wafer warpage 中文意思是什麼
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During the fabrication or service, if the applied tensile stresses exceed the probabilistic tensile strength of silicon, then failure will occur. even a tiny crack will bring tremendous damage to devices and circuits. especially nowadays, with the increasing of silicon wafer diameter, warpage in heat treatment, defects and dislocations generated in silicon often become critical problems in ulsi devices fabrication
特別在大規模集成電路與器件生產中，一個微小的裂紋就可能導致后道工序中電路與器件的完全損壞；而且在熱處理過程引起的翹曲，使光刻精度下降；在矽片內部產生的氧沉澱及位錯等缺陷，會導致集成電路或器件的漏電流增加，使器件失效。
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