編碼器法、液位壓力傳感器法和可變電阻器法；主控晶元的選擇，我們選用了高集成度的混合信號系統級晶元c8051f021 ；實現了信號的採集和處理，包括信號的轉換和在單片機內的運算；高集成度16位模數轉換晶元ad7705在系統中的應用，我們完成了它與單片機的介面設計及程序編制任務；精確時鐘晶元ds1302在系統中的應用，在此，我們實現了用單片機的i o口與ds1302的連接和在軟體中對時序的模擬，該晶元的應用給整臺儀器提供了時間基準，方便了儀器的使用；另外，針對研製任務的要求，還給系統加上了一路4 20ma模擬信號電流環的輸出電路來提供系統監測，該部分的實現是通過採用ad421晶元來完成的，本設計中完成了ad421與單片機的spi介面任務，協調了它與ad7705晶元和單片機共同構成的spi總線系統的關系，並完成了程序設計；與上位機的通信介面設計，該部分通過兩種方法實現： rs232通信方式和rs485通信方式；系統設計方面還包括報警電路設計、操作鍵盤設計、電源監控電路設計、電壓基準電路的設計。
  15. Finite element method ( fem ) was used to simulate thermal and vibration problems in stacked - die csp assembly. finite element models and apdl programes were built in ansys to conduct thermal, thermal - mechanical and vibration analysis. the aim of these researches were trying to find some possible reasons and trends which affect the reliability of stacked csp / bga assembly and give some useful suggestions for the packaging design

    本論文正是針對以上情況，以採用引線鍵合工藝的三維疊層csp / bga封裝（裸晶元疊裝）為研究對象，在有限元分析軟體ansys中建立相關的有限元模型，編制了相應的apdl參數化分析程序，進行了溫度場分析、熱循環加載下的snpb合金焊點疲勞分析和實裝pcb板的振動模態分析。
  16. So in one hand it requires the wafer ' s diameter to be more large in order to enhance the productivity, and on the other hand it puts forward more strict requirement about the crystal perfection and electricity character. especially the electronic character and the equality of micro - area in the crystal wafer has become the key factor to determine whether the device can be made on it or not. so the resistivity measurement of micro - area become one most important procedure in the chip machining. to ensure the produce quality of chip and the perfect performance of final production, the four - probe testing technology need to be deeply studied

    圖形日益微細化，電路尺寸不斷縮小，目前ic製造以8英寸、 0 . 13 m為主，預計在2007年左右將以12英寸、 65nm為主，這一方面要求圓片直徑不斷增大以提高生產率，另一方面對晶體的完美性、機械及電特性也提出了更為嚴格的要求。特別是微區的電學特性及其均勻性已經成為決定將來器件性能優劣的關鍵因素。因此，微區電阻率的測試成為晶元加工之中的重要工序。
  17. In chapter 3, the mechanism, static and dynamic characters of the piezoresistive accelerometer with the double thin plates - mass. and the simulation of ansys was used for the optimal design of this sensor and obtained the parameters of the structure

    第三章詳細論述了具有雙薄板梁島結構的壓阻式加速度傳感器晶元的工作原理、分析了器件的靜態、動態特性，用ansys模擬並進行了優化設計，在此基礎上確定了傳感器的結構參數。
  18. Singapore ( afp ) - asia ' s chip foundries are making a strong comeback in 2004 after three lean years as demand for electronic products booms and semiconductor makers increasingly outsource production, analysts said

    分析家稱，在經歷了三年「困難時期「后，旺盛的電子產品需求及半導體生產商日益增加的外包趨勢將讓亞洲今年的晶元代工業強勁反彈。
  19. About fluoropolymers : fluoropolymers are used in architectural fabrics ; chemical processing piping and vessels ; automotive fuel systems ; telecommunications and electronic wiring insulation ; and computer chip processing equipment and systems - in addition to consumer products such as cookware and apparel

    有關氟聚合物：氟聚合物除了應用在炊具和服裝等消費產品上，也用於建築構造、化學工藝管道、汽車燃油系統、電訊及電子絕緣線圈，以及計算機晶元加工設備和系統中。
  20. After processing, the cell parameter, transparency, optical damage threshold of ktp crystal have been measured as well as the distribution coefficient of doped elements. the results showed that, after dopping, the cell parameter and transparency of ktp crystal changed little ; optical damage threshold increased three orders of magnitude than the common flux ktp, meanwhile, optical homogeneity decresed a little

    將ktp晶體加工后測試了它們的晶胞參數、透過率、光損傷閾值、摻雜元素分凝系數等，結果表明，經過摻雜的ktp晶體晶胞參數、透過率等基本沒有變化，光學均勻性稍有下降，而激光損傷閾值卻提高了3倍。
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