晶元組 的英文怎麼說

中文拼音 [jīngyuánzǔ]
晶元組 英文
almador almador
  • 晶 : Ⅰ形容詞（光亮） brilliant; glittering Ⅱ名詞1. （水晶） quartz; （rock） crystal 2. （晶體） any crystalline substance
  • 組 : Ⅰ名詞1 （由不多的人員組成的單位） group 2 （姓氏） a surname Ⅱ動詞（組織） organize; form Ⅲ量詞（...
  1. Nokia will use four chipset suppliers ? texas instruments, broadcom, infineon technologies and stmicroelectronics. chipsets are combinations of integrated circuits that operate together

    諾基亞公司將與四家晶元供應商合作，它們是德州儀器、博通、英飛凌科技公司和意法半導體。晶元組是在一組集成電路的組合。
  2. What is needed at a bare minimum to make sure your card works is a brooktree conexant bt8x8 series chipset in the video capture card

    要確保視頻捕捉卡能夠工作，至少要求其中有brooktree / conexant bt8x8系列晶元組。
  3. These other boards can ben cpu boards or peripheral boards providing various functions. the vmebus standard originated with the motorola versabus in 1979 which was designed using the then new mc68000 microprocessor

    系統總線吞吐率的優化：其他的晶元組對pci到內存帶寬只能到70mbs ， powerplusii則能達到80mbs而無須消耗額外的cpu資源。
  4. Vmebus boards have data bus sizes of 16, 32, or 64 bits and are designed to be plugged into a backplane that has up to 21 slots for other boards. these other boards can ben cpu boards or peripheral boards providing various functions. the vmebus standard originated with the motorola versabus in 1979 which was designed using the then new mc68000 microprocessor

    性能的提高主要是由於三個方面的改進： 1 .處理器及高速緩存性能的優化2 .降低內存瓶頸：通過對powerplus體系結構的改進，使內存性能提高到582mb s memory read bandwidth和640mb s burst write bandwidth 3 .系統總線吞吐率的優化：其他的晶元組對pci到內存帶寬只能到70mb s ， powerplus ii則能達到80mb s而無須消耗額外的cpu資源。
  5. In this paper the applications of diamond material to mcm to improve thermal characteristics and thermal stress problem are studied

    本文研究了金剛石材料在多晶元組件中熱特性改善和熱應力問題。
  6. Results in the paper will supply references to thermal designs of multi - chip module packaging based on diamond material

    本文對金剛石材料在多晶元組件熱性能改善和熱應力研究，對金剛石在多晶元組件封裝熱設計應用具有一定的參考價值和提供一定的理論依據。
  7. 3, the output linear resolution of the bridge is about to 0. 84 % and has a better property in comparison of some typical mr angular sensors. 4, the output sensitivity of the bridge is about 1. 0667mv / and better than ferrimag angular sensors

    4 ，該自旋閥晶元組成的橋路輸出的靈敏度達到了1 . 0667mv ，相對于強磁性薄膜為敏感元件的角度傳感器有了很大的提高。
  8. It also explains the importance of system software research. analyzing and comparing two kinds of hardware architectures and two kinds of operation system, we choose the fit hardware architecture and the fit operation system for the chosen hardware

    通過對兩種硬體架構、兩種操作系統的特點進行分析比較，選擇了適合ip機頂盒的硬體平臺與核心軟體? ?操作系統，並介紹了所選擇的硬體平臺的晶元組及外圍器件。
  9. Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built, thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built, and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip

    本文根據實際的多晶元組件的封裝結構，建立了三維溫度場分析模型，分析了金剛石作為導熱層和基板對多晶元組件散熱性能的改善;建立了二維和三維的晶元-粘結層-基板熱力學模型，分析了不同的基板/晶元厚度比和面積比對層間熱應力分佈的影響。
  10. 6, we got the data of noise and magnetic lag in spin - valve gmr and also gives some resolutions in applications. the results show that the spin - valve gmr chip will has a better output waveform when it ' s filtered

