plasma processing 中文意思是什麼

plasma processing 解釋
等離子體加工
  • plasma : n. 1. 【生理】血漿；淋巴液。2. 【生物學】原生質。3. （做藥膏用的）膏漿。4. 【礦物】半透明的綠玉髓。5. 【物理學】等離子（體）；等離子區。
  1. Microwave electron cyclotron resonance ( mwecr ) cvd is a newly developed technique for plasma processing and materials fabrication, such as plasma etching and films deposition

    本論文介紹了我們對ecr等離子體cvd系統的測試、 bn薄膜的制備和薄膜光學特性研究。
  2. According to the characteristic of cnc plasma cutting machine it could improve the process quality of cutting piece in effect for choosing proper technics, for example, cutting section point, aspect, sequence, speed etal during the period of processing, and elaborating towards the distortion control of single side piece, slightness piece, profiled piece and particularity piece at the same time

    根據數控等離子切割機的特點，在加工過程中正確選擇切割的起點、切割方向、切割順序、切割速度等工藝，可以有效提高切割件的加工質量，同時對單邊工件、細長件、異型件以及特殊件的變形控制進行了詳細地闡述。
  3. Pulse electric current heat treatment ( pecht ) developed by sodick, ltd., of japan, is a recently developed material processing method which consists of spark plasma sintering and welding, plasma activated sintering and welding, big pulse electric current ( bpec ) diffusion welding etc. the following are basic merits of pecht : rapid heating and cooling ; short sintering or welding time ; lowering sintering or welding temperature

    脈沖電流熱加工（ pulseelectriccurrentheattreatment ，比如燒結，焊接等）是九十年代發展起來的一種材料快速制備新技術，它包括放電等離子燒結與焊接、等離子活化燒結與焊接、脈沖大電流擴散焊接等。它具有升溫、降溫速度快、能在較低的溫度下燒結或焊接以及時間短的特點。
  4. Influence of in - situ oxygen plasma processing on the resistivity of diamond thin film

    原位氧等離子體處理對金剛石薄膜電阻率的影響
  5. The results show that amorphous carbon films have high etching resistance against oxygen plasma, and etch rates of the films correlated not only with etching processing parameters, also with deposition conditions

    結果表明非晶碳膜對于氧離子體具有高的抗刻蝕性，其刻蝕率不僅與刻蝕的過程參量有關，而且決定於膜的沉積條件。
  6. The proper temperature is felt about from the substrate of p ( 100 ) cz - si, and it is found that the solar cell conversion efficiency has been improved from 8. 85 % to 11. 45 % for the annealing process. suitable processing conditions for cells " fabrication, hydrogen passivation, sinx anti - reflection coating deposited by plasma enhanced chemical deposition ( pecvd ) are also studied

    將太陽電池樣品分別用pecvd （ plasmaenhancedchemicalvapordeposition ）做減反射膜，用fg （ forminggas ）燒結，測試電池性能，發現用pecvd處理后電池效率有所提高，用fg燒結后同樣有所改善。
  7. Zno is a ii - vi wide bandgap semiconductor which is used for various applications such as gas sensors, bulk - acoustic - wave devices, surface - acoustic - wave devices, varistors, light emitting, light detecting devices and so on. undoped and al doped zno thin films have also been widely used in transparent conducting layers because of their higher thermal stability and good resistance against hydrogen plasma processing damage compared with ito ( sn - doped in2o3 ) films

    Zno是一種新型的直接帶隙寬禁帶半導體材料，具有六方纖鋅礦結構，較高的激子束縛能（ 60mev ） ，較低的電子誘生缺陷和閾值電壓低等優點，在uv探測器、藍紫光led和ld等光電子器件領域有巨大的應用潛景。
  8. Spark plasma sintering ( sps ) is a kind of new sintering technology for materials synthesis and processing, it has such advantages as high sintering speed, low sintering temperature, it also can retain the origin state of the sintered materials, as such make the sintered materials keep the state of un - equilibrium in this paper, sps was conceived of treating iron covered silicon powder to keeping the origin state of the powder

