滑動裂紋 的英文怎麼說

中文拼音 [dònglièwén]
滑動裂紋 英文
slicrack
  • : Ⅰ形容詞1 (光滑; 滑溜) slippery; smooth 2 (油滑; 狡詐) cunning; crafty; slippery Ⅱ動詞(貼著物...
  • : 裂動詞[方言] (東西的兩部分向兩旁分開) open
  • : 名詞(花紋; 紋縷兒) lines; veins; grain
  • 滑動 : slither; slippage; slipping; slide; sliding; run; sliding movement [motion]; glide; slump滑動閘門...
  1. There are typical laminated structure, soft sedimentary - slipping deformed structure, syngenetic brecciated structure in the ore which are the mirror of syngenetic sedimentation. the other type of ore has the charactristic of epigenetic mineralization, which is called as telescoped ore. the ore occurs in vein, pocket, lensoid and bedd

    礦石中發育典型的層狀構造、軟沉積變形構造、同生角礫構造等反映同生沉積特徵的礦石構造;另一類礦石具有明顯的後生成礦特點,稱之為疊生改造型礦石,礦石產于脈狀、囊狀、透鏡狀及似層狀礦體中,與燕山期巖漿巖及斷隙構造關系密切。
  2. But when heavyly loaded, the former is far better than the latter. the wear resistance of za27 alloyed with mn is no obviously better than that of common za27 alloy. under the sliding friction conditions, the wear resistance at high temperature of za27 is improved by alloyed si and reaches the highest level when the content of si is 1 - 3wt. %

    主要始於脆性相si相和mn相,沿晶界擴展;在摩擦條件下(常溫) ,含si的za27合金在載重較小時,耐磨性與普通za合金相比沒有明顯提高,但在載荷較大的情況下,其耐磨性遠高於普通za27合金材料;加mn的za27合金與常規za27合金相比,耐磨性沒有明顯提高;在摩擦條件下, si的加入提高了za27合金的高溫摩擦性能。
  3. The direct analysis method has more efficient than the line programming for the shakedown analysis of contact surface layer, therefore, the mentality of shakedown analysis of contact surface layer was introduced based on the direct analysis method as follows : first, the direct method for shakedown analysis was presented and its application to a two - dimensional rolling / sliding contact problem was demonstrated. the direct method consists of operator split technique, which transforms the elastic - plastic problem into a purely elastic problem and a residual problem with prescribed eigenstrains, and an incremental projection method to determine the eigenstrain

    這些方法各有創新,其特點是計算速度快、收斂性好及精度可靠,計算規模避免了彈塑性隨強化分析的非線性的影響,並使彈塑性問題轉化為殘余問題和線彈性問題,適用於滾、滾接觸失效分析,從而有效地解決了接觸體安定性分析與萌生壽命預測的實際問題,也是本文對表面強化接觸失效的安定分析成為可能。
  4. It is found that cyclic loading at high differential stress level will lead to the decrease of felicity ratio, and the value max can be decreased by some crack systems in specimen. there is still a lot of ae during unloading at high differential stress level, which implies that the deformation is dominated by fracturing at low differential stress level, and the deformation by frictional sliding increases greatly at high differential stress level

    關于應力方式對巖石破的影響,發現較高差應力水平下的多次循環加卸載會使felicity比減小;某些構造能使巖石產生felicity效應的應力門檻值_ ( max )降低;由高差應力水平下卸載時仍有大量聲發射產生推測:在低差應力水平下,破尖端的突然擴展為主;在高差應力水平下,沿已有的面的大量增加。
  5. The fiction coefficients of the five sliding pairs in different media were in the succession of, respectively. in distilled water : ual2o3 > ual2o3 / al2o3 > ual2o3 / al24zys > ual2o3 / al24zy > usic / sic in 1mol / l naoh : in air at 50 % relative humidity : and the friction coefficients of the sliding pairs a12o3 / a12o3, a12o3 / zta, a12o3 / a124zy and a12o3 / a124zys were in the order of u

    當載荷為60n ,頻率為10hz時,經過400om距離后,在水中a12o3 / a1203 , a1203億ta , a12o3 / a124zy和a12o3 / a124zys摩擦副均不能形成有效的潤膜,屬邊界潤過程,磨損表面產生了,發生了晶粒拔出。
  6. The results indicate that the mechanisms to improve the toughness of the multipiayer composite include the crack deflection along the metal interfaces, the crack divarication and passivation, the ductile - phase bridging, stretched, sliding friction, pull - out and interface delamination

    對其增韌機制分析表明, tz - 3y20a mo疊層材料主要包括偏轉、并行擴展、分叉鈍化以及橋接、摩擦、拔出、小塊脫落等增韌機制。
  7. It is found that the great cracks on the coarse surface are initiated easily than on the smooth surface by the sem observation and the crack size obtained at the dynamic indentation experiment is bigger than at the static indentation experiment under the same load. it is showed the single crystal silicon is easier to initiate the crack and fracture under dynamic load, the single crystal silicon ’ s

    然後通過sem觀察單晶硅試件表面壓痕形貌,發現粗糙表面比光表面容易生成大,在相同載荷作用下單晶硅材料在態壓痕試驗得到的要大於在靜態壓痕試驗得到的,表明在態加載條件下單晶硅材料更容易生成和破碎。
  8. At the macroscopic scale, it can be considered that we are in presence of a damage accumulation via matrix microcracking coupled with interfacial sliding phenomenon which may be settled according to a slow crack growth mechanism

    在宏觀層次上,可以把通過基體微和界面所形成的損傷積累看作是一種的緩慢生長過程。
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