    6 ，得到了自旋閥gmr的噪聲和磁滯特性數據，提出了一些解決的方法，實驗表明對自旋閥晶元組成的橋路初始輸出進行濾波可以得到較好的輸出波形。
  11. With the rapid development of integrate circuit and electronic products various packaging modes and packaging technologies are developed. multi - chip module ( mcm ) packaging technologies rapidly develop because of it ’ s characteristic of improving frequency and increasing transmission speed and so on

    多晶元組件（ multi - chipmodule即mcm ）封裝技術因組裝密度高，改善了頻率特性和傳輸速度等一系列優點獲得了迅速發展。
  12. Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density

    多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。
  13. 2, design a structure makes the liner output higher to 160mv with a liner input about 150 in bridge of spin - valve gmr. in comparison of some typical mr angular sensors it ' s output make a great progress

    2 ，設計了一種結構使自旋閥gmr晶元組成的橋路輸出電壓信號線性區達到約150 ，輸出幅度達到了160mv ；相比一些典型的磁阻非接觸式角度傳感器，量程獲得了可觀的擴展。
  14. Download now if your computer has a chipset that contains a pci to pci bridge connecting to a docking solution that also contains a pci to pci bridge

    如果您的計算機裝有晶元組，而且該晶元組所包含的pci到pci連接橋連接到也包含pci到pci連接橋的底座解決方案，那麼請立即下載此更新。
  15. This update applies to windows 2000 sp3 - based computers with chipsets containing a pci to pci bridge connecting to a docking solution that also contains a pci to pci bridge

    此更新適用於基於windows 2000 sp3的帶有晶元組的計算機，這些晶元組所包含的pci到pci連接橋連接到也包含pci到pci連接橋的底座解決方案。
  16. And designed a program used by this method to design a filter. the result complies with the analytic result. at the end of this paper, according to the project of airline broadcast, the author designd filter with high rectangular factor, five channelizing filter banks, saw programmable correlator implemented with multiplayer muti - chip technology, saw resonator

    本文的最後，結合某航空直擴數傳電臺的工程要求，設計了高矩形系數的前置濾波器、聲表面波濾波器組、採用多晶元組裝厚膜工藝技術的聲表面波可編程相關器和聲表面波壓控振蕩器，完成了解調解擴單元的硬體設計。
  17. If a device supports, for instance, both gsm and bluetooth, the pcm lines from the gsm chipset might be directly wired to the bluetooth chip s pcm audio lines

    例如，如果設備同時支持gsm和bluetooth ， gsm晶元組的pcm線路可以直接與bluetooth晶元的pcm音頻線路連接。
  18. In this paper outlining the characteristics of diamond substrate and problems to be faced with, and measures to be taken, introducing knowledge of multi - chips modules packaging

    本文首先綜述了熱沉用金剛石基板的特點和面臨的問題及相應的措施;並介紹了多晶元組件封裝技術相關知識。
  19. This paper goes on with analysis of the phased array radar calibration theory and compare of different schemes, then the best is adopted. 2 mhz digital circuit mainly composed of dds ( direct digital synthesis ) chip, which carries out the shift of the phase and the limit of the amplitude, has been designed and debugged successfully. it is used to substitute for the conventional phased shift circuit and amplitude limiting circuit which work at the radio frequency, so the all - digital transmit channel of phased shift array radar is achieved

    本論文研究的重點是：針對傳統相控陣雷達系統收發（ t r ）組件中的移相和限幅功能均在射頻段完成，大膽利用直接數字合成（ dds ）晶元組成頻率在2mhz左右的數字電路代替傳統相控陣雷達在射頻段進行移相和限幅的電路，從而組成全數字發射通道，使對相位和幅度的控制和調試更方便快捷，並設計具體的電路驗證此方案的可行性。
  20. Supports a variety of cards based on the prism chipset

    支持多種基於prism晶元組的卡。
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