die-by-die alignment 中文意思是什麼
die-by-die alignment
解釋
晶片間對準-
In this thesis, the work on automatic alignment system is as follows : firstly, after the methods and optical systems for alignment whose are used commonly now are discussed, a new die leveling method based on auto - focus is presented for the flip chip bonder. auto - focus is completed by estimating from images ; die leveling is completed by focusing for several feature locations
本文針對倒裝貼片機的自動對準系統開展了以下幾方面的工作:首先在討論了現有的對準方法和自動貼片機的對準光路系統基礎上，針對貼片機實際應用環境，提出基於多點自動對焦的晶元調平方法。 -
Today, the most advanced alignment methods have used the technology of machine vision and image proceeding, by which the feature marks on dies or substrate are recognized or measured, by which machine movement equipments are leaded to complete alignment. die leveling and auto - focus usually be completed before vision - based alignment of die and substrate
自動對準系統是自動貼片機中的關鍵組件之一，現階段最先進的對準方法是利用機器視覺和圖像處理技術來識別和測量微細標記特徵，然後反饋給控制系統引導機械裝置進行對準定位，在對準之前還必須對晶元進行「調平」以及實現「對焦」獲得清晰的標記圖像。
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