激光封裝 的英文怎麼說

中文拼音 [jīguāngfēngzhuāng]
激光封裝 英文
package sealing with laser
  • 激 : Ⅰ動詞1 （水因受到阻礙或震蕩而向上涌） swash; surge; dash 2 （冷水突然刺激身體使得病） fall ill fr...
  • 光 : Ⅰ名詞1 （照耀在物體上、使人能看見物體的一種物質） light; ray 2 （景物） scenery 3 （光彩; 榮譽） ...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 激光 : [物理學] laser 激光靶 laser target; 激光報警器 laser avoidance device; 激光玻璃纖維 laser fibre; ...
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. Based on the structure and emission characteristic of the diode bar, a numerical calculation. model of the thermal dissipation was proposed and a related simulation of the effects of heatsinks parameters on the performance of the packaged laser was carried out

    根據二極體條結構及輻射特性，建立了散熱過程數值計算模型，數值模擬研究了熱沉參數對封裝激光器性能的影響。
  2. High power diode laser is the requirement to research on the high - average - power diode - pumped solid - state lasers, so the package techniques of the diode laser is studied first in this thesis

    高功率二極體激光器是開展高平均功率dpl研究的必要條件。本文首先研究了高功率二極體激光器封裝技術，二極體條散熱冷卻是高功率二極體激光器封裝要解決的核心問題。
  3. However, the disadvantage of laser welding is the so - called post - weld - shift ( pws ). the end result is a reduction in light coupling efficiency. the shrinkage force generated by the solidification process is so great that no known mechanical structure can counteract the shrinkage from shifting the joint ? at least at the micron level

    這種封裝技術最大的缺點是會使激光二極體的封裝產生焊後偏移（ pws ） ，很少有一種機械的方法可以校正這種焊後偏移到亞微米級別，目前激光錘被證明是一種很有效的校正方法，激光錘校正作用過程就是利用金屬熔化凝固冷卻產生的內應力來恢復焊後偏移的過程。
  4. Water shutoff agent dsz - a is composed of inorganic particle. its specialities are low cost, easily flow, high strength and long valid period. the agent suits non - selective water shutoff in sand formation. dsz - a not only can plug high water - bearing formation, but also can plug case leakage. dsz - a has been applied on site and gotten good effect. it is a agent which has wide prospect

    井下護泵除砂裝置主要用於產液氣量高，出砂能力大，利用常規裝置、常規方法很難治理的井.它的設計是建立在丟手封隔器卡封的基礎上，將液體攜砂能力由地層進入泵管轉變為先過濾（雙層激光割縫篩管部分） ，再在除砂器內靜態沉澱、由單流閥排入井底等一系列除砂護泵優點.本文著重介紹了井下護泵除砂裝置的工作原理與應用情況
  5. Therefore, the waveguide optical modes in the semiconductor lasers with different waveguide structures are investigated by means of optical waveguide theory. with the development of fabrication and packaging techniques, the dimensions of optoelectronic and photonic systems have become smaller and smaller. the far - field radiation models are no longer suitable for the near - field distribution of semiconductor lasers

    隨著製作工藝和封裝技術的發展，光電系統和光子系統的尺寸越來越小，半導體激光輻射的遠場模型不再適合其近場特性的分析；而且，半導體激光器可以作為近場虛擬光探針，應用於近場光學高密度存儲、納米光刻、近場光學成像以及光譜探測等領域。
  6. The nd : yag laser welding technology is being widely used in to - can style package for laser diode

    論文中運用nd : yag激光對同軸激光二極體組件進行焊接封裝。
  7. Based on the different requirements on the operating mode, the back surface cooling package style by impinge cooler and the module package style by micro - channels coolers were studied respectively

    根據對二極體激光器不同工作模式要求，分別研究了採用沖擊式冷卻器的背冷式二維陣列封裝和微通道冷卻的模塊化封裝。
  8. 3. because traditional coupling system composed with cylinder lens and focus lens has the disadvantages of difficult to encapsulation and modulate, a new practical method brings forward : the output light from laser diode is collimated using a section of optical fiber with the diameter of 600 m instead of cylinder lens, and a sphere ? end lens

    3 .針對由柱透鏡和聚焦透鏡組成的組合透鏡耦合系統中存在的封裝和調試困難等問題，提出了:用一段直徑為600 m的裸石英光纖代替柱透鏡，對半導體激光器輸出光束進行準直整形;用球透鏡光纖對準直后的光束進行聚焦，直接實現和光纖耦合，來代替聚焦透鏡和光纖耦合的環節。
  9. The principle advantages of vcsels over conventional edge - emitting lasers lie in ultralow threshold current, small far - field divergent angle, high modulation frequency, potential for wafer level testing and the ease for single longitudinal mode operation and two - dimension integration. as a result they show considerable promise for applications such as optical fiber communication, parallel optical interconnects, optical information processing and neural networks, etc. a direct coupling theoretical model in quasi - three - dimension for the gain - wave guide vertical - cavity surface - emitting lasers has been created in this paper

