焊接熱循環 的英文怎麼說

中文拼音 [hànjiēxúnhuán]
焊接熱循環 英文
weld thermal cycle
  • : 動詞(用熔化的金屬修補金屬器物或使金屬工件連接起來) weld; solder
  • : Ⅰ動詞1 (靠近;接觸) come into contact with; come close to 2 (連接; 使連接) connect; join; put ...
  • : 循動詞(遵守; 依照; 沿襲) follow; abide by
  • : Ⅰ名詞1 (環子) ring; hoop 2 (環節) link 3 (姓氏) a surname Ⅱ動詞(圍繞) surround; encircle;...
  • 焊接 : weld; welding; soldering; seal; sealing; sealing-in; shutting together
  • 循環 : circulate; circle; round; repeat; loop; period; recurrence; cycling; circulating; mixing; circula...
  1. The effect of heat pipe on the thermal cycle during welding and haz

    管對焊接熱循環影響區的影響
  2. This dissertation is one of the sub - problems of " computer dynamic test and calculation of welding heat - cycle ", which is a project on natural science fund

    本文是自然科學基金項目「焊接熱循環的計算機動態測試與計算」的一個子課題。
  3. Combining cae / capp and welding techniques, we construct the mathematical model of 16mnr welding temperature field using theory of welding heat - conduction, then validate it by experiments

    將cae / capp技術和技術相結合,應用理論首先建立了16mnr溫度場數學模型及焊接熱循環的特徵參數模型,並通過實驗驗證了該數學模型正確的。
  4. With the model, the simulation of welding process is achieved, and the needed technical parameters of the tissue of welding line are obtained, further more, we can predict the tissu e of welding line by the existing welding heat - cycle technical parameters

    該數學模型的正確建立,使16mnr冶金過程的模擬得以實現,通過模擬可以得出所需縫組織的工藝參數,同時也可以通過根據現有的焊接熱循環工藝參數預測縫組織。
  5. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中,往往會產生殘余應力以及殘余應力,殘余應力的釋放作用及器件在使用過程中的變形,會降低集成電路晶元與封裝體的結合強度,進而降低集成電路的電性能,反復的,將導致器件的疲勞失效,嚴重時可導致矽片或陶瓷片破裂,使整個器件遭到破壞。
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