    放電等離子燒結（ sparkplasmasintering簡稱sps ）是一種材料快速制備新技術，它具有燒結速度快，燒結溫度低，使燒結材料處于遠離平衡狀態，並能保持材料的原有狀態等重要特點。本文設想制各出鐵硅包覆粉末，再利用sps進行遠離平衡狀態的處理，來獲得保持原始粉末自然狀態的合金塊體。
  9. In a word, the two type of voa both have valuable applicability and potential market. the author have done numerous processing to work out new processing such as polymer coating and cure and triple - layer - metal film vaporing. other new processing, polymer ultra - violet ( uv ) cure and inductively - coupled plasma ( icp ) etching were studied

    作者經過反復的工藝實驗，確定了聚合物波導塗膜和固化、三層金屬電極蒸發和腐蝕等新工藝的參數，並得到了聚合物紫外固化、等離子體刻蝕等新工藝的初步數據。
  10. The interactions between dust particles and plasmas have attracted much attention in the recent years since dust contamination is recognized as a serious problem in plasma processing of integrated circuits

    近年來，特別是在人們認識到塵埃粒子是影響半導體集成電路加工質量的關鍵問題后，塵埃粒子與等離子體的相互作用備受關注。
  11. The content of this dissertation is about the modification of coatings by laser cladding nano - material on plasma - spraying coatings. introducing rapid prototyping into nano material processing, experimental researches on the selective sintering of nano material are carried out systematically, the main work accomplished and conclusions gotten in this dissertation are presented as follows : 1 under the aiding of plasma spraying, reasonable coating material systems are designed to fabricate alumina, nicral / a12o3, nicral / a12o3 + 13 % wt. tio2, nicral / wc - co coating

    本文主要是在等離子噴塗的基礎上，利用激光熔覆納米陶瓷材料對等離子塗層進行改性處理，從而制備納米復合塗層；同時將激光快速成型應用於納米材料加工中，主要完成如下內容： （ 1 ）設計合理的等離子塗層結構，制備了al _ 2o _ 3 ， nicral al _ 2o _ 3 ， nicral al _ 2o _ 3 13 wttio _ 2 ， nicral wc - co四種塗層。
  12. A superalloy double helix integrated impeller with good performances of dimensional precision, microstructure and mechanics was rapidly manufactured by hpdm ( hybrid plasma deposition & milling ) method proposed by author ' s, laboratory, which synthesized plasma deposition as an additive technology, and milling as a subtractive technique during the processing

    摘要採用等離子熔積與銑削復合製造技術，在等離子熔積成形過程中復合銑削精整，試制了難加工高溫合金雙螺旋整體葉輪樣件，其組織性能和力學性能均高於採用傳統工藝加工獲得的葉輪。
  13. Plasma arc processing

    等離子弧加工
  14. To approach as a resist in dry etching processing, etching properties of the films in oxygen plasma have been investigated

    為了探索該種薄膜在干刻蝕工藝過程中用作掩膜的可能性，還研究了它在氧離子體中的刻蝕性能。
  15. Charged dust particles exist widely in space, laboratory as well as plasma processing

    帶電的塵埃粒子廣泛存在於宇宙空間、實驗室的等離子體裝置中和材料的等離子體加工等環境中。
  16. Due to the use of microwaves the plasma systems 400 and 660 provide for fast and damage - free plasma processing

    由於微波技術的應用，等離子體400和660系列可提供快速與無損害的等離子處理。
  17. The highly active microwave plasma is able to remove hardened resist and guarantees for highest ash rates and damage - free processing

    這個高活性的微波等離子能處理高強度的抵抗灰燼並保證最高的灰燼處理效率，處理過程中對產品沒有任何損害。
  18. Gather around and use up the good professional production line of elastic component, high - accuracy processing apparatus, advanced plasma solder technology, complete test measure technology and equipment

    擁用完善的彈性元件專業生產線，高精度的加工設備，先進的等離子焊接技術、完善的檢驗檢測技術及設備。
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