銅線互連 的英文怎麼說

中文拼音 [tóngxiànhùlián]
銅線互連 英文
copper interconnect
  • 銅 : 名詞（金屬元素） copper （cu）
  • 線 : 名詞1 （用絲、棉、金屬等製成的細長的東西） thread; string; wire 2 [數學] （一個點任意移動所構成的...
  • 互 : 代詞（相互;彼此） each other; mutual
  • 連 : Ⅰ動詞1 （連接） link; join; connect 2 （連累） involve （in trouble）; implicate 3 [方言] （縫） ...
  • 銅線 : constantan wire
  1. The results indicate the stress of copper interconnects generates in the metallization and the thermal stress caused by thermal mismatch during the damascene process is the main stress. the thermal stress distribution in copper interconnects has been simulated by the finite element analysis software with the different trench structures

    對測量結果的分析得出金屬薄膜的淀積是造成銅互連線中應力的主要原因，熱應力在銅互連線應力中占較大比例，熱處理后銅互連線中應力減小。
  2. The snam results of local stress distribution are in close agreement with the results of computer simulation

    利用計算機模擬了溫度場變化引起的銅互連線中熱應力分佈。
  3. Studies on the stress of copper interconnects include the stress measurement by xrd, computer simulation and observation the local stress distribution with snam

    利用薄膜應力測試分佈儀和xrd測量硅基銅膜及銅互連線薄膜宏觀應力。
  4. Materials for printed boards and other interconnection structures - part 2 - 19 : reinforced base materials, clad and unclad ; epoxide cross - plied linear fibreglass - reinforced laminated sheets of defined flammability vertical burning test, copper clad

    印製板和其它互連結構用材料.第2 - 19部分:被包和非包被增強基材料.規定燃燒性的環氧交叉簾布層線性纖維玻璃增強包銅的疊層板
  5. The mechanical simulation compared the stress distribution in copper lines and pore, with the result that the maximum stress locates in the corner

    在力學模擬過程中，計算了銅互連線和通孔的熱應力的分佈。
  6. On the other hand, tddb experiments of copper interconnection have been taken to prove the performance improvement of interconnect by the use of low - k dielectric

    試驗方面則進行了銅互連線的tddb試驗，來驗證低k介質對互連性能的改善。
  7. Studies on the microstructure of copper interconnects include the determination of grain size by afm and sem, the measurement of texture by xrd and ebsd, the evaluation of barriers by xps and aes

    銅互連線的微觀結構的研究：通過afm 、 sem 、 tem等的分析方法對銅膜及銅互連線薄膜的晶粒尺寸進行了評價。
  8. Xrd analysis results reveal the electroplated copper film has strong cu { 111 } texture and cu { 111 } texture weakens after annealed. the cu { 111 } texture of copper film in trenches is obviously weaker than that of the blanket copper film

    在沉積態銅膜存在較強的銅{ 111 }織構，熱處理以後銅膜的織構減弱，銅互連線溝槽中銅{ 111 }織構要弱於銅膜的銅{ 111 }織構。
  9. The results show the grain size becomes larger along with elevated temperature and the grain size in interconnects does not change evidently after annealed at 200 ? because of the effect of the trench structure

    結果顯示熱處理后銅膜晶粒長大，但銅互連線薄膜由於溝槽結構對晶粒的長大有阻礙作用。利用xrd和ebsd測試方法對銅膜及銅互連線薄膜的織構進行評價。
  10. In this thesis, focusing on the copper diffusion failure of copper interconnects in the ulsi, such as electromigration, stressmigration and copper diffusing into silicon dioxide and silicon, the microstructure and the stress of copper interconnects in ulsi have been studied systemically

    本論文從ulsi銅互連技術可靠性研究中的銅擴散失效問題出發，針對電徙動失效、應力遷移失效、層間擴散失效問題，對銅互連線的微觀結構和應力進行了研究。
  11. Through the electromigration experiment, the electromigration resistance of copper interconnection with different width was compared, its mtf and activated energy was calculated, and the failure mechanism was explored. then, difference between copper interconnection and aluminum interconnection was studied

    通過電徙動試驗，研究比較了不同寬度的銅互連線的抗電遷徙能力，計算了其中值壽命和激活能，探討了其失效機理，並與鋁互連線進行了比較。
  12. Materials for interconnection structures - sectional specification set for reinforced base materials, clad and unclad - epoxide cross - plied linear fibreglass - reinforced laminated sheets of defined flammability vertical burning test copper clad

    互連結構用材料.包層和非包層的增強的基材分規范.規定了易燃性的環氧斜交簾布層的線性纖維玻璃增強的包銅的疊層板
  13. Materials for printed boards and other interconnecting structures - part 2 - 19 : reinforced base materials, clad and unclad - epoxide cross - plied linear fibreglass - reinforced laminated sheets of defined flammability vertical burning test, copper clad

    印製板和其它互連結構用材料.第2 - 19部分:包覆和不包覆增強基材.規定易燃性的環氧交叉簾布層線性纖維玻璃增強包銅層壓板
  14. Optical interconnects are desirable because fiber optics offer more bandwidth and carry data farther than copper, which is currently used to connect chips and move data inside a computer

    之所以如此強調光學互連的重要性是因為光纜較目前電腦中廣泛使用的銅線而言，可以提供更大的帶寬，攜帶的數據量也大很多。
  15. Through the simulation and calculation of the delay models, the improvement degree of the new material and geometric parameters for the interconnect delay can be concluded and performance optimizations should be made by analyzing these influences

    而通過互連延時模型的模擬與計算，得出新材料即銅和低k介質對延時的改善程度，及互連線的幾何參數對互連延時的影響，並根據這些確定最優尺寸來適應集成電路設計的需要。
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