semiconductor assembly 中文意思是什麼

semiconductor assembly 解釋
半導體封裝
  • semiconductor : n. 【物理學】半導體。
  • assembly : n 1 集合。2 集會。3 會眾。4 〈A 〉立法會議，議院，（特指）下院〈美國州議會通常稱作 General Assemb...
  1. As silicon is the most important semiconductor material in micro - electronic field, one - dimensional nano - structures of silicon play an important role in the fields of device assembly, nanometer - size magnetic device, photoelectronics, and have drawn wide interest in the world

    摘要作為微電子領域最重要的半導體材料，硅的一維納米結構在器件組裝、納米尺寸磁性器件、光電子等領域具有重要的作用，已經成為國際上材料科學研究的一個熱點。
  2. Universal instruments is a global electronics productivity specialist, providing innovative circuit, semiconductor, and back - end assembly technologies and equipment, integrated system solutions, and process expertise to manufacturers in every sector of the global electronics industry

    環球儀器公司是一家全球性的電子產品生產設備專業製造商，為全球電子行業各領域的製造廠商提供富有創新性的電路、半導體、後端組裝技術和設備、集成系統解決方案及專項工藝技術。
  3. Semiconductor photoelectric assembly detail specification for miniature duplex photoelectric localizer for type cbgs 2301

    半導體光電組件. cbgs2301微型雙向光電定位器.詳細規范
  4. In the past 21 years dalian office finished more than 120 projects all over north - east in the field of microelectronic, optical fiber and cable, lcd, biological and pharmaceutical, mechanic, assembly, steel, ship manufacturing and domestic buildings. some of the projects got the prize from national or provincial construction department. below are the reference projects dalian office finished these years : dalian dongfu lcd co., ltd, dalian haire industry park, guangyang bearings dalian co., ltd, konica dalian co., ltd, canon dalian office appliance co., ltd, pacifica electronics co., ltd, photoelectron dalian co., ltd, hyundai electronics dalian, rhi dalian co., ltd, yuanda pharmaceutical co., ltd, siemens vdo auto electronics changchun, toyota tianjin precise products co., ltd 6000, toyota zhangjiagang technology co., ltd, shenyang sico semiconductor co., ltd, dalian dongxian and dalian orient precise products co., ltd. dalian office will carry the principle make best design, provide satisfying service to provide our best service to the clients

    Edri大連分院成立至今完成120多項工程設計監理及工程總承包項目，其中多個項目工程設計獲得國家和部省級科技進步獎，先後完成了大連東福彩色液晶顯示器工程大連海爾工業園光洋軸承大連有限公司柯尼卡大連有限公司佳能辦公設備大連有限公司太平洋電子有限公司光電子大連有限公司現代電子大連有限公司奧鎂大連有限公司，大連高新生物制藥有限公司大連保稅區國際車城遠大制藥有限公司西門子威迪歐汽車電子長春有限公司豐田合成天津精密製品有限公司豐田合成張家港科技有限公司，沈陽科希-硅技半導體技術第一有限公司大連東顯電子有限公司大連東方精工有限公司等一大批高科技產業園區設計項目，並且進行全程質量跟蹤服務，在業內樹立起edri大連分院良好口碑，贏得了客戶廣泛好評，為我院在東北地區的發展做出了自己的貢獻。
  5. Based on the historical space forecast data and corresponding actual data provided by a global semiconductor assembly and test company, the uncertainty of space planning was defined. during this analysis process, linear regression, grey prediction, neural network back propagation algorithm and confidence interval were applied, respectively, to define the uncertainty. compared with those methods, the confidence interval of historical space forecast error, calculated by mathematical statistics, was the reasonable method to define the space forecasting uncertainty

