液相濺射法 的英文怎麼說

中文拼音 [xiāngjiànshè]
液相濺射法 英文
liquid-phase sputtering
  • : 名詞(液體) liquid; fluid; juice
  • : 相Ⅰ名詞1 (相貌; 外貌) looks; appearance 2 (坐、立等的姿態) bearing; posture 3 [物理學] (相位...
  • : 動詞(液體受沖擊向四外射出) splash; spatter
  • : Ⅰ動詞1 (用推力或彈力送出) shoot; fire 2 (液體受到壓力迅速擠出) discharge in a jet 3 (放出) ...
  • : Ⅰ名詞1 (由國家制定或認可的行為規則的總稱) law 2 (方法; 方式) way; method; mode; means 3 (標...
  1. Copper has been deposited on surface of the al mmcs as interlayer by magnetron sputtering, tlp bonding of al mmcs with these interlays, the joints shear strength of tlp bonding using deposited film was as much as the joint shear strength of tlp bonding using cu foil. removing the oxidation on the surface before deposition, copper was coated by magnetron sputtering as tlp bonding interlayer

    待連接表面通過磁控沉積銅膜作為中間層進行瞬間連接,得到的接頭強度與銅箔中間層進行瞬間連接得到的接頭強度當,而使用磁控去除待連接表面氧化膜后沉積銅膜作為中間層進行瞬間連接的接頭強度提高7 . 6左右。
  2. With the development of thin film science and technology, various thin film preparation techniques developed rapidly, as a result, conventional so - called filming has developed from single vacuum evaporation to many new film preparation techniques, such as ion plating, sputtering, laser deposition, cvd, pecvd, mocvd, mbe, liquid growth, microwave and mtwecr, etc., of which vacuum evaporation is the common technology for thin film preparation, because it has the distinct advantage of high quality of film deposition, good control - ability of deposition rate and high versatility

    隨著薄膜科學與技術的發展,各種薄膜制備方得到了迅速發展,傳統的所謂鍍膜,已從單一的真空蒸發發展到包括蒸鍍、離子鍍、鍍膜、化學氣沉積( cvd ) 、 pecvd 、 mocvd 、分子束外延( mbe ) 、生長、微波及微波電子共旋( mwecr )等在內的成膜技術。其中電子束蒸發技術是一種常用的薄膜制備技術,它具有成膜質量高,速率可控性好,通用性強等優點。
  3. It ' s the first time to deposit copper film on surface of al mmcs by magnetron sputtering, and embed al mmcs into the sputtering region of al target

    本文首次提出使用磁控制備瞬間連接的中間層。一種是直接沉積,另一種是去除氧化膜再沉積
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