heat-sink device 中文意思是什麼

heat-sink device 解釋
散熱器件
  • heat : n 1 熱；熱力；熱度；熱量。2 體溫；發燒。3 （氣候的）高溫，暑氣。4 【冶金】熔煉的爐次；裝爐量；一...
  • sink : vi （sank 〈古、美〉 sunk sunk sunken ）1 下沉，沉沒。2 （日、月等）沉入地平線下；低落；下垂；下...
  • device : n. 1. 設計，計劃；方法，手段。2. 〈pl. 〉意志，慾望。3. 謀略，策略，詭計。4. 器具，器械，設備，裝置。5. 圖案，圖樣；花樣；紋章；標記，商標；（紋章上的）題銘。
  1. Heat sink for power semiconductor device part 2 : measuring method of thermal resistance and input fluid - output fluid pressure difference

    電力半導體器件用散熱器第2部分：熱阻和流阻測試方法
  2. Selecting guide of heat sink for power semiconductor device

    電力半導體器件用散熱器選用導則
  3. Heat sink for power semiconductor device part 1 : casting kind series

    電力半導體器件用散熱器第1部分：鑄造類系列
  4. Heat sink for power semiconductor device part 3 : insulators and fasteners

    電力半導體器件用散熱器第3部分：絕緣件和緊固件
  5. This idealized characteristics can be used for analyzing the converter topology but should not be used for the actual design, when, for example, heat sink requirements for the device are being estimated

    這個理想化的特性可以用來分析換流器的拓撲性質但是不能應用於實際設計，例如估計設備所需的散熱器。
  6. Automotive air conditioner accessories : automotive air conditioner cooler, evaporator, heat sink, air conditioner, temperature adjuster, heater, central cooler, air desiccators, cooling fan controller, internal heat exchanger, compressor, motor, air warmer, warm air device, electronic fan for cooling condenser, liquid can, thermal expansion valve, air condition pipeline, switch, clutch, connector, height valve, shunt valve and all kinds of automotive air conditioner production materials ( body aluminum, copper materials, etc ), production equipment, measurement equipment, etc

    車用空調配件：各種車用空調冷凝器、蒸發器、散熱器、空調器、調溫器、加熱器、中冷器、空氣乾燥器、冷卻風扇控制器、內部熱交換器、壓縮機、電動機、暖風機、暖風裝置、各種冷凝器電子扇、貯液灌、熱力膨脹閥；各種車用空調管路、開關、離合器、接頭、高低閥、換向閥及各種車用空調生產材料（車用鋁材、銅材等） 、生產設備、檢測設備等。
  7. Polycrystalline diamond films with preferred orientation by adopting assisted - bias hfcvd technique are prepared, and the mechanisms of the nucleation and growth of the films are studied. in addition, application of the film to the heat sink of power electron device is discussed

    採用輔助偏壓熱絲cvd技術，制備擇優生長的多晶金剛石薄膜，研究了金剛石薄膜的成核及生長機理，並將其應用於功率電子器件的熱沉。
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