package circuit 中文意思是什麼

package circuit 解釋
封裝電路
  • package : n 1 包裝,包紮。2 〈主美〉包,包裹,捆,束,組;(產品等的)(一)件,件頭。3 包裝用物;(包裝用...
  • circuit : n 1 (某一范圍的)周邊一圈;巡迴,周遊;巡迴路線[區域];迂路。2 巡迴審判(區);巡迴律師會。3 【...
  1. By taking the miniature ceramic rod which is easily to machine high accuracy as sensitive structure, and by printing and polarizing six belt - shaped electrodes above it to constitute three pairs of electrodes, this paper designed package and the phase - sensitive detection circuit in the system so that it effectively reduced the sensitive structure size and improved its processing precision to realize the angular rate gyro microminiaturization

    首先採用易於加工成高精度的微型陶瓷棒作為敏感體,在其上印刷成六個帶狀電極並予以極化構成三副電極對,然後設計了封裝及相敏檢波電路,從而有效地減小了敏感結構的尺寸,提高了其加工精度,實現了角速率陀螺微型化。
  2. High - qualified designers and engineers of chaowei are able to provide various high - qualified design services such as ic software program, circuit board, product appearance, products structure, and product package, etc. the factories directly under chaowei have advanced production abilities including mould making, inection moulding, surface spray - painting, silk - screening, shift - screening, smt, welding and assembling, quartz clock core production, and quality check and assurance. chaowei held many design patents and utility model patents, at the same time, national clock and watch quality certification, national technical supervision bureau certification, usa fcc and astm security authentication, canada ic, and euro ce are achieved, the rich experience in oem and odm can ensure high quality products and professional service

    超維公司擁有一批高素質的專業設計師和工程師,有能力為國內外客戶提供包括ic軟體編程線路板設計產品外觀設計產品結構設計產品包裝設計等多方面高水準的設計服務超維的直屬工廠則擁有模具製造注塑成型表面噴漆絲印移印smt焊接裝配石英鐘機芯製造品質檢驗測試等先進的生產能力超維公司的產品擁有大量的外觀設計專利和實用新型專利,同時獲得了國家鐘表質量檢驗中心的合格證書國家技術監督局檢驗合格證書美國fcc認證和astm安全認證加拿大ic認證歐盟ce認證。
  3. In the current production of integrate circuit ( ic ), we usually package the chip with chemical material to protect chips

    在當前的集成電路生產中,為了保護晶元,通常要用化學材料對晶元加以封裝。
  4. The second part introduces concepts and knowledge of the integrate circuit ( ic ) design and package. the third part introduces the realization of the routing algorithm and the

    ( 2 )包括第二、三章,介紹了集成電路設計和封裝的概念和知識。
  5. First we measured s - parameter of the device and package shell. the package shell and bonding wire are expressed with equipment circuit composed of the resistance, capacitance and inductance then acquired the value of component by optimizing using microwave emulation software ( microwave office )

    首先,測量出管殼封裝器件和管殼的s參數,把管殼和鍵合線均表示為由電容、電感、電阻組成的等效電路,再用微波模擬軟體( microwaveoffice )優化出元件數值。
  6. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中,往往會產生熱殘余應力以及焊接殘余應力,殘余應力的釋放作用及器件在使用過程中的熱變形,會降低集成電路晶元與封裝體的結合強度,進而降低集成電路的電性能,反復的熱循環,將導致器件的熱疲勞失效,嚴重時可導致矽片或陶瓷片破裂,使整個器件遭到破壞。
  7. The accelerometer which has simple fabricated process and high sensitivity and small parasitic capacitance and residual stress is hybrid integrated with the interface circuit using ic nude chip. so the density of the package is increased, and the noise of the sensing system is decreased. these found the base of capacitive accelerometer module using the mcm method

    該傳感器製作工藝簡單,靈敏度高,支撐梁採用u型,減小了刻蝕后的殘余應力,用玻璃作為襯底,減小了襯底和硅可動質量塊間的寄生電容,且把傳感器晶元和用ic裸片製作的介面電路集成在一起,提高了封裝密度,減小了傳感器系統的噪聲,為採用mcm技術製作電容式加速度傳感器模塊打下了基礎。
  8. Socket function mainly realizes setting up and initializing service unit socket, initializing service unit and service unit serial and so on. bind funcion primarily binds local address and port for the socket. listen function is to evaluate the max length of server ’ s listening queue. connect function and accept function set aside rate ahead, infrom user ’ s request of establishing virtual circuit to suna, cooperate with suna to establish the connection between client and server, return the result. we make use of three handshake with data protocol and virtual circuit mode, in this way, when we translate data, we can look up communication course according to virtual circuit number, at the same time, there aren ’ t source ip address and port, end ip address and port in the head of data package, the speed of translating data advances in a certain extent. send function and recv function is to send data collaborating with suna, and copy data from the receiving queue of socket to user ’ s buffer. close function cooperate

