電子封裝 的英文怎麼說

中文拼音 [diànzifēngzhuāng]
電子封裝 英文
electronic packaging
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 子 : 子Ⅰ名詞1 （兒子） son 2 （人的通稱） person 3 （古代特指有學問的男人） ancient title of respect f...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 電子 : [物理學] [電學] electron
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with 13 refs

    摘要結合電子封裝的現狀、電子塑封材料的發展以及電子封裝對塑封材料提出的高性能要求，介紹了新型脂環族環氧樹脂及其作為塑封材料的應用前景，其包括耐熱型液體、含磷三官能團型、有機硅多官能團脂環族環氧樹脂。
  2. The challenge of changeover to lead - free in electronic packaging

    電子封裝面臨無鉛化的挑戰
  3. Flip chip bonding technology used in modern micro - photoelectron package

    現代微光電子封裝中的倒裝焊技術
  4. The advanced microelectronics packaging technology

    新型微電子封裝技術
  5. Optimization thermal profile of solder in smt

    微電子封裝領域焊膏迴流曲線的優化研究
  6. Microstructures and properties of si - al alloy for

    噴射沉積硅鋁電子封裝材料的組織與性能
  7. Research status and development of high silicon aluminium alloy for light weight electronic package materials

    高硅鋁合金輕質電子封裝材料研究現狀及進展
  8. Die bonder is a kind of microelectronics encapsulation device that welds transistors to the base. temperature control system is one important part of it

    粘片機是一種將晶源焊接到底座的微電子封裝設備，溫度控制系統是其較為重要的組成部分。
  9. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。
  10. Prof king thanked the government for supporting the establishment of the ppl through the innovation and technology fund

    金耀基教授感謝香港政府透過創新科技基金撥款支持中大成立光電子封裝實驗室。
  11. Study on high performance polyphenylene sulfide composite materials for electronic encapsulation

    電子封裝用聚苯硫醚高性能復合材料的研製
  12. A new method for calculating the strain energy release rate of delamination crack propagation at an interface between dissimlar materials was suggested by using the j - integral with a small flat rectangular contour near the crack tip

    提出了一種通過特定的扁平小矩形路徑j積分，計算電子封裝中異質界面分層裂縫擴展能量釋放率的新方法。
  13. Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density

    多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。
  14. Research on high performance novel electronic packaging materials of silicon - based aluminum

    新型硅基鋁金屬高性能電子封裝復合材料研究
  15. Current status of research on electronic packaging materials

    電子封裝材料的研究現狀
  16. Application and development of cad in electronic packaging

    技術在電子封裝中的應用及其發展
  17. New progress of electronic packaging technology

    電子封裝技術的新進展
  18. A review of metal - martix composites for electronic packaging

    電子封裝用金屬基復合材料的研究現狀
  19. Present status and progress in study of electronic packaging materials

    電子封裝材料的研究現狀及進展
  20. Review of metal - matrix composite materials for electronic packaging

    金屬基電子封裝復合材料的研究進展
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