ceramic substrate 中文意思是什麼

ceramic substrate 解釋
陶瓷襯底
  • ceramic : adj 陶器的，陶瓷的，陶質的；制陶的。 the ceramic industry 陶瓷業，窖業。 ceramic manufactures 陶...
  • substrate : n. 1. 底層，地層。2. 【無線電】（半導體工藝中的）襯底，基底。3. 【生物學】（生態學中的）基層；【生物化學】受質；被酶作用物。
  1. 7 ) by using in - situ hydrothermal synthesis and sol - gel complex method a stoichiometry tetragonal perovskite pbti03 ceramic film was successfully prepared on tini substrate

    通過採用原位水熱solgel復合合成法，在tint基體上成功制備了結構較為緻密的pbtio 。
  2. According to the results of ramman and xrd spectrum, the structural and ramman characteristics of 5 1014cm - 2 dy ions implanted cdte films deposited on ceramic substrate have been studied, and the function of the thermal annealing have been discussed

    採用顯微喇曼譜結合xrd ，研究了5 1014cm - 2dy離子注入陶瓷基底上沉積的cdte薄膜的結構和喇曼特性，並討論了離子注入后的退火效應。
  3. Ceramic substrate, cutting, drilling for hybrid ic, glass substrate laser processing

    電子用陶瓷基板玻璃基板雷射加工。
  4. Ceramic substrate cutting, drilling, scribing

    陶瓷基板切割鉆孔畫線2
  5. The result shows that the best comprehensive properties of silver conductor multilayer aln ceramic substrates can been achieved by two - step organic vehicle evacuation technology and cofire the substrate using mixed atmosphere gases of nitride and micro fraction of oxide

    結果表明，二次排膠法與在氮氣氣氛中加入微量氧進行燒結，獲得了綜合性能優良的銀布線多層陶瓷基板。
  6. Ceramic substrate glaze

    陶瓷襯底釉
  7. Product structure : by the ceramic substrate, the back electrode, the resistance body, the surface electrode, glass, two glass, the end electrode, the intermediate electrode, the outer electrode equicomponent constitutes

    產品構造：由陶瓷基片、背電極、電阻體、面電極、一次玻璃、二次玻璃、端電極、中間電極、外部電極等成分構成。
  8. 4, the formation mechanism of the n - sic particles in the ceramic coating prepared by the nano - micrometer n - sic / al2o3 composite powder located within m - al2o3 grains is revealed : m - al2o3 would be well melted during spraying and form droplet, the n - sic particles existing on the surface of droplet, then the particle enter the droplet when it is impacted and flattened on the substrate

    4 、提出了利用納米一微米n - sic al _ 2o _ 3包覆復合粉末所制的陶瓷塗層中n - sic粒子分佈於m - al _ 2o _ 3晶內的機理：在噴塗過程中微米級al _ 2o _ 3完全熔化形成液滴， n - sic粒子存於液滴表面，在液滴撞擊基材平鋪過程中n - sic粒子進入液滴內部形成。
  9. If low residual stress and better residual stress distribution map are expected, a12o3 ceramic substrate is a better choice compared to fr4

    在降溫過程中，剪切應力的絕對值逐漸從一個較高水平逐漸開始減小，並趨于平衡。
  10. Ceramic substrate packaging, which has better heat resistance and withstand higher and lower temperature and compact

    採用陶瓷封裝，和矽晶晶片膨脹系數較接近散熱性能良好，耐高低溫與沖擊
  11. In this paper, the ceramic coatings were prepared in situ on ti - 6al - 4v alloy by micro - plasma oxidation ( mpo ). the phase composition, microstructure and corrosion resistance of the ceramic coatings were studied in detail and the technology of corrosion resistant coatings was optimized. the dissolution of the substrate and the changes of the elements in the electrolyte during the mpo process were studied to discuss the growing characters and the structure of the ceramic coatings

    本文通過微等離子體氧化（ mpo ）方法在ti - 6al - 4v鈦合金表面原位生長陶瓷膜，系統地研究陶瓷膜的相組成、微觀結構及膜層耐腐蝕性能，並優化耐蝕性陶瓷膜層制備工藝;分析基體在mpo過程中的溶解現象和電解液中離子濃度變化特點，探討電極表面陶瓷膜層生長規律和結構特點;研究膜層的等效電路、膜層結構與耐腐蝕性能的關系，並對優化工藝條件下制備的陶瓷膜層進行進一步的耐腐蝕性能測試和耐腐蝕機制研究。
  12. When the substrate is alios ceramic substrate, the shear stress hovers over a relatively high negative level during curing process and steps to a relatively low level during cooling down

    對于陶瓷基板，在固化過程中，剪切應力並不象fr4基板上所表現的那樣，在零點上下波動，而是處於一個絕對值較大的負值。
  13. The ceramic - metal cladding material on the steel substrate is a new type of cladding material which has great development potential because of having functional dominances of both high hardness, excellent wear resistance of ceramics and high strength, toughness, good thermal conductivity of ceramics and high strength, toughness, good thermal conductivity of metal

    制備出的金屬陶瓷-鋼覆層材料同時具有陶瓷材料硬度高、耐磨、耐腐蝕和金屬鋼強度高、韌性好、導熱性好的性能優勢，是一種很有發展潛力的高硬復合材料。
  14. It ' s a method to realize system integration. the hdi substrate is critical to mcm. aluminum nitride ( a1n ) has been considered as a material for ceramic packaging in view of the recent trends in the semiconductor industry toward higher speed, power dissipation and packaging density

    Mcm還能夠實現電子系統的小型化、高密度化，是實現系統集成的重要途徑，在mcm中高密度布線的多層基板技術是實現高密度封裝的關鍵。
  15. Cadmium contained in the cadmium oxide of a thick film ceramic substrate

    厚膜陶瓷基質的氧化鎘中所含的鎘。
  16. In the all candidate materials, glass - ceramic is the most superior material for hard - disk substrate

    在所有的基板材料當中，微晶玻璃是最有希望用作硬盤基板的。
  17. The mixer is fabricated using hmic process based on the thin film ceramic substrate and tested

    該混頻器主要採用微帶混合集成電路，薄膜陶瓷基片製作。
  18. Wafer ceramic substrate application

    晶圓與陶瓷基板應用
  19. The mean residual stress of a ^ os ceramic substrate is lower than the mean residual stress of fr4 with the difference around 40 %. 2

    當採用陶瓷基板時，剪切應力和正應力的平均值均比採用fr4基板時降低40左右。
  20. Ceramic substrate printed board

    導線膠印製板
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