電子封裝組裝 的英文怎麼說

中文拼音 [diànzifēngzhuāngzǔzhuāng]
電子封裝組裝 英文
electronic package and assembly
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 子 : 子Ⅰ名詞1 （兒子） son 2 （人的通稱） person 3 （古代特指有學問的男人） ancient title of respect f...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 組 : Ⅰ名詞1 （由不多的人員組成的單位） group 2 （姓氏） a surname Ⅱ動詞（組織） organize; form Ⅲ量詞（...
  • 電子 : [物理學] [電學] electron
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  • 組裝 : package; assembling; packaging組裝車間 composing room; 組裝船 fabricated ship; 組裝生產 assembly ...
  1. Driveequipment use active magnet connected - implement to firsthand fix at the axletree of electrical engine, pumproom close completely, via magnetic force coincidence to drive impeller on rotor - assembled to circumgyrate indirectly

    驅動裝置採用主動磁鐵聯軸器直接裝在電機軸上，泵室完全封閉，通過磁力偶合間接驅動轉子組合上的葉輪旋轉。
  2. Sealed from water and dust, and employing an optics system consisting of two oval - shaped mirrors to transmit the sight picture to the firer, the oavd is designed to be intuitive to use and more accurate than electronic systems

    離軸式觀察裝置經過密封能防水、防塵，是具有兩個橢圓形反射鏡組成的光學系統，觀察目標更為直觀，與電子系統相比也更為準確。
  3. Microstructures and properties of si - al alloy for

    噴射沉積硅鋁電子封裝材料的組織與性能
  4. The most recognized form of digital wrappers are digital envelopes. those pieces of code are the workhorses of e - mail encryption, locking out intruders who don ' t have the right digital key to open the envelope. the digital envelope is essentially made up of code encrypted with a cipher, or software algorithm, and carries a digital signature that properly identifies the sender to the recipient

    數字包裝器最被認可的形式是數字信封，這些代碼主要完成電子郵件的加密，把想打開信封而沒有正確數字密鑰的入侵者擋在外面，數字信封主要由通過密碼加密或軟體演算法加密的代碼組成，運載著能正確讓接收方識別發送方身份的數字簽名。
  5. Die bonder is a kind of microelectronics encapsulation device that welds transistors to the base. temperature control system is one important part of it

    粘片機是一種將晶源焊接到底座的微電子封裝設備，溫度控制系統是其較為重要的組成部分。
  6. This machine is designed for paint - dropping or rubber dropping epoxy resin end sealing of engine rotor winders such as mini - engine, series engine, motorcycle, vehicle starting engine, dc servo engine and electrical tools, etc. the local machine is of germany simenz programmable controller ( plc ) with the parameter of simenz latest chinese

    本機專為微電機、串激電機、摩托車、汽車起動電機、直流伺服電機、電動工具等電機轉子（電樞）的繞組滴漆或滴膠環氧樹脂端部封裝而設計的專用設備。
  7. Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density

    多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。
  8. This article introduces the development and characteristic of dye - sensitized solar cell, points out poor stability would be obstacle for its production, summarizes its components which would improve its stability, such as : solid electrolyte, ionic liquid, inorganic sensitized dye, composite transparent conducting film and sealing of cells, discusses the prospects for application of dye - sensitized solar cells

    摘要介紹了色素增感太陽能電池的發展及特點，指出穩定性差將是實現產業化的一個發展瓶頸；對提高穩定性的組成部分如：固體電解質、離子液體、無機增感色素、復合透明導電薄膜以及電池的封裝問題進行了綜述；對色素增感太陽能電池的應用前景作出了展望。
  9. A typical optocoupler made up of two electronic assembles : an ir led and an output optoelectronic detector which are integrated into a dip

    典型的光耦合器是將兩個電子組件-紅外（ ir ）發光二極體（ led ）和輸出光電探測器集合到一個雙列直插式封裝（ dip ）中。
  10. Since 1998, a total of more than hk $ 140 million was awarded to cuhk, in which hk $ 16. 6 million was appropriated by the information technology fund to set up the ppl, dedicated to the r & d of photonic component packaging and related technologies and processes

    自一九九八年起，中大共獲得超過一億四千萬港元撥款，其中包括創新科技基金一千六百六十萬港元撥款，用作成立光電子封裝實驗室，研究光電子組件的封裝及有關技術。
  11. Industrial automation systems and integration - product data representation and exchange - part 210 : application protocol : electronic assembly, interconnection and packaging design

    工業自動化系統和集成.產品數據表示和交換.第210部分:應用協議:電子組件互連和封裝設計
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