    Socket ( )函數實現創建、初始化服務元套接字,初始化服務元及服務元序列等。 bind ( )函數為套接字綁定本地地址和埠號。 connect ( )和accept ( )函數主要是根據用戶要求預留帶寬,將用戶的建立虛電路請求轉達給服務元網路體系,協作服務元網路體系採用捎帶數據的三次握手協議建立虛電路,並告訴用戶處理結果,一方面,捎帶數據的三次握手協議在一定程度上可提高數據傳輸速度;另一方面,採用虛電路方式,使得數據通信可直接根據虛電路號查找相應的通信進程,而且數據包的包頭中省去了源ip地址、埠號和目的ip地址、埠號,提高了數據傳輸速率。
  9. At last, we gave the circuit connection method of web browse function and ethernet / rs232 gateway function and the detailed resolvent to improve the results of theory research. the result indicates that it is feasible to access internet with the method of micro controlling unit and virtual software package. this method will provide a new kind of resolvent to appliance accessing intemet, long - distance controlling and long - distance data collection

    最後給出了實現網頁瀏覽功能和ethernet rs232網橋功能的實驗線路連接方法及具體實驗方案,來證明理論研究的結論。實驗結果表明採用8位微控制器與虛擬軟體包相結合的方式接入internet是完全可行的,這將為家電上網,遠程控制,遠程數據採集等提供一種新的解決方案。
  10. The developments of high - speed circuits and mmic pose the problem of analyzing the circuits characterized both in time and frequency domains. a variety of mixed time - frequency methods have been developed during the last quarter century in the research of the vlsi interconnect and package analysis and nonlinear steady - state analysis. this paper examines these methods from a unified point of view. various mixed problems are formulated as circuit equations in the mixed time - frequency domain. fundamental approaches to slove the equations are given, from which all of the published mixed methods can be naturally deduced. this facilitates the comprehension of these methods and is helpful for their applications. some new ideas are proposed based on the cross reference among these different kinds of methods

    隨著高速集成電路及mmic (微波單片集成電路)的發展,提出了對時-頻混合表示電路進行分析的任務.本文用統一的觀點考察了通常屬于高速電路互連與封裝分析、非線性電路穩態響應分析兩個不同方面的混合分析問題,指出這類問題的實質是要求解一個時-頻混合的電路方程,給出了求解這一方程的基本思路,闡明了現有的各種方法是如何從這一基本思路導出的.這可為認識這些方法的本質與聯系,促進它們的應用與發展提供參考.此文還探討了某些方法之間的相互借鑒,提出了若干新的想法
  11. The element of the pe, ceramic package and glass package circuit are mostly introduced, and the infection of saltfog test for them in theory is analysed

    摘要主要講述了塑封電路、陶封電路和玻璃封裝電路的成分,並對鹽霧試驗對它們的影響進行了理論分析。
  12. Struggled through 3 years, we had made a 480 - channels marine multi - component seismic exploration system. include new circuit design of digital package, omnidirectional 3 component geophone, ocean bottom towed cable, marine four component seismic acquisition unit, hydrophone, recording system etc. in july 2001, this system was used in dagang field and worked over twenty km. we obtained a good seismic data

    目前已完成了一套480道海底電纜採集系統,包括數字包的創新電路設計,三分量檢波器的萬向平衡裝置,海底電纜鎧裝結構,可拖曳的四分量採集一體化單元,水聽器,系統主機等,並於2001年7月和2002年5月兩次在大港油田渤海灣海域進行了現場實驗,獲得了良好的地震資料。
  13. However, both the package switched network and the traditional circuit switched network will exist for a long time due to the cost and some technical problems

    但是,由於技術和成本問題,傳統電路交換網路與分組交換網路還將會在很長時間內並存。
  14. Sensor window cotton improved image quality, access dry wet fingers. automated exposure and intelligent compensation improved image quality accept odm or oem, providing system analysis, casing - making, circuit design, producing - assembly, package design, etc, linear service

    U . are . u指紋儀在新版中標配,全面提升指紋識別質量支持射頻卡等卡類設備輸入和輸出,可配置id卡mifare卡多種方式考勤
  15. Emc / emi simulation of special microwave connection and package structure in mcm - l is taken to sum up some effective emi methods to guide layout design. 3. the system characteristics and link index are analyzed to point out key modules in circuit realization

    設計了微波疊層結構,並對疊層結構中出現的互耦、互連、不連續性及封裝結構進行電磁模擬,提出抑制電磁干擾的措施。
  16. This paper explains the bluetooth technology in detail, and designs the circuit and arithmetic of package composing, data error detection and correction, data whitening, receive / transmit routines, traffic control, receive / transmit timing, channel control and hop selection

    為了驗證本系統的性能,本論文應用模擬工具對穩定通信條件下的系統和一般直擴通信系統作出模擬,經過對誤碼性能的對比,得出本系統優於一般直擴系統,具有良好的性能。
  17. Ngn has achieved not only the fusion of the network, but, more importantly, fusion of the services through the optimization of the network structure. it enables the package switch network to inherit the abundant service functions which the original circuit switch network has, and quickly provide some new services which can hardly provided by the original network within the whole network at the same time

    下一代網路通過優化網路結構不但實現了網路的融合,更重要的是實現了業務的融合,使得分組交換網路能夠繼承原有電路交換網中豐富的業務功能,同時可以在全網范圍內快速提供原有網路難以提供的新型業務。
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