    它與傳統的邊發射激光器相比具有更優越的特性，例如，具有極低的閾值、較小的遠場發散角、調制頻率高、易實現單縱模工作和二維集成，無須解理封裝即可進行在片測試等，所以，它被廣泛應用於光纖通訊、并行光互聯、光信息處理、光神經網路等領域。
  10. The pd packaged in the laser diode can detect the signal of the self - mixing speckle interference and determine the motion state of the target

    封裝在半導體激光器另一側的光電二極體，檢測光學反饋生成的自混合散斑干涉信號，確定物體的狀態。
  11. Laser speckle interferometry was used as the experimental method to test the coefficient of thermal expansion ( cte ) of the metal composite leads used in the packaging structures and the thermal deformations of the entire packaging structures due to the change of temperature from room - temperature to 150oc

    通過實驗和數值模擬的方法對其熱變形和熱應力進行了研究。採用激光散斑干涉法測量了從室溫到150oc的封裝用金屬復合引線的熱膨脹系數和整個封裝結構的熱變形。
  12. A special clamp for etching optical fiber and depositing pd film on the fiber is designed. designed a encapsulation set of the characteristics that is dampproof, shake and eroding resisted. the experimental set - up for hydrogen sensing includes the light source, gas cell, mass flow controller, stainless steel helical tubing and the detector, etc. the experimental results are also discussed

    本文還設計了一套光纖腐蝕用夾具、光纖封裝加熱夾具和一套光纖濺射鍍膜實驗夾具;設計並製作了一套具有防潮、抗震和抗腐蝕功效的光纖傳感頭封裝裝置;設計了一套由激光器、反應混合氣室、光功率計、質子流量計和流量控制器等組成的氫氣定標實驗裝置並對實驗數據進行了分析與處理。
  13. Gloss, clarity and heat sealability etc. decro bopp film has been in high - ranked level in domestic market. the products are widely used in food packaging, drink packaging, trademark labeling, general printing, laminating, tape - base gluing and other industrial application

    （消光度） 、透明度（不透明度） 、白度、熱封性能等方面各具特色，指標居國內領先水平，廣泛應用於粘膠帶材、食品包裝、高檔飲料包裝、商標印刷、印刷復合、激光防偽及其他工業用途。
  14. Based on the analysis, the heat sink materials, cooling liquid, the heatsink structure, and the bonding of laser bar are optimized in order to increase the transfer efficiency

    通過分析，對微通道熱沉材料、冷卻液、微通道熱沉的結構參數以及熱沉與激光器列陣條的封裝等進行了優化設計。
  15. Angle shift can reduce in light coupling efficiency. therefore, the angle shift is an important factor for light coupling efficiency when pws is corrected by lh for laser diode packaging

    角度的偏移也會影響到激光二極體的光通量效率，所以在利用激光錘校正激光二極體封裝焊後偏移的過程，要充分考慮橫向角度的偏移。
  16. The central wavelength of 808nm, fwhm of 2. 2nm and e - o efficiency of 45 % are achieved. most of the experimental results about high - average - power diode laser package have not been reported in previously published paper in this field

    利用該冷卻器實驗封裝出連續輸出1kw的二維陣列二極體激光器，激光中心波長808nm ，譜線寬度2nm ，電光效率達45 。
  17. And the use - case diagram, state diagram and class diagram are used in uml diagram, which describe the software model from its function, logic and static structure. and the main arithmetic is shown. during the detail design process the com component technology is applied to envelop the logical part, hence to update and improve the software ; the software system of evaluation of the virtual prototype of the high power tf co2 laser is developed

    本文採用面向對象的軟體工程方法對高功率橫流co _ 2激光器虛擬樣機評價軟體的需求進行了分析，並用uml中的用例圖、狀態圖和類圖分別從功能、邏輯和靜態結構三個方面對軟體模型進行了描述，提出了主要演算法，在詳細設計過程中應用com組件技術對其中邏輯部分進行封裝，以便於升級和改進，開發了高功率橫流co _ 2激光器的虛擬樣機評價的軟體系統。
  18. The designing idea and method of laser resistor trimming machine is valuable for designing other laser processing equipments

    其設計思路和方法對其它激光加工設備（如表面封裝電容激光加工設備等）的實現有一定的借鑒價值。
  19. The packaging experiments of linear array diode laser were carried out. the output power of 100w with duty cycle of 20 % is achieved in q - cw mode, the life time of which reaches 2. 19 109 shots

    實驗封裝出峰值功率100w 、占空比20的準連續線陣二極體激光器，壽命達2 . 19 10 ~ 9次；同時封裝了連續40w線陣二極體激光器。
  20. Through analyzing constitute and mechanism of high power laser diode ( ld ) fiber coupling module, the effects on reliability of ld fiber coupling module are detailed as following : crafts of coupling and encapsulation, electricity factors and ld itself

    摘要文章從高功率半導體激光器光纖耦合模塊的組成和各個部分的機理出發，詳細分析了影響其可靠性的因素，主要有以下三個方面：激光器自身的因素、耦合封裝工藝和電學因素。
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