間化合物 的英文怎麼說

中文拼音 [jiānhuà]
間化合物 英文
meta-compound
  • : 間Ⅰ名詞1 (中間) between; among 2 (一定的空間或時間里) with a definite time or space 3 (一間...
  • : 合量詞(容量單位) ge, a unit of dry measure for grain (=1 decilitre)
  • : 名詞1 (東西) thing; matter; object 2 (指自己以外的人或與己相對的環境) other people; the outsi...
  1. Abstract : the current status of research work on intermetallic compound dispersoid in rapidly solidified elevated temperature aluminum alloys is reviewed. the dispersoid existing in common elevated temperature aluminum allo ys, effect of rapid solidification processing on the formation of dispersoid and their thermal stability are discribed

    文摘:綜述了快速凝固耐熱鋁金中金屬間化合物彌散相的研究現狀,介紹了常見耐熱鋁金中存在的彌散相、快速凝固工藝對彌散相形成的影響和彌散相的熱穩定性及其影響因素。
  2. According to the nb - si phase diagram, the temperature of 1550 ?, which is lower than the eutectoid transformation temperature of nbssi ( 1783 ? ), is chosen for heat - treatment. according to the present conditions of the furfaces, heat - treatment by stages is first proposed for the nb - si system intermetallic composites to keep the furface in good conditions. the results indicate that the equilibrium nb + nbssia dual - phase microstructure of the nb - si system intermetallics forms gradually via such eutectoid reaction as nbasi ? nb + nbssis with the heat - treatment time

    根據nb - si二元相圖,選擇略低於nb _ 3si共析轉變溫度t _ f = 1783的1550對鑄態nb - si系金屬間化合物進行不同時( 25h - 100h )的熱處理,並根據目前國內和我院熱處理爐的現狀,首次提出採用分段熱處理的方法來解決nb - si金熱處理溫度高、連續熱處理時過長而影響熱處理爐壽命的困難。
  3. Preparation of ordered intermetallic compound of fe3si with mechanical activation and sintering

    有序金屬間化合物的制備
  4. Evolution of intermetallic compounds in snag and snagcu lead - free solder joints during aging

    無鉛焊料接頭中金屬間化合物在時效中的演變
  5. Classification and designation for superalloys and high temperature intermetallic materials

    高溫金和金屬間化合物高溫材料的分類和牌號
  6. Method of tensile test for intermetallic compounds - part 1 : room temperature tensile test

    金屬間化合物抗拉伸試驗方法.第1部分:室溫抗拉伸試驗
  7. Method of tensile test for intermetallic compounds - part 2 : elevated temperature tensile test

    金屬間化合物抗拉伸試驗方法.第2部分:高溫抗拉伸試驗
  8. Advances in powder metallurgy of tial intermetallics

    金屬間化合物的研究進展
  9. The process and mechanism of ball bonding were studied in this paper, specifically, intermetallic compounds ( imc ) formation and reliability on copper wire and aluminum alloy pad bonding joint during thermal aging were analyzed in detail

    本文在對銅絲球鍵工藝和原理研究的基礎上,著重分析了老過程中銅絲球與鋁金焊盤鍵的金屬間化合物生長及可靠性。
  10. A reliability experiment of thermal aging was carried out for the two types of joints, scanning electron microscopy, energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints, and kinetics model of imc formation was established. the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature, imc growth is more sensitive to the aging temperature than the aging time, the activation energy of cu - al imc growth is 97. 1kj / mol and the major forming cu - al imc are cual2 and cu9al4, the activation energy of au - al imc growth is 40. 1kj / mol and the main au - al imc are au4al and au5al2, with au2al and aual at the interfacial periphery of joints, the rate of cu - al imc growth is about 1000 times slower than that of au - al imc, and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours

