mass bonding 中文意思是什麼
mass bonding
解釋
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An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry. it develops for the mass production of ic, mems and moems with small feature sizes and high precise bonding demands. an alignment system is one of the key components in flip chip bonders
全自動倒裝貼片機（ flipchipbonder ）是半導體生產工藝中完成晶元和基底對準、鍵合的高精度自動化設備，適合於特徵尺寸小，鍵合精度要求高的ic （ integratedcircuit ） 、 mems （ microelectromechanicalsystem ） 、 moems （ microopticalelectromechanicalsystems ）等的大規模生產。 -
Influences of axis inclination, length, clamping angle of anchorage, roughness and bonding degree of interface on the displacement of anchorage and repose stability of rock mass were explored
就錨碇體軸線傾角、長度、夾持角、接觸界面粗糙度及結合程度對錨碇位移和巖體安息穩定性的影響作了深入探討。 -
An effective micromachining process is developed to improve the reliability of the metal wire in the multi - sensor and to avoid adhesion between the pyrex glass and silicon mass in the process of anodic bonding
針對晶元上各電阻間金屬引線的可靠性問題和加速度傳感器質量塊吸附問題提出了有效的改進方法。
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