chip assembly 中文意思是什麼

chip assembly 解釋
片子裝配
  • chip : n 1 碎片，削片，薄片；碎屑；薄木片；無價值的東西。2 （陶器等的）缺損（處）。3 （賭博用）籌碼；〈p...
  • assembly : n 1 集合。2 集會。3 會眾。4 〈A 〉立法會議，議院，（特指）下院〈美國州議會通常稱作 General Assemb...
  1. In microelectronics, the process of connecting wires from the leads on the package to the bonding pads on the chip. part of the assembly process

    在微電子中，使用電線將數據包的引線與晶元上的結合區相連接的過程。裝配過程的一部分。
  2. Smic ' s joint ventures, a testing and assembly facility in chengdu with utac and the manufacturing of on - chip color filters and micro lenses in shanghai with toppan, are also in production

    中芯國際和聯合科技在成都合資成立的封裝測試廠以及和凸版印刷在上海成立的合資企業，專注于生產製造芯載濾光片和微鏡頭均已投產。
  3. The assembly process and experimental results are included in this paper. in order to increase the power density of the module, a three - dimensional fc - ipem package structure is introduced. a half - bridge fc - ipem module is built in the lab with bga power devices and flip - chip technique

    為實現更高的功率密度，本文把微電子行業中廣泛應用的倒裝晶元技術應用於模塊電源研究中，完成了一個半橋fc - ipem （ flipchip - integratedpowerelectronicsmodule ）模塊。
  4. At the last we program the parameter detecting methods for frequency - shift track signal with c language and assembly language base on code composer studio of dsp. then we realize it on the dsp chip of tms320f2812. experiments shows that it can satisfy the demand of real time and precision

    最後在dsp的集成開發環境ccs （ codecomposerstudio ）上採用c語言和匯編語言混合編寫移頻軌道信號的參數檢測演算法，並將該演算法移植到dsp晶元（ tms320f2812 ）上實現，測試結果表明上述演算法能夠滿足實時性和精度的要求。
  5. Low assembly cost, suit for automatic thick film chip resistor or capacitor equipment

    2 .可和現有厚膜封裝，片式電阻
  6. We adopt a ping - pong buffer mechanism to guarantee the system ' s real - time implementation. in the hardware design, we use adsp2188n and codec chip msm7702 to accomplish the algorithm and flash memory sst391f080 to store the startup code. assembly language code and some necessary initialization data

    在硬體設計中，本系統以adspzi88n為核心，結合codec晶元msm7702完成編解碼演算法，使用flash晶元sst39lto80來存儲系統的啟動程序、匯編語言程序和初始化表格數據，使用話筒和聽筒來完成語音的輸入輸出。
  7. The function of the assembler is to change assembly language to binary sequence, which makes it easier for the user to program with the chip

    匯編器將晶元的匯編語言轉換為晶元可以執行的二進制代碼，使晶元的應用者不必使用二進制代碼進行開發。
  8. On the aspect of hardware, it refers to the hardware circuit design of the high - speed control card and the analog output card, anti - jamming technology, chip software programming, and hardware upgrade project ; on the aspect of software technology, it relates to the design idea of program frame modularization and using asm96 assembly language to compile system software including main program and communication interrupt service program and controlling output program

    硬體上，內容涵蓋了高速智能控制卡和模擬量輸出介面卡的硬體電路設計、抗干擾技術、晶元控製程序設計和硬體升級方案;軟體上，注重程序結構模塊化，運用asm96宏匯編語言編寫系統程序，包括主程序、通信中斷服務程序、控制輸出程序等。
  9. As an advanced package, 3 - d stacked csp assembly provides significant size and performance advantages than traditional single chip package. meanwhile, high packaging density tends to generate more power in a package and cause serious thermal problem

    三維疊層晶元尺寸封裝（ stackedchipscalepackage ）是目前最先進的微電子封裝形式之一，具有體積小、重量輕、封裝效率高等特點。
  10. The hardware subsystem of this device, with single - chip microcomputer at89c52 as the intelligent kernel, was constructed by the method of modularization ; and its real - time controlling software was designed with embedded assembly language

    該裝置的硬體分系統以單片機at89c52為智能核心，採用模塊化的方式予以構建；而其實時控制軟體則採用嵌入式匯編語言進行設計。
  11. The hardware of the whole control system was designed on the base of mcs - 51 one - chip computer and including data collection, controlling, displaying, inputting, communication, etc. the software of system was developed by the mcs - 51 assembly language and visual c + +

    然後在mcs - 51單片機基礎上，設計了整個控制系統的硬體，包括數據採集、控制、顯示、輸入和通信等部分。
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