package reliability 中文意思是什麼

package reliability 解釋
包裝可靠性
  • package : n 1 包裝，包紮。2 〈主美〉包，包裹，捆，束，組；（產品等的）（一）件，件頭。3 包裝用物；（包裝用...
  • reliability : n. 可靠性，安全性，確實（性）。
  1. Two new methods have been put forward to estimate the reliability characteristic parameter. a software package has been developed to process the data obtained from reliability testing for electric apparatus. it consists of both the determination of failure distribution and the estimation of reliability characteristic parameter

    最後，設計出電器可靠性試驗數據處理軟體包，此軟體包含了產品失效分佈類型的確定和可靠性試驗結果為大子樣、小子樣、無失效數據時可靠性特徵量的估計方法，以及恆定應力加速壽命試驗數據下的可靠性特徵量的估計方法。
  2. The results of fe simulation shows that the mental package made abroad has lower thermal stress and higher reliability during working and manufacturing process than that made in china. it is mainly because that the two packaging structures were manufactured in different forming processes : one was punched and the other was brazed

    有限元計算的結果表明，採用沖壓一次成型的國外封裝外殼比採用異材壓焊的國產封裝外殼的工作熱應力和製造殘余熱應力要小很多，具有更高的可靠性。
  3. Then, the half - empirical paris equation, which can be used as a design base of flip chip package reliability, have been determined from the crack propagation rates da / dn measured and the energy release rates g simulated

    然後由實驗測得界面裂縫擴展速率和有限元模擬給出的能量釋放率，擬合得到可作為倒裝焊封裝可靠性設計依據的paris半經驗方程。
  4. The reliability of flip chip package was studied in this work by both experimental measurements and finite element simulations

    本文針對倒裝焊封裝可靠性問題進行了實驗和數值模擬兩方面的研究。
  5. In the second part, the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials, die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components. in the last chapter, the design tool for advanced electronic package was studied. the main conclusions in the second part are as follows

    論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊晶元可靠性研究以及大功率器件散熱問題研究三方面內容，最後為實現封裝設計標準化和自動化，研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。
  6. It is proved that thermal fatigue is the main cause of the invalidity of the package. therefore, it is significant to research the reliability of solder ball under the thermal cycle

    實踐證明熱作用是晶元封裝組件失效破壞的主導因素，因此熱循環條件下的焊點可靠性研究有著非常重要的意義。
  7. On the basis of algorithms study, a software package named " photovoltaic system reliability analysis planning " is developed, which can be used for further research

    在理論研究的基礎上，本文開發完成了「光伏發電系統可靠性分析軟體」 ，可做進一步研究之用。
  8. Abstract : package delaminations are often associated with electrical and package reliability problems in ic device

    摘要：在塑封ic器件中，封裝分層往往會產生電和封裝的可靠性問題。
  9. " our global small package business is vibrant and growing, " said scott davis, ups s chief financial officer. " this strong growth is being fueled by our integrated customer technologies, expanded supply chain capabilities and superior service and reliability.

    由於我公司整合了各項客戶技術，擴大了供應鏈的服務能力，並提高了服務質量和可靠性，這一切都成為促進業務強勁增長的動力。 」
  10. Ipv6 is the next ip protocol, which have authentication header ( ah ) and encrypted security payload ( esp ). ah can affirm the ip information package ' s reliability and integrality and esp can encrypt and encapsulate the data

    Ipv6是下一代的ip協議，其中的認證報頭（ ah ）可用來確認ip信息包的可靠性和完整性，加密的安全有效負載報頭（ esp ）可同來提供數據的加密封裝。
  11. First, the paper discusses briefly the ic package technology, the reliability analysis methodologies and the current situation of the ic package

    本文首先對晶元封裝及其可靠性分析方法及現狀進行了概述，並對相關理論方法作了介紹。
  12. Therefore, it is necessary to establish and develop a set of convenient and efficient method to test and calculate thermal stresses and deformation in the study of package design and reliability analysis

    因此，建立和發展一套簡便有效的熱應力和變形估算方法，是封裝設計和可靠性研究中必不可少的工作。
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