    研究結果表明:金屬間化合物厚度與老的關系符線法則,金屬間化合物的生長對老溫度比老更加敏感; cu - al金屬間化合物生長的激活能為97 . 1kj / mol ,老后金屬間化合物呈層狀分佈,主要相為cual2和cu9al4 ; au - al金屬間化合物生長的激活能為40 . 1kj / mol ,主要相為au4al和au5al2 ,同時在界面周邊區域生成了au2al和aual ;老過程中cu - al金屬間化合物生長速率比au - al金屬間化合物生長速率小103數量級;金絲球鍵點200老96小時出現了明顯的kirkendall空洞和裂紋,但銅絲球鍵點200老2900小時和250老169小時都沒有形成空洞和裂紋。
  11. The expansion and dehiscence behavior during the vacuum reactive sintering below 660 of compact ti / al composite powders was experimentally investigated, and the reasons of expansion and dehiscence were theoretically analyzed. the method of low temperature reactive sintering was generalized, and the experiment testified the method effective. the rule of the expansion of the billets was generalized from the result of density of the billets

    低溫反應燒結工藝:研究了高能球磨ti / al復粉體在溫度低於660下真空無壓反應燒結過程中的膨脹和開裂行為,分析了產生膨脹和開裂的主要原因;並提出了能夠有效預防坯料開裂的方法;通過測定坯料在低溫燒結后的密度,總結了其體積膨脹的規律;通過x射線衍射技術分析了隨球磨時不同,金屬間化合物的生成情況。
  12. Before 900 c, ti reacts with al to form tial intermetallics ; above 900 c, c reacts with remain ti to form tic triggered by the exothermal reaction of ti and al ; tial reacts with tic to produce dense tial / ti2alc composites

    的放熱反應引發c和未反應完全的ti反應生成tic ; tiai金屬間化合物和tic反應併成緻密tiai / tizaic復材料。通過保溫階段, tizaic長成層狀多品結構,同時復材料緻密
  13. In this paper, a new method was presented that b - doped diamond was synthesized at high pressure and high temperature ( hthp ) using b - doped graphite intercalation compounds ( gics )

    本論文提出了利用含硼石墨層間化合物( gics )高溫高壓( hthp )成含硼金剛石的新工藝。
  14. Tial - matrix intermetallic compounds have become one of the hottest high - temperature structural materials recently, due to its excellent high - temperature properties and lower density

    Tial基金屬間化合物因具有優良的高溫性能和較低的密度,從而成為目前世界上研究最為熱門的高溫結構材料之一。
  15. The planeness and integrality of the flier - plate were ensured effectively by exerting restrictive pressure, controlling heating and cooling rate, lowering welding temperature or reducing welding time as much as possible, etc. theoretical model of creating quasi - isentropic compression via 93w - ofc - tc4 - a1 - mb2 system flier - plate with graded wave impedance was established, and numerical simulation of the impact process was then carried out

    採取施加外部機械力、控制升降溫速率以及盡量降低焊接溫度或減少焊接時(防止脆性金屬間化合物的過度增長)等措施,確保了焊接接頭的平整性和界面結構的完整性。建立起梯度飛片擊靶的理論模型,對93w - ofc - tc _ 4 - al - mb _ 2系波阻抗梯度飛片的擊靶過程進行了數值模擬計算。
  16. The essential factors for different growth rate of imc were analysed as well

    本文還分析了金屬間化合物生長速率差異的本質因素。
  17. The efficiency of the sample made in alkaline catalyst is 79 % and a first charge capacity of 201. 2mah ? g ~ ( - 1 )

    在900條件材料出現了一定量的硅銅金屬間化合物( cu3si相) ,但材料的電學性能沒有明顯提高。
  18. Microstructural evolution during superplastic deformation in large - grained single phase ni - 48al intermetallics

    金屬間化合物超塑性變形過程中的組織演
  19. Subsidized by the national natural science foundation of china, " tenth five - year " plan of hubei province and so on, this dissertation systematically discussed the author ' s researches on synthesis and deformation of ni / al and ti / al system intermetallic compound

    本文在國家自然科學基金、湖北省「十五」重點攻關計劃等基金支持下,系統地論述了作者在ni al系和ti al系金屬間化合物成與成形的電脈沖效應方面研究成果。
  20. Alloy fabricated by arc melting consists of continuous nbssi matrix and dispersive distributed nb particles. the metastable nbasi phase is found to have a tetragonal crystal structure with space group p42 / n and lattice parameters a = 1. 021nm, c = 0. 519nm

    O 0 )金屬間化合物的顯微組織由連續的nb3si基體、彌散分佈的nb粒子組成,其中亞穩態相nb3si為四方結構,空群p42 n ,點陣常數a l
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