玻璃織維板 的英文怎麼說

中文拼音 [zhīwéibǎn]
玻璃織維板 英文
glass mat
  • : 動詞(編織) knit; weave
  • : Ⅰ動詞1 (連接) tie up; hold together; link 2 (保持; 保全) maintain; safeguard; preserve; keep ...
  • : Ⅰ名詞1 (片狀硬物體) board; plank; plate 2 (專指店鋪的門板) shutter 3 [音樂] (打拍子的樂器) ...
  • 玻璃 : 1. (一種質地硬而脆的透明物體) glass 2. [口語] (指某些像玻璃一樣透明的尼龍、塑料等) nylon; plastic
  1. Specifications. specification no. 19. thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    規范.第19號規范:多層印製電路構件規定的可燃性雙馬來酰亞胺三嗪改型氧化物包銅疊層
  2. Base materials for printed circuits - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    印製電路用基體材料.用於多層印製構成的限定可燃性的薄雙馬來酰亞胺三嗪改性的環氧包銅層壓
  3. Base materials for printed circuits. part 2 : specifications. specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 18號規范:規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機物包銅層壓
  4. Base materials for printed circuits. part 2 : specifications - specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 18號規范.規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機物包銅層壓
  5. . 1 base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test ; amendment 1

    印製電路用基材.第2部分:規范.第18號規范:規定易燃性的雙對馬來酰壓胺三氮雜苯改良型環氧覆銅層壓
  6. Specification and characterization methods for nonwoven " e " glass mat

    非編的" e "形的規范和特性方法
  7. Textile - glass - reinforced plastics - prepregs, moulding compounds and laminates - determination of the textile - glass and mineral - filler content ; calcination methods iso 1172 : 1996 ; german version en iso 1172 : 1998

    增強塑料.預浸料坯,模塑化合物及疊層
  8. Components for electronic equipment. printed circuits. woven glass fabric impregnated with expoxid resin for printed boards

    電子設備元件.印刷電路.印刷電路用環氧樹脂浸潤的
  9. Base materials for printed circuits. part 2 : specifications. specification no 4 : epoxide woven glass fabric copper - clad laminated sheet, general purpose grade

    印製電路基材.第2部分:規范.第4號規范:普通級環氧化合物編覆銅層壓
  10. Glass yarn is the basic material for weaving into glass fabric which itself is the key reinforcement material for glass epoxy laminates

    紗為布的基本材料,本身亦是覆銅面的主要強化物料。
  11. Materials for printed boards and other interconnecting structures - part 2 - 9 : reinforced base materials clad and unclad ; bismaleimide triazine modified epoxide or unmodified, woven e - glass reinforced laminated sheets of defined flammability vertical burning test, copper - clad

    印製和其它互連結構用材料.第2 - 9部分:包被和非包被增強基材.規定了易燃性的包銅二順丁烯二酰亞胺三嗪改良或未改良的環氧編e型增強層壓
  12. Materials for interconnection structures - sectional specification set for reinforced base materials, clad and unclad - reinforced base materials clad and unclad - bismaleimide triazine, modified epoxide or unmodified, woven e - glass reinforced laminated sheets of defined flammability vertical burning test, copper - clad

    互連結構用材料.包被和非包被增強基材分規范.包被和非包被增強基材.規定了易燃性的包銅二順丁烯二酰亞胺三嗪改良或未改良的環氧編e型增強層壓
  13. Materials for printed boards and other interconnecting structures - part 2 - 7 : reinforced base materials clad and unclad - epoxide woven e - glass laminated sheet of defined flammability vertical burning test, copper - clad

    印製電路和其它互連結構件用材料.第2 - 7部分:包覆和非包覆的增強基材.規定易燃性的環氧編e型層壓包銅薄
  14. Base materials for printed circuits - epoxide woven e - glass laminated sheet of defined flammability vertical burning test

    印製電路基本材料.規定可燃性的環氧編e型疊層
  15. Materials for interconnection structures - sectional specification set for reinforced base materials, clad and unclad - polyester non - woven woven fibreglass laminated sheet of defined flammability vertical burning test, copper - clad

    互連結構用材料.包層和非包層增強的基材分規范.規定了易燃性的聚酯非編銅包的層壓
  16. Materials for printed boards and other interconnection structures - part 2 - 4 : reinforced base materials, clad and unclad ; polyester non - woven woven fibreglass laminated sheet of defined flammability vertical burning test, copper - clad

    印製和其它互連結構用材料.第2 - 4部分:包被和非包被增強基材.規定了易燃性的覆銅聚酯非編層壓
  17. Materials for printed boards and other interconnecting structures - part 2 - 4 : reinforced base materials clad and unclad - polyester non - woven woven fibreglass laminated sheet of defined flammability vertical burning test, copper - clad

    印刷電路及其它互連結構用材料.第2 - 4部分:包覆和不包覆增強基材.規定易燃性的聚酯非機包銅層壓
  18. Textile - glass - reinforced plastics. prepregs, moulding compounds and laminates. determination of the textile - glass and mineral - filler content. calcination methods

    增強式塑料製品聚酯膠片模製化合物及層壓材.紡和礦物填充料含量的測定.煅燒法
  19. Base materials for printed circuits. part 2 : specifications - specification number 17 : thin polyimide oven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    印刷電路用基材.第2部分:規范. 17號規范:多層印刷電路製作用規定易燃性的聚酰亞胺機物包銅層壓
  20. Materials for printed boards and other interconnecting structures - part 2 - 10 : reinforced base materials clad and unclad - cyanate ester, brominated epoxide, modified or unmodified, woven e - glass reinforced laminated sheets of defined flammability vertical burning test, copper - clad

    印製電路和其它互連結構用材料.第2 - 10部分:包覆和非包覆的增強基材.規定可燃性的銅包改性的或未改性的氰酸酯溴化環氧編e型增強層壓薄
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