    本文從半導體工廠長期生產能力計劃的頂層即廠房生產面積的計劃展開，對一跨國半導體封裝測試公司提供的廠房生產面積的長期歷史預測數據以及對應的真實數據進行分析，採用線性回歸，灰預測，神經網路bp演算法，基於數理統計的置信區間的求解等方法分別定義廠房生產面積預測的不確定度，經多種方法的比較得出，基於數理統計方法求解出的生產面積歷史預測誤差置信區間能直觀清楚地標定不確定度。
  6. Unlike oil pumps for traditional industries, our dry pumps are specified for the use of semiconductor companies. the rotor of vacuum space is not sealed with oil, but with the application of the minute clearance and high - speed rotation. therefore, a special demand is laid on the precision manufacture techniques, assembly procedures and profile design of roots rotor

    以乾式真空幫浦為例，在2001年2月第一臺賣出去以來，已賣出數百臺，本乾式真空幫浦等級屬於半導體廠專用乾式真空幫浦，不同於傳統產業使用的油式真空幫浦，旋轉轉子真空腔體內不用油去密封，而是用微小的間隙配合高速旋轉的轉子進行密封，因此特別講究精密加工技術精密組裝技術魯氏轉子線型設計。
  7. Currently, the technique of semiconductor laser arrays and stacks assembly is not mature in china. there are no assembling equipment for semiconductor laser arrays and stacks in the world, and all institutions manufacturing semiconductor laser arrays and stacks kept usage of solder as secret. consequently, assembling technique, solder and assembling equipment have been deemed as focal points of my studies

    目前國內對半導體激光器列陣及疊陣的組裝技術還不成熟，國內外還沒有用於半導體激光器列陣及疊陣的組裝設備，各個研製半導體激光器列陣及疊陣的機構對焊料的使用還互相保密，因此本人對半導體激光器的結構、組裝技術、焊料、組裝設備進行了如下研究：對無鋁半導體激光器的結構進行了設計，在理論上對半導體激光器列陣及疊陣進行了研究。
  8. General specification for cascade speed control assembly with semiconductor converter

    半導體變流串級調速裝置總技術條件
  9. Amkor technology ' s mission is to be the world ' s premier semiconductor assembly and test services company through customer satisfaction, leading edge technology and financial performance

    安靠的使命是通過客戶的滿意度、先進的技術和財務表現成為世界領先的半導體封裝測試企業。
  10. Manufactures materials and components for pcb manufacturing and assembly, semiconductor manufacturing and electronics products

    -提供電子產品展覽會信息，采購與供應廠商信息庫，產品網上展覽。
  11. Semiconductor discrete device. detail specification for gaas high - speed switching assembly for type ek20

    半導體分立器件. ek20型砷化鎵高速開關組件詳細規范
  12. We are dedicated to becoming the top - rated supplier at each of our customers in the electronics value chain - from semiconductor fabrication, to device packaging and complete module and system assembly

    從半導體製造、元器件封裝到電子模塊的裝配與保護，道康寧提供的創新性解決方案可應用於電子產業價值鏈的各個環節。
  13. Assembly and characterization of semiconductor and mcm - 41 mesoporous material

    41和半導體的組裝與表徵
  14. General specification for semiconductor opto - electronic assembly

    半導體光電組件總規范
  15. The study of wip control system in semiconductor assembly and test factory

    半導體封裝測試廠庫存控制系統的研究
  16. Wire bond parameter optimization in semiconductor assembly

    半導體封裝超聲波壓焊的工藝參數優化
  17. Capacity planning in semiconductor assembly and test manufacturing system

    半導體封裝測試系統的生產能力規劃
  18. A kind of particle swarm optimization method with the characteristic of logical time - sequenced is proposed and applied to procedure parameters optimization of semiconductor assembly product line

    摘要提出一種具有邏輯時序特徵的微粒群優化演算法，並將其應用於半導體封裝生產線的工序參數優化中。
  19. Assembly process and product reliability assurance system in samsung suzhou semiconductor

    蘇州三星半導體封裝工藝及產品可靠性保障體系
  20. Found in 2007, taiwan surplus equipment company - tsec is the dedicated supplier of surplus semiconductor equipments include front - end, ate and assembly field

    驊菱企業有限公司於2007年成立，做為專業的半導體二手設備供應商，包括前段，測試及封裝領域